• 한국건축시공학회:학술대회논문집
• /
• 한국건축시공학회 2023년도 가을학술발표대회논문집
• /
• pp.37-38
• /
• 2023

The purpose of this study is to manufacture mortars incorporating oyster shells and install them in the form of shaped, shaped butt joints, and flat boards to see what difference there is in the back temperature depending on the joint method and the type of installation. Based on the fact that similar backside temperatures were measured regardless of the presence or absence of a joint It is judged that the joint will not affect the backside temperature if it is constructed closely, In the case of ㄱ shaped, it is believed that the backside temperature higher than the backside temperature of the flat board was measured because heat accumulates on the backside during heating.

• 마이크로전자및패키징학회지
• /
• 제27권1호
• /
• pp.1-7
• /
• 2020

The backside metallization process is typically used to attach a chip to a lead frame for semiconductor packaging because it has excellent bond-line and good electrical and thermal conduction. In particular, the backside metal with the Ag/Sn/Ag sandwich structure has a low-temperature bonding process and high remelting temperature because the interfacial structure composed of intermetallic compounds with higher melting temperatures than pure metal layers after die attach process. Here, we introduce a die attach process with the Ag/Sn/Ag sandwich structure to apply commercial semiconductor packages. After the die attachment, we investigated the evolution of the interfacial structures and evaluated the shear strength of the Ag/Sn/Ag sandwich structure and compared to those of a commercial backside metal (Au-12Ge).

• 한국정밀공학회지
• /
• 제20권1호
• /
• pp.85-90
• /
• 2003

Removal rate and Within Wafer Non-Uniformity (WIWNU), the most critical issues in Chemical Mechanical Polish (CMP) process, are related to the pressure distribution, wafer shape, slurry flow, mechanical property of pad and etc. Among them, wafer warp generated by other various manufacturing process of wafer may induce the deviation of pressure distribution on the backside of wafer. In the convex shaped wafer the pressure onto the backside of wafer is higher than that of perfectly flat shaped wafer. Besides, such an added pressure is in proportion to the curvature of wafer. That is, the bigger the curvature of wafer becomes the higher the removal rate goes. And the WIWNU is known to be directly related to the pressure distribution on the wafer as well. In other words, the deviation of pressure distribution is in proportion to the WIWNU. In this paper, it is found that the wafer shape may be modified through heating the backside of it and thus properly changed pressure onto the backside of it may improve the WIWNU.

• 대한전기학회:학술대회논문집
• /
• 대한전기학회 2011년도 제42회 하계학술대회
• /
• pp.1302-1303
• /
• 2011

Building-Integrated Photovoltaic System(BIPV) has a muti-functional to generate electrical power and be able to be exterior materials for building. When PV modules are applied as envelope materials for building, the PV modules are considered on characteristics of the thermal effect and performance of PV module to optimize BIPV system synthetically. The purpose of this study is analysis of the changes of temperature and performance on PV modules. after installing four PV modules that have different ventilation type of PV module backside. Measurement results on this experiment is that the ventilation of PV module backside can control elevated module temperature and improve the performance of PV module. So, the technology development on the ventilation of PV module is suggested introducing effective BIPV system.

• 한국화재소방학회논문지
• /
• 제33권1호
• /
• pp.60-68
• /
• 2019

본 논문은 실내 공간구획에 사용되는 경량칸막이 복합벽체의 가열온도에 따른 이면부로의 전도 열전달 특성에 관한 연구이다. 경량칸막이 벽체로 일반적으로 사용되고 있는 복합재료로 구성된 스터드 칸막이, SGP 칸막이, 샌드위치 패널, 우레탄폼 패널, 그라스울 패널을 실험시료로 선정하고, $200^{\circ}C$, $300^{\circ}C$, $400^{\circ}C$, $500^{\circ}C$의 가열온도를 하단부 표면에 1800 s 동안 인가하여 상단부 표면인 이면부로의 전도 열전달 특성을 분석하였다. 실험결과 가열온도가 최대 $500^{\circ}C$로 인가됨에 따라 최대 이면온도는 스터드 칸막이 $51.6^{\circ}C$, SGP 칸막이 $63.6^{\circ}C$, 샌드위치 패널 $317.2^{\circ}C$, 우레탄폼 패널 $124.9^{\circ}C$, 그라스울 패널 $42.2^{\circ}C$로 측정되었다. $500^{\circ}C$에서의 최대 전도 열전달율은 스터드 칸막이 17.16 W, SGP 칸막이 18.39 W, 샌드위치 패널 136.65 W, 우레탄폼 패널 14.34 W, 그라스울 패널 5.57 W로 측정되었다.

• 한국태양에너지학회 논문집
• /
• 제26권1호
• /
• pp.81-89
• /
• 2006

Building integrated photovoltaic (BIPV) system operates as a multi-functional building construction material. They not only produce electricity, but also are building integral components such as facade, roof, window and shading device. On the other hands lots of architectural considerations should be reflected such as Installation position, shading, temperature effect and so on. As PV modules function like building envelope in BIPV, combined thermal and PV performance should be simultaneously evaluated This study is on the combined thermal and PV performance evaluation of BIPV modules. The purpose of this study is to investigate a temperature effect of PV module depending on the ventilation type of PV module backside. Test cell experiment was performed to identify the thermal and power effect of PV modules. Measurement results on the correlation of temperature and power generation were obtained. Those results can be utilized for the development of optimal BIPV installation details in the very early design stage.

• 한국화재소방학회논문지
• /
• 제34권2호
• /
• pp.14-21
• /
• 2020

본 논문은 ISO 9705 2/5축소모델 2개를 실내 공간구획에 사용되는 경량칸막이를 이용하여 구획 한 후 ISO 9705 시험을 재현하여 이면부로의 화재위험성에 관한 연구이다. 실험 시료는 시공 시 가장 많이 사용되고 있는 SGP 칸막이, 스터드 칸막이, 그라스울 패널, 우레탄폼 패널, 샌드위치 패널, 유리 칸막이를 선정 하였고, ISO 9705시험 기준에 따라 버너에 점화 전 측정 장치와 데이터의 기록을 시작하여 120 s간 유지시켜 안정화를 취하고, 점화 후 600 s 동안 100 kW, 이후 600 s 동안 300 kW까지 증가하였다가 종료 후 180 s동안 관찰하여 이면부로의 화재 위험성 및 벽체의 화재 패턴을 분석하였다. 점화원에서 발생된 열량으로 인한 최대 이면온도는 SGP 칸막이 67.7 ℃, 스터드 칸막이 55.1 ℃, 그라스울 패널 52.4 ℃, 샌드위치 패널 727.4 ℃, 우레탄폼 패널 561 ℃, 유리 칸막이 630.5 ℃로 측정되었다. 샌드위치 패널과 우레탄폼 패널의 경우 내장재에 용융으로 인한 가연성 가스의 폭발 현상이 발생하였고 강화유리는 수열부와 비수열부의 온도차이로 인하여 유리가 파열되며 인접구획실로의 화재 위험성이 높은 것으로 판단된다.

• 대한전기학회:학술대회논문집
• /
• 대한전기학회 2011년도 제42회 하계학술대회
• /
• pp.1300-1301
• /
• 2011

The purpose of this study is to analyze the electrical performance characteristics of semi-transparent BIPV modules. This study dealt with four different types of semi-transparent PV modules depending on the backside glass material, such as clear glass, bronze glass, reflecting glass and low-e glass. The monitoring data shows that the PV module temperature and solar radiation were closely related to the electrical performance of the modules.

• 대한전기학회:학술대회논문집
• /
• 대한전기학회 2000년도 하계학술대회 논문집 C
• /
• pp.1510-1512
• /
• 2000

Due to the shrinking of the chip size and increasing of the complexity in the modern electronic devices. the defect of wafer are so important to decide the yield in the device process. The engineers has studied the wafer defects and the characteristics. They published lots of the experimental methods. I did an experiment the gettering effect of the defects due to the high temperature and the long time diffusion. Actually, As the thickness of the wafer backside polysilicon is thicker and the diffusion time is faster. the defects on the wafer are decreased. The polysilicon gram boundaries of the wafer backside played an important part as the defect gettering site.

• 한국태양에너지학회:학술대회논문집
• /
• 한국태양에너지학회 2011년도 추계학술발표대회 논문집
• /
• pp.364-369
• /
• 2011

Recently, the cases of BIPV(Building-integrated Photovoltaic) have been increased with interest in renewable energy application for buildings. PV System in building can perform a variety of roles as an energy supplier, exterior materials, aesthetic element and etc. To apply PV modules in buildings, various factors should be considered, such as the installation angle and orientation of PV module, shading, and temperature. The temperature of PV modules that are attached to building surfaces especially is one of the most important factors, as it affects both the electrical efficiency of a PV module and the energy load in a building. BIPV modules designed as finished material for spandrels are presented in this paper. The purpose of this study is to analysis on the thermal performance characteristics of BIPV modules. This study dealt with different types of BIPV modules depending on the backside material, such as clear glass and backsheet. The analysis of monitoring data shows that the PV module temperature was closely related to the solar radiation on the BIPV module surface, and the BIPV used at the backside also had an effect on the PV module temperature that in turn determines its thermal performance.