• Title/Summary/Keyword: BN sheet

검색결과 13건 처리시간 0.032초

Ab Initio Investigations of Shapes of the h-BN Flakes on Copper Surface in Relation to h-BN Sheet Growth

  • Ryou, Junga;Hong, Suklyun
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2014년도 제46회 동계 정기학술대회 초록집
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    • pp.210.1-210.1
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    • 2014
  • The hexagonal boron nitride (h-BN) sheet, a 2D material like graphene sheet, is comprised of boron and nitrogen atoms. Similar to graphene, h-BN sheet has attractive mechanical properties while it has a wide band gap unlike graphene. Recently, many experimental groups studied the growth of single BN layer by chemical vapor deposition (CVD) method on the copper substrate. To study the initial stage of h-BN growth on the copper surface, we have performed density functional theory calculations. We investigate several adsorption sites of a boron or nitride atom on the Cu surfaces. Then, by increasing the number of adsorbed B and N atoms, we study formation behaviors of the BN flakes on the surface. Several types of BN flakes atoms such as triangular, linear, and hexagonal shapes are considered on the copper surface. We find that the formation of the BN flake in triangular shape is most favorable on the surface. On the basis of the theoretical results, we discuss the growth mechanism of h-BN layer on the copper surfaces in terms of its shapes in the initial stage of growth.

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First-principles Study of Graphene/Hexagonal Boron Nitride Stacked Layer with Intercalated Atoms

  • Sung, Dongchul;Kim, Gunn;Hong, Suklyun
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2014년도 제46회 동계 정기학술대회 초록집
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    • pp.185.2-185.2
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    • 2014
  • We have studied the atomic and electronic structure of graphene nanoribbons (GNRs) on a hexagonal boron nitride (h-BN) sheet with intercalated atoms using first-principles calculations. The h-BN sheet is an insulator with the band gap about 6 eV and then it may a good candidate as a supporting dielectric substrate for graphene-based nanodevices. Especially, the h-BN sheet has the similar bond structure as graphene with a slightly longer lattice constant. For the computation, we use the Vienna ab initio simulation package (VASP). The generalized gradient approximation (GGA) in the form of the PBE-type parameterization is employed. The ions are described via the projector augmented wave potentials, and the cutoff energy for the plane-wave basis is set to 400 eV. To include weak van der Waals (vdW) interactions, we adopt the Grimme's DFT-D2 vdW correction based on a semi-empirical GGA-type theory. Our calculations reveal that the localized states appear at the zigzag edge of the GNR on the h-BN sheet due to the flat band of the zigzag edge at the Fermi level and the localized states rapidly decay into the bulk. The open-edged graphene with a large corrugation allows some space between graphene and h-BN sheet. Therefore, atoms or molecules can be intercalated between them. We have considered various types of atoms for intercalation. The atoms are initially placed at the edge of the GNR or inserted in between GNR and h-BN sheet to find the effect of intercalated atoms on the atomic and electronic structure of graphene. We find that the impurity atoms at the edge of GNR are more stable than in between GNR and h-BN sheet for all cases considered. The nickel atom has the lowest energy difference of ~0.2 eV, which means that it is relatively easy to intercalate the Ni atom in this structure. Finally, the magnetic properties of intercalated atoms between GNR and h-BN sheet are investigated.

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Synthesis of Hexagonal Boron Nitride Nanosheet by Diffusion of Ammonia Borane Through Ni Films

  • 이석경;이강혁;김상우
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2013년도 제45회 하계 정기학술대회 초록집
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    • pp.252.1-252.1
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    • 2013
  • Hexagonal boron nitride (h-BN) is a two dimensional material which has high band-gap, flatness and inert properties. This properties are used various applications such as dielectric for electronic device, protective coating and ultra violet emitter so on. 1) In this report, we were growing h-BN sheet directly on sapphire 2"wafer. Ammonia borane (H3BNH3) and nickel were deposited on sapphire wafer by evaporate method. We used nickel film as a sub catalyst to make h-BN sheet growth. 2) During annealing process, ammonia borane moved to sapphire surface through the nickel grain boundary. 3) Synthesized h-BN sheet was confirmed by raman spectroscopy (FWHM: ~30cm-1) and layered structure was defined by cross TEM (~10 layer). Also we controlled number of layer by using of different nickel and ammonia borane thickness. This nickel film supported h-BN growth method may propose fully and directly growing on sapphire. And using deposited ammonia borane and nickel films is scalable and controllable the thickness for h-BN layer number controlling.

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Phase change properties of BN doped GeSbTe films

  • 장문형;박성진;박승종;정광식;조만호
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2010년도 제39회 하계학술대회 초록집
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    • pp.226-226
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    • 2010
  • Boron Nitride (BN) doped GeSbTe films were grown by the ion beam sputtering deposition (IBSD). The in-situ sheet resistance data and the x-ray diffraction patterns showed the crystallization is suppressed due to the BN incorporation. The phase change speed in BN doped GeSbTe films were investigated using the static tester equipped with nanosecond pulsed laser. The phase change speed for BN doped GST films become faster than the corresponding values for an undoped GST film. The Johnson-Mehl-Avrami(JMA) plot and Avrami coefficient for laser crystallization showed that the change in growth mode during the laser crystallization is a most important factor for the phase change speed in the BN doped GST films. The JMA results and the atomic force microscopy (AFM) images indicate that the origin of the change in the crystalline growth mode is due to an increase in the number of initial nucleation sites which is produced by the incorporated BN. In addition, the retension properties for the laser writing/erasing are remarkably improved in BN doped GeSbTe films owing to the stability of the incorporated BN.

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N과 AlN 시트에 다양한 기체(COx, NOx, SOx)의 흡착에 관한 이론 연구 (Theoretical Investigation for the Adsorption of Various Gases (COx, NOx, SOx) on the BN and AlN Sheets)

  • 김성현;김백진;신창호;김승준
    • 대한화학회지
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    • 제61권1호
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    • pp.16-24
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    • 2017
  • 본 연구는 그래핀과 유사한 2차원 붕소-질소(BN)와 알루미늄-질소(AlN) 시트에 여러 대기 유해 가스($CO_x$, $NO_x$, $SO_x$)가 흡착될 때의 구조적 특징과 결합에너지를 밀도 범함수 이론(DFT)과 MP2 방법을 사용하여 연구하였다. 분자 구조는 $B3LYP/6-31G^{**}$$CAM-B3LYP/6-31G^{**}$이론 수준에서 최적화하고, 진동 주파수를 계산하여 열역학적으로 가장 안정한 분자 구조를 확인하였다. 결합에너지는 $MP2/6-31G^{**}$ 이론 수준에서 한 점(single point) 에너지를 계산하고, 영점 진동에너지(ZPVE)와 바탕집합 중첩에러(BSSE)를 모두 보정하였다. BN 시트에 가스의 흡착은 모두 물리흡착으로 예측되었으며, AlN 시트에 대한 가스 흡착은 $CO_x$$NO_x$에 대해서는 물리흡착이 그리고 $SO_x$에 대해서는 화학 흡착이 일어날 것으로 예측되었다.

발열제어부품소재 적용을 위한 실리콘 복합조성물의 열전도 특성 (Thermal Characteristics of Silicone Composites for the Application to Heat-Controllable Components)

  • 곽호두;오원태
    • 한국전기전자재료학회논문지
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    • 제32권2호
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    • pp.116-121
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    • 2019
  • Hexagonal boron nitride particles (s-hBN) modified with 3-aminopropyl triethoxysilane (APTES) were used for the preparation of silicone composite materials. The microstructure of the composite materials was observed, and the thermal conduction and mechanical characteristics of the composite sheets were studied based on the compositions and microstructures. When a small amount of s-hBN particles was used, the thermal conductivity of the composite improved as a whole, and the tensile strength of the sheet also increased. The thermal conductivity and tensile strength of the composite in which a small amount of carbon fiber was added along with s-hBN were further improved. However, the use of carbon nanotubes with structural characteristics similar to those of carbon fiber resulted in lower thermal conductivity and tensile strength. Elastic silicone composites exhibiting 2.5 W/mK of thermal conductivity and a low hardness are expected to be used as thermally conductive interfacial sheet materials.

고출력 전자 패키지 기판용 고열전도 h-BN/PVA 복합필름 (High Thermal Conductivity h-BN/PVA Composite Films for High Power Electronic Packaging Substrate)

  • 이성태;김치헌;김효태
    • 마이크로전자및패키징학회지
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    • 제25권4호
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    • pp.95-99
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    • 2018
  • 최근 고집적 고출력 전자 패키지의 효율적인 열전달을 위한 기판 및 방열소재로서 절연성 고열전도 필름의 수요가 커지고 있어, 알루미나, 질화알루미늄, 질화보론, 탄소나노튜브 및 그래핀 등의 고열전도 필러소재를 사용한 고방열 복합소재에 대한 많은 연구가 이루어지고 있다. 그 중에서도 육방정 질화보론(h-BN) 나노시트가 절연성 고열전도 필러 소재로서 유력한 후보 물질로 선택되고 있다. 본 연구는 이 h-BN 나노시트와 PVA로 된 세라믹/폴리머 복합체 필름의 방열특성 향상에 관한 것이다. h-BN 나노시트는 h-BN 플레이크 원료 분말을 유기용매를 사용한 볼밀링과 초음파 처리에 의한 물리적 박리공정으로 만들었으며, 이를 사용한 h-BN/PVA 복합 필름을 제조한 결과 성형된 복합필름의 면방향과 두께방향 열전도도는 50 vol%의 필러함량에서 각각 $2.8W/m{\cdot}K$$10W/m{\cdot}K$의 높은 열전도도가 나타났다. 이 복합필름을 PVA의 유리전이온도 이상에서 일축 가압하여 h-BN 판상분말의 얼라인먼트를 향상시킴으로써 면방향 열전도도를 최대 $13.5W/m{\cdot}K$까지 증가시킬 수 있었다.

보론 나이트라이드를 사용하는 Predeposition 공정에서 질소류량의 영향 (The effect of nitrogen flow rate in a predeposition with Boron nitride)

  • 박형무;김충기
    • 전기의세계
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    • 제30권4호
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    • pp.227-230
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    • 1981
  • The variation of sheet resistance and the reduction of masking oxide thickness with the flow rate of nitrogen gas has been measured in Boron predeposition process with Planar Diffusion source, BN-975. At 900.deg. C, the sheet resistance varied as much as 75% when the nitrogen flow rate was changed from 0.4 liters/min to 2.0 liters/min. At 975.deg. C, however, only 12% of sheet resistance variation was observed under the same flow rate change. The reduction of masking oxide thickness at 975.deg. C for a 5 min predeposition was 600 nm when the nitrogen flow rate was 0.4 liters/min. When the flow rate incresased to 1.9 liters/min, however, only 100nm of masking oxide was consumed in a similar predeposition process.

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Synthesis of Boron Nitride Nanotubes via inductively Coupled thermal Plasma process Catalyzed by Solid-state ammonium Chloride

  • Chang, Mi Se;Nam, Young Gyun;Yang, Sangsun;Kim, Kyung Tae;Yu, Ji Hun;Kim, Yong-Jin;Jeong, Jae Won
    • 한국분말재료학회지
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    • 제25권2호
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    • pp.120-125
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    • 2018
  • Boron nitride nanotubes (BNNTs) are receiving great attention because of their unusual material properties, such as high thermal conductivity, mechanical strength, and electrical resistance. However, high-throughput and high-efficiency synthesis of BNNTs has been hindered due to the high boiling point of boron (${\sim}4000^{\circ}C$) and weak interaction between boron and nitrogen. Although, hydrogen-catalyzed plasma synthesis has shown potential for scalable synthesis of BNNTs, the direct use of $H_2$ gas as a precursor material is not strongly recommended, as it is extremely flammable. In the present study, BNNTs have been synthesized using radio-frequency inductively coupled thermal plasma (RF-ITP) catalyzed by solid-state ammonium chloride ($NH_4Cl$), a safe catalyst materials for BNNT synthesis. Similar to BNNTs synthesized from h-BN (hexagonal boron nitride) + $H_2$, successful fabrication of BNNTs synthesized from $h-BN+NH_4Cl$ is confirmed by their sheet-like properties, FE-SEM images, and XRD analysis. In addition, improved dispersion properties in aqueous solution are found in BNNTs synthesized from $h-BN+NH_4Cl$.

Cu첨가 극저탄소 고 강도강의 가공성에 미치는 Al과 B의 영향 (Effect of Aluminium and Boron on Formability for Cu Bearing Extra Low Carbon Steel Sheets)

  • 김성일;정경환;홍문희
    • 한국소성가공학회:학술대회논문집
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    • 한국소성가공학회 2009년도 춘계학술대회 논문집
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    • pp.302-305
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    • 2009
  • This paper examines the effect of nitride formation on formability for Cu bearing high strength extra low carbon (ELC) steel sheets. For this purpose, we have investigated the effect of addition of aluminium (Al) and boron (B) on texture and precipitation behavior of the ELC steel during continuous annealing. Mechanical properties and microstructures of the ELC steel sheets were analyzed as well using uni-axial tensile test, electron back-scattered diffraction (EBSD) technique and transmission electron microscopy (TEM) following pilot rolling and continuous annealing. It has been found that the addition of Al and B increases the precipitation of AlN and BN. What is more, the scavange of solute nitrogen is effective in increasing the formability of the ELC steels. In addition, the Al and B addition improves the aging property of the ELC steel.

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