• Proceedings of the KIEE Conference
• /
• 1988.07a
• /
• pp.346-349
• /
• 1988

Conductance technique is the moat accurate method and gives more detailed information about interface of the MIS structure than other methods. With the measurement of the equivalent parallel conductance and capacitance, the characterization of Si-SiN interface is developed. The interface state density of Si-SiN is obtained by $8{\times}10^{11}$ - $6{\times}10^{12}(eV^{-1}cm^{-2}$). After the positive B-T stress is performed on the sample, the interface state density gets increased. The interface state density is not effected by the D.C. stress.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2004.11a
• /
• pp.243-246
• /
• 2004

Boron Phosphide films were deposited on (111) Si substrate at $650^{\circ}C$, by the reaction of $B_2H_6$ with PH, using APCVD. $N_2$ was carried out as carrier gas. The optimal gas rates were 20 ml/min for B2H6, 60 ml/min for PH3 and 1 l/min for N2. After as grown the films were insitu annealed fur 1hour in $N_2$ ambient at $550^{\circ}C$ and measured. The measurement of AFM shows that the average surface roughness is $10.108{\AA}$ for the reaction temperature at $450^{\circ}C$ and $29.626{\AA}$ fur the reaction temperature at $650^{\circ}C$. The measurement of XRD shows that the films have the orientation of(1 0 1). Also, the measurement of AES is shown that the films have $B_{13}P_2$ stoichiometry. For the Result of microwaves absorbtion properties using VNA, it obtained the permittivity of BP about 8 between $1.5{\sim}2.5GHz$. In this study, it obtained the BP thin film by deposited in atmosphere pressure And BP thin film can be after to applicate as microwave absolution material is obtained.

• 한국정보디스플레이학회:학술대회논문집
• /
• 2006.08a
• /
• pp.1649-1652
• /
• 2006

2.22-inch qVGA $(240{\times}320)$ amorphous silicon thin film transistor liquid active matrix crystal display (${\alpha}$- Si TFT-AMLCD) panel has been successfully demonstrated employing a 2.5 um fine-patterning technology by a wet etch process. Higher resolution 2.22-inch qVGA LCD panel with an aperture ratio of 58% can be fabricated because the 2.5 um fine pattern formation technique is combined with high thermal photo-resist (PR) development. In addition, a novel concept of unique ${\alpha}$-Si TFT process architecture, which is advantageous in terms of reliability, was proposed in the fabrication of 2.22-inch qVGA LCD panel. Overall results show that the 2.5 um finepatterning is a considerably significant technology to obtain higher aperture ratio for higher resolution ${\alpha}$-Si TFT-LCD panel realization.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.11 no.5
• /
• pp.413-417
• /
• 1998

In this paper, we investigate frequency dependance of inductance of FeCoB amorphous magnetic films. $(Fe_{1-x}Co_x)_{79}Si_2B_{19}$ was used as the basic composition of amorphous magnetic film having near zero magnetostriction. The amorphous magnetic films were fabricated with x=0.94 and x=0.95 by using sputtering method at high frequency. The films were anneald under non-magnetic field and near crystallization temperatures(30min at $280^{\circ}C$, 30min and 1hr at $400^{\circ}C$, respectively). As the results of the experiments with the fabricated films, the lowest coercive force was 0.084[Oe] at 400[W] of the input power and the crystallization temperature was $360^{\circ}C$ . In the case 30min at 40$0^{\circ}C$ the inductance value in the low frequency with x=0.95 was higher by 488% than that with x=0.94. The quality factor Q was below 0.7 for all samples. We obtained the highest quality value at 400[KHz] with 30min at $280^{\circ}C$ and x=0.94. The value was about 0.62. Also, the quality factor value was about 0.35 at 1[MHz] with 30min at $280^{\circ}C$ and x=0.95.

• Journal of Korea Foundry Society
• /
• v.2 no.3
• /
• pp.2-15
• /
• 1982

In this study, the influenced of graphite shape on the boriding of cast iron and boride structure was investigated. Gray cast iron, ferritic and pearlitic ductile cast iron were borided at 750,850,900 and $950^{\circ}C$ for 1,3 and 5 hours by powder pack method with the mixture of $B_4C_9\;Na_2B_4O_7$, $KBF_4$ and Shc. The boride layer was consisted of FeB(little), $Fe_2B$ (main) and graphite. Some possibility of the existence of unknown Fe-B-C compound in the boride layer was suggested. And precipitates in the diffusion zone was $Fe_3(B,C)$. The concentration of Si and precipitation of $Fe_3(B,C)$ in the ${\alpha}$ layer raised the hardness of this Zone. The depth and hardness of boride layer increased with the increase of treating temperature and tim. But high temperature (over $950^{\circ}C)$ caused pore at graphite position and long treating time (5hrs) sometimes caused formation of graphite layer beneath the boride layer. So, for the practical application of borided cast iron, treating in short time and at low temperature was recommended. And for ductile cast iron, ferritizing or pearlitizing heat treatment was seemmed to be possible at the same time with boriding. The graphite in the boride layer was deeply concerned with the qualitx and characteristics of the boride layer. And it greatly influenced on the shape of the boride phase, structure of the boride layer. Generally speaking, the existance of graphite restrained the growth of the boride phase. But the boundary between the gsaphite and the matrix acted as the shortcut of boron diffusion. So, for gray cast iron, the graphite layed length-wise led the formation of boride layer.

• Transactions of Materials Processing
• /
• v.18 no.7
• /
• pp.544-549
• /
• 2009

This study aimed to elucidate the deformation mechanism during low-temperature superplasticity of fine-grained Ti-6Al-2Sn-4Zr-2Mo-0.1Si alloy in the context of constitutive equation. For this purpose, initial coarse equiaxed microstructure was refined to $2.2{\mu}m$ via dynamic globularization. Globularized microstructure exhibited large superplastic elongations(434-826%) at temperatures of $650-750^{\circ}C$ and strain rate of $10^{-4}s^{-1}$. It was found that the main deformation mechanism of fine-grained material was grain boundary sliding accommodated by dislocation motion with both stress exponent (n) and grain size exponent (p) values of 2. When the alpha grain size, not sub-grain size, was considered to be an effective grain size, the apparent activation energy for low-temperature superplasticity of the present alloy(169kJ/mol) was closed to that of Ti-6Al-4V alloy(160kJ/mol).

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2001.07a
• /
• pp.263-266
• /
• 2001

In this paper, we investigated dielectric properies for BST thin films that was deposited on MgO/Si substrates using RF magnetron sputtering. In here, MgO film was used to perform that a diffusion b arrier between the BST film and Si substrate and a buffer layer to assist the BST film growth. A d eposition condition for MgO films was RF Power of 50W, substrate temperature of room temperature and the working gas ratio of Ar:O$_2$ were varied from 90:10 to 60:47. Finally we manufactured the cap acitor of Al/BST/MgO/Si/Al structure to know electrical properties of this capacitor through I-V, C-V measurement. In the results, C-V aha racteristic curves was shown a ferroelectric property so we measured P-E. A remanent poliazation and coerceive electric field was present 2$\mu$C/cm$^2$ and -27kV/cm respectively at Ar:O$_2$=90:10. And a va clue of dielectric constant was 86 at Ar:02=90:10.

• JSTS:Journal of Semiconductor Technology and Science
• /
• v.3 no.1
• /
• pp.21-26
• /
• 2003

4H-SiC Schottky rectifiers were exposed to pure Ar discharges in a planar coil Inductively Coupled Plasma system, as a function of source power, of chuck power and process pressure. The reverse breakdown voltage ($V_B$) decreased as a result of plasma exposure due to the creation of surface defects associated with the ion bombardment. The magnitude of the decrease was a function of both ion flux and ion energy. The forward turn-on voltage ($V_F$), on-state resistance ($R_{ON}$) and diode ideality factor (n) all increased after plasma exposure. The changes in all of the rectifier parameters were minimized at low power, high pressure plasma conditions.

• JSTS:Journal of Semiconductor Technology and Science
• /
• v.5 no.2
• /
• pp.113-119
• /
• 2005

4H-SiC planar MESFETs were fabricated using ion-implantation on semi-insulating substrate without recess gate etching. A modified RCA method was used to clean the substrate before each procedure. A thin, thermal oxide layer was grown to passivate the surface and then a thick field oxide was deposited by CVD. The fabricated MESFET showed good contact properties and DC/RF performances. The maximum oscillation frequency of 34 GHz and the cut-off frequency of 9.3 GHz were obtained. The power gain was 10.1 dB and the output power of 1.4 W was obtained for 1 mm-gate length device at 2 GHz. The fabricated MESFETs showed the charge trapping-free characteristics and were characterized by the extracted small-signal equivalent circuit parameters.

• Journal of the Korean Vacuum Society
• /
• v.21 no.4
• /
• pp.199-204
• /
• 2012

$SF_6$ gas is widely used for dry etching process of semiconductor and display fabrication process. But $SF_6$ gas is considered for typical greenhouse gas for global warming. So it is necessary to research relating to $SF_6$ alternatives reducing greenhouse effect in semiconductor and display. $C_3F_6$ gas is one of the promising candidates for it. We studied about etch characteristics by performing Reactive Ion Etching process of dry etching and reduced gas element exhausted on etching process using absorbent Zeolite 5A. $Si_3N_4$ thin film was deposited to 500 nm with Plasma Enhanced Chemical Vapor Deposition and we performed Reactive Ion Etching process after patterning through photolithography process. It was observed that the etch rate and the etched surface of $Si_3N_4$ thin film with Scanning Electron Microscope pictures. And we measured and compared the exhausted gas before and after the absorbent using Gas Chromatograph-Mass Spectrophotometry.