• Journal of Technology Innovation
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• v.26 no.3
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• pp.37-68
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• 2018

Since the 20th century, automobiles, which are the most common means of transportation, have been evolving as the use of electronic control devices and automotive semiconductors increases dramatically. Automotive semiconductors are a key component in automotive electronic control devices and are used to provide stability, efficiency of fuel use, and stability of operation to consumers. For example, automotive semiconductors include engines control, technologies for managing electric motors, transmission control units, hybrid vehicle control, start/stop systems, electronic motor control, automotive radar and LIDAR, smart head lamps, head-up displays, lane keeping systems. As such, semiconductors are being applied to almost all electronic control devices that make up an automobile, and they are creating more effects than simply combining mechanical devices. Since automotive semiconductors have a high data rate basically, a microprocessor unit is being used instead of a micro control unit. For example, semiconductors based on ARM processors are being used in telematics, audio/video multi-medias and navigation. Automotive semiconductors require characteristics such as high reliability, durability and long-term supply, considering the period of use of the automobile for more than 10 years. The reliability of automotive semiconductors is directly linked to the safety of automobiles. The semiconductor industry uses JEDEC and AEC standards to evaluate the reliability of automotive semiconductors. In addition, the life expectancy of the product is estimated at the early stage of development and at the early stage of mass production by using the reliability test method and results that are presented as standard in the automobile industry. However, there are limitations in predicting the failure rate caused by various parameters such as customer's various conditions of use and usage time. To overcome these limitations, much research has been done in academia and industry. Among them, researches using data mining techniques have been carried out in many semiconductor fields, but application and research on automotive semiconductors have not yet been studied. In this regard, this study investigates the relationship between data generated during semiconductor assembly and package test process by using data mining technique, and uses data mining technique suitable for predicting potential failure rate using customer bad data.

• International Commerce and Information Review
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• v.11 no.3
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• pp.145-165
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• 2009

Nowadays, economic growth of China has become an important issue. Due to the demographic position and the market size, China-Korea trade relationship has grown tremendously and significantly. The Chinese relationship with the Korean industry has considerably increased over the years. Various trade competitiveness indices such as TSI, MRCAI, and IITI have been applied to measure the competitive advantage and the complementary of market structure between these two countries. For this purpose, the dataset from the year 2000 to 2008 provided by KITA were used. The MRCAI result show that Korea has specialized in the product of semiconductor, communication equipment, precision machine, automobile, and nonferrous metal. The intra-industry trade level of Korean manufacturing industry is rising in line with the dominance of vertical intra-industry trade(VIIT) trend.

• Proceedings of the KSME Conference
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• 2001.06c
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• pp.189-196
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• 2001

Machine tools of high-speed and high-precision are required for various fields of industry such as semiconductor, automobile, mold fabrication and so on. Light-weight machine tool structure is essential for reduction of production time through rapid transportation. Also, high damping capacity of the structure is required to obtain precise products without vibration during manufacturing. Composite materials have high potential for machine tool structures due to its high specific stiffness and good damping characteristics. In this study, the design and the manufacture of a hybrid machine tool structure using composite materials was attempted and the damping capacity was investigated experimentally.

• IE interfaces
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• v.20 no.3
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• pp.245-256
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• 2007

Toyota Production System (TPS) has been known a new production paradigm applicable to every type of manufacturing industry, not restricted to automobile assembly system. The basic framework of TPS has been studied and presented actively; many enterprises from all over the world including some of large domestic companies, have adopted and applied. This study analyzed the cases for TPS introduction and application process of LG Electronics and SAMSUNG Electronics, Semiconductor Division. On a different areas of business items, different strategic approaches are developed and implemented on a two comparable domestic companies. Key success factors for two companies are analysed, and some issues are also discussed.

• Journal of Institute of Control, Robotics and Systems
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• v.14 no.11
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• pp.1155-1164
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• 2008

Supervisory control theory, which was first proposed by Ramadge and Wonahm, is a well-suited control theory for the control of complex systems such as semiconductor manufacturing systems, automobile manufacturing systems, and chemical processes because these are better modeled by discrete event models than by differential or difference equation models at higher levels of abstraction. Moreover, decentralized supervisory control is an efficient method for large complex systems according to the divide-and-conquer principle. Decentralized supervisors cannot observe the events those of which occur only within the other supervisors. Therefore decentralized supervisors can be designed according to supervisory control theory under partial observation. This paper presents a solution and a design procedure of supervisory control problem (SCP) for the case of decentralized control and SCP under partial observation (SCPPO). We apply the proposed design procedure to an experimental CIM Testbed. And we compare and analyze the designed decentralized supervisors and partially observed supervisors.

• Proceedings of the Korean Society for Quality Management Conference
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• 2010.04a
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• pp.55-61
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• 2010

Many enterprises are looking for counterproposals to be survival through innovation activities and to be held on their continuous businesses for their business management environments nowadays. One of the innovation activities is an improvement of Loss and reinforcement of business structure through Lean, TPM. Another one is an improvement of these innovation activities and have achieved lots of outcomes (profits). But most these activities have been applied for only the industries in Automobile, Semiconductor, Aviation, Construction with large enter in Korea. And most of minor cable enterprises don't even try to import these innovation activities excluding some how the small and medium cable enterprise can import the LEAN / 6 Sigma activities effectively with some of sample in real small and medium cable company.

• Transactions of the Korean Society of Automotive Engineers
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• v.16 no.5
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• pp.113-118
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• 2008

We have developed an integrated giant magneto resistance using not only circuit but also integrating technique with semiconductor for automobile application. It has four elements used for giant magneto resistance sensor. Ni-Fe/Cu multi layers were prepared on a glass substrate by magnetron sputtering. The dependence of magneto resistance on the thickness of the Ni-Fe and Cu layers was investigated. The MR ratio showed a saturated a peak at Cu layer $10{\AA}$, Ni-Fe layer $50{\AA}$, where the MR ratio is about 8.7% at room temperature. By means of Ni-Fe multi film and specific integrating technique, these new giant magneto resistance sensor showed excellent resistance characteristics.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.17 no.4
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• pp.35-41
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• 2008

R/In order to satisfy the customer's variant needs for a product quality in recent years, a demand for developing higher precision machining technologies in a lot of application areas such as automobile, cellular phone and semiconductor has been increased more and more. Magnetic abrasive polishing(MAP) process is one of these precision technologies. In this study, to verify the parameters' effect of the MAP process on the surface roughness improvement of the plane and the inclined workpiece, well planned experiments which was called the design of experiments were carried out. Considered polishing factors were spindle speed, supplied current, abrasive type and working gap between the workpiece and the solid tool. As a result, it was seen that the supplied current and the working gap greatly affected the surface roughness improvement.

• Transactions on Electrical and Electronic Materials
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• v.6 no.2
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• pp.39-45
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• 2005

Numerical and visualization procedures are used in a finite difference grid to analyze and better understand the heat transfer in the MEMS based air micro-jet array (MIA) impingement cooling device. The Navier-Stokes (NS) equations with incompressible flow are solved using an implicit procedure. The temperature contour and velocity vector visualization diagrams are used for illustration. The computed temperature distribution at the bottom of the MIA is in good agreement with the experimental measurement data. The parameters are investigated to improve the efficiency of heat transfer in the MIA. The optimum configuration of the MIA is suggested. The present modeling explains the flow phenomenon and yields valuable information to understand the flow and heat transfer in MIA.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.27 no.8
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• pp.501-504
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• 2014

This paper was developed and described core-process to implement low on resistance which was the most important characteristics of SJ (super junction) MOSFET. Firstly, using process-simulation, SJ MOSFET optimal structure was set and developed its process flow chart by repeated simulation. Following process flow, gate level process was performed. And source and drain level process was similar to genral planar MOSFET, so the process was the same as the general planar MOSFET. And then to develop deep trench process which was main process of the whole process, after finishing photo mask process, we developed deep trench process. We expected that developed process was necessary to develop SJ MOSFET for automobile semiconductor.