Transactions on Electrical and Electronic Materials

The Korean Institute of Electrical and Electronic Material Engineers (한국전기전자재료학회)
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Numerical Analysis of Micro-jet Array Cooling Device with Various Configurations

  • Jung, Yang-Ki (Korea Automobile Testing & Research Institute) ;
  • Lee, In-Chan (Memory Research and Development Division, Hynix Semiconductor Inc.) ;
  • Ma, Tae-Young (Department of Electric Engineering, Gyeongsang National University)
  • Published : 2005.04.01
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Abstract

Numerical and visualization procedures are used in a finite difference grid to analyze and better understand the heat transfer in the MEMS based air micro-jet array (MIA) impingement cooling device. The Navier-Stokes (NS) equations with incompressible flow are solved using an implicit procedure. The temperature contour and velocity vector visualization diagrams are used for illustration. The computed temperature distribution at the bottom of the MIA is in good agreement with the experimental measurement data. The parameters are investigated to improve the efficiency of heat transfer in the MIA. The optimum configuration of the MIA is suggested. The present modeling explains the flow phenomenon and yields valuable information to understand the flow and heat transfer in MIA.

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References

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