• Proceedings of the KWS Conference
• /
• 2006.05a
• /
• pp.230-232
• /
• 2006

Eutectic Au-20Sn solder has been widely used for optoelectronic packages because of fluxless soldering process and thus are particularly valuable for many applications such as biomedical, photonic, and MEMS devices that can not use any flux. Also when good joint strength, superior resistance to corrosion, whisker-free, and good thermal conductivity are demanded, eutectic Au-20Sn solder can be satisfied with above-mentions best. In this study, we tried to know the interfacial reactions between Au-20Sn solder and Cu substrate with or without ENIG plating layer In the results, Au-Cu-Sn ternary phases were formed at the Au-20Sn/Cu substrate, and Au-Ni-Sn, Au-Ni-Cu-Sn phases were formed at the Au-20Sn/ENIG substrate.

• Journal of the Korean institute of surface engineering
• /
• v.46 no.6
• /
• pp.235-241
• /
• 2013

In this study, the effects of alloying elements and thermal aging on the contact resistance of electroplated gold alloy layers were investigated by surface analysis using X-ray photoelectron spectroscopy (XPS). The contact resistance of Au-Ag alloy was lower than that of Au-Ni or Au-Co alloy after thermal aging. The XPS results show that nickel and oxygen present as nickel oxides such as NiO and $Ni_2O_3$ on the surface of gold layers after thermal aging. The increase in the contact resistance after thermal aging is attributable to the nickel oxide layer formed on the surface of the gold layers. The content of nickel diffused from the underlayer during the thermal aging was high in the order of Au-Co, Au-Ni and Au-Ag alloy because the area of grain boundary was large in the order of Au-Ag, Au-Ni and Au-Co alloy.

• Proceedings of the Korean Society for Technology of Plasticity Conference
• /
• 2009.10a
• /
• pp.464-466
• /
• 2009

This study tried to examine the suitability of strip casting process such as PFC (Planar Flow Casting) method for soldering Au-Sn strip. The effect of heat treatment on the tensile behavior and mechanical properties of an Au-Sn strip was investigated through tensile test, micro hardness test, X-ray diffraction (XRD), SEM, and TEM observations. It was apparent that 20-mm width Au-Sn strip could be well produced by using planar flow casting process. Tensile results showed that tensile strength increased from 338.3MPa to 310MPa and plastic strain improved from 0% to 1.5% with heat treatment ($170^{\circ}C$/70 hrs.). The microstructure of Au-Sn strip mainly consisted of two phases; $Au_5Sn(\zeta)$ and AuSn($\sigma$). It was also found that inhomogeneous amorphous local structure continuously changed to the homogeneous two phases microstructure with heat treatment. The fractographical observation after tensile test indicated the cleavage fracture mode of as-casted Au-Sn strip. On the other hand, the heat treated Au-Sn strip showed that fracture propagated along interface between brittle AuSn and ductile $Au_5Sn$ phases. The deformation behavior of strip casted Au-Sn alloy with microstructural evolution and the improve method for ductility of this alloy was also suggested.

• Journal of the Microelectronics and Packaging Society
• /
• v.11 no.3 s.32
• /
• pp.47-53
• /
• 2004

Eutectic Au-20Sn(compositions are all in weight percent unless specified otherwise) solder alloys were soldered on the Ni substrate with various time and temperature. The composition, phase identification and morphology of intermetallic compounds(IMC) at the interface were examined using Scanning Electron Microscopy(SEM). There were two types of IMCs, $(Au,Ni)_3Sn_2$ and $(Au,Ni)_3Sn$ at the interface. The transition in morphology of $(Au,Ni)_3Sn_2$ has been observed at $300{\~}400^{\circ}C$. The morphology transition of $(Au,Ni)_3Sn_2$ is due to the decrease of enthalpy of formation of $(Au,Ni)_3Sn_2$ phase and has been explained well by Jackson's parameter with temperature. Because the number of diffusion channel is different at each soldering temperature, IMC thickness is nearly same at all temperature.

• Journal of Electrochemical Science and Technology
• /
• v.3 no.2
• /
• pp.57-62
• /
• 2012

In this report, we demonstrate that the longitudinal localized surface plasmon resonance mode can be suppressed when the nanorods were in dumbbell shape. The seed nanorods were synthesized by electrochemical deposition of metals into the pores of anodic aluminum oxide templates. The dumbbell-like nanorods were grown from seed Au-Ni-Au nanorods by a rate-controlled seed-mediated growth strategy. The selective deposition of Au atoms onto Au blocks of Au-Ni-Au nanorods produced larger diameter of Au nanorods with bumpy surface resulting in dumbbell-like nanorods. The morphology of nanorods depended on the reduction rate of $AuCl_4^-$, slow rate producing smooth surface of Au nanorods, but high reduction rate producing bumpy surface morphology. Through systematic investigation into the UV-Vis-NIR spectroscopy, we found that the multiple localized surface plasmon resonance (LSPR) modes were available from single-component Au nanorods. And, their LSPR modes of Au NRs with bumpy surface, compared to the smooth seed Au NRs, were red-shifted, which was obviously attributed to the increased electron oscillation pathways. While the longitudinal LSPR modes of smoothly grown Au NRs were blue-shifted except for a dipole transverse LSPR mode, which can be interpreted by decreased aspect ratio. In addition, dumbbell-like nanorods showed an almost disappeared longitudinal LSPR mode. It reflects that the plasmonic properties can be engineered using complex nanorods structure.

• 한국정보디스플레이학회:학술대회논문집
• /
• 2008.10a
• /
• pp.855-858
• /
• 2008

Transient current (TC) on bulk-state liquid crystal mixtures was measured. We found that TC is very sensitive to impurities and the features of TC curves depend on the type of contamination, from which the quality of materials can be definitely evaluated and the type of impurities can also be revealed.

• Proceedings of the KWS Conference
• /
• 2004.05a
• /
• pp.75-77
• /
• 2004

Microstructure and mechanical property of In48Sn solder on electrolytic Au/Ni/Cu BGA substrate were investigated with the number of reflows. AuIn and AuIn$_2$ IMCs were formed at the interface solder and pad after 1reflow. An increase of the number of reflows changed AuIn into AuIn$_2$. AuIn$_2$ IMC layer at the interface broke and spalled away into the solder after 3reflows. Shear force decreased with the number of reflows because the weakness of the interface by the spalling of AuIn$_2$ IMC layer.

• Proceedings of the Korean Powder Metallurgy Institute Conference
• /
• 2006.09a
• /
• pp.158-159
• /
• 2006

Ultrafine Au-Pb particles prepared by two method, (1) simultaneous evaporation of Au and Pb in inert gas and (2) subsequent vapor condensation of Pb in a differentially evacuated tube onto flying Au nanoparticles prepared by gasevaporation technique, were observed by electron microscopy. In the method (1), the particles that grew at the region where the two smoke masses converged, consisted of alloy phases. In the method (2), the particles consisted of two or three phases of Au, $Au_2Pb$, $AuPb_2$ and Pb phases in turn from the inner part, Pb-rich particles being composed of only two phases of $AuPb_2$ and Pb.

• Journal of the Korean Ceramic Society
• /
• v.13 no.3
• /
• pp.55-62
• /
• 1976

순수한 닉켈과 금 박막을 (III)규소 단 결정위에 진공 증착시켰다. Ni/Au/Si나 Au/Ni/Si시료를 진공중에서 약 55$0^{\circ}C$로 가열하였을 때 육방정 혹은 변형된 육방정의 미소 결정들이 규소 기질위에 형성되었다. 이들 미소 결정들의 형성과정 및 조성은 X-선 회절법, scanning electron microscopy 및 scanning Auger microprobe 법을 사용하여 결정하였다. 이들 미소 결정은 NiSi2임이 확인되었다. Ni/Au/Si 시료에서는 Au-Si 공융점(37$0^{\circ}C$) 이상으로 온도가 증가됨에 따라 닉켈과 규소가 Au-Si 공융체 속으로 이동한 후 반응하여 NiSi2를 형성하였다. Au/Ni/Si 시료에 있어서의 Au-Si 공융체 형성은 닉켈 박막에 있는 바늘구멍형의 표면 결함과 관련 지을 수 있겠다. 금이 닉켈 박막의 grain boundary를 통하여 Ni/Si 계면으로 확산되어 그 계면을 습윤시킨 다음 Au-Si 공융체를 형성하였다. 이런 Au-Si 공용체는 닉켈과 규소 원자에 대한 높은 확산 매질로서 작용하여 NiSi2 형성을 촉진시켰다. 표면에 평행한 (III)규소면 위의 NiSi2 미소 결정은 유사한 육방정으로 나타났으며, 경사진 미소결정은 부등변 사변형과 유사하였다. Auger 스펙트럼 및 Ni, Au 및 Si에 대한 내층조성(indepth Composition Profiles)은 NiSi2 미소 결정이 Au-Si 공융체의 matrix에 미소 부분으로 나타났음을 보여주었다.

• Journal of Technologic Dentistry
• /
• v.14 no.1
• /
• pp.23-43
• /
• 1992

Corrosion characteristics of four commerial gold-based dental alloys(C-1; Au75%, Ag13.9%, Pd3%, Cu & etc.,8.1%, C-2 ;Au 52.08, Ag 24%, Pd 5%, Cu & etc.,18.92, C-3 ; Au 53%, Ag 22%, Pd 5%, Pt 3% Cu & etc.,17%, C-4 ; Au 53%, Pd4, Pt1.5%, Ag & Cu & etc.,41.5%) and four experimental ternary Au-Ag-Cu alloys(E-1 ; Au 50%, Ag 30%, Cu 20%, E-2 ; Au 50%, Ag 20%, Cu 30%, E-3 ; Au 50%, Ag 10%, Cu 40%, E-4 ; Au 50%, Ag 40%, Cu 10%) were investigated by potentiodynamic polarization analysis and the structure was examined by optical microscope and SEM. All corrosion testing was conducted in 1% NaCl solution. The main results are as follows : 1. The corrosion resistence of commercial alloys was decreased in the order of C-1, C-3, C-4, C-2. C-2. 2. The E-1 and E-3 ternary alloys exhibits the higher corrosion resistence than E-2 and E-4 alloys. 3. The cast microstructure of alloys reveals dendrite morphology which shows the significant microsegregation caused by the difference in the diffusion rate between liquid and solid. 4. It is found that the surface corrosion products were mainly AgCl by X-ray diffraction results.