Journal of the Korean institute of surface engineering (한국표면공학회지)

The Korean Institute of Surface Engineering (한국표면공학회)
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Effect of Alloying Elements and Thermal Aging on the Contact Resistance of Electroplated Gold Alloy Layers

금 합금 도금층의 접촉저항에 미치는 합금원소의 종류 및 Thermal Aging의 영향

  • Lee, Jiwoong (Department of Materials Science and Metallurgy, Kyungpook National University) ;
  • Son, Injoon (Department of Materials Science and Metallurgy, Kyungpook National University)
  • 이지웅 (경북대학교 금속신소재공학과) ;
  • 손인준 (경북대학교 금속신소재공학과)
  • Received : 2013.11.25
  • Accepted : 2013.12.05
  • Published : 2013.12.31
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Abstract

In this study, the effects of alloying elements and thermal aging on the contact resistance of electroplated gold alloy layers were investigated by surface analysis using X-ray photoelectron spectroscopy (XPS). The contact resistance of Au-Ag alloy was lower than that of Au-Ni or Au-Co alloy after thermal aging. The XPS results show that nickel and oxygen present as nickel oxides such as NiO and $Ni_2O_3$ on the surface of gold layers after thermal aging. The increase in the contact resistance after thermal aging is attributable to the nickel oxide layer formed on the surface of the gold layers. The content of nickel diffused from the underlayer during the thermal aging was high in the order of Au-Co, Au-Ni and Au-Ag alloy because the area of grain boundary was large in the order of Au-Ag, Au-Ni and Au-Co alloy.

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