• 제목/요약/키워드: Atomic layer deposition(ALD)

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원자층 증착법을 이용한 Al2O3/TiO2 보호막의 수분 보호 특성 (Water Vapor Permeation Properties of Al2O3/TiO2 Passivation Layer Deposited by Atomic Layer Deposition)

  • 권태석;문연건;김웅선;문대용;김경택;신새영;한동석;박재근;박종완
    • 한국진공학회지
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    • 제19권6호
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    • pp.495-500
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    • 2010
  • 원자층 증착법(ALD: atomic layer deposition)을 이용하여 PES (poly (ether sulfon)) 기판위에 증착 온도, 플라즈마 파워에 따라 $Al_2O_3$$TiO_2$ 박막을 증착했다. 공정 조건에 따라 $Al_2O_3$$TiO_2$ 박막의 밀도, 탄소의 함유량이 달라지는 것을 알 수 있었으며, 공정 조건을 변화시켜 고밀도의 박막을 얻을 수 있었다. 플라즈마에 의한 PES 기판 손상을 막기 위해 buffer layer를 도입했으며, 또한 박막 내부 결함에 의한 수분 투과를 지연 또는 막기 위해 다층 구조를 증착했다. 이를 분석하기 위해 MOCON test를 이용해 투습률을 조사하였다. 플라스틱 기판에 다층 구조의 무기물 보호막을 적용했을 시 플라스틱 기판의 투습률 특성이 개선되었으며, 수분 투과에 대한 activation energy 또한 증가하는 것을 알 수 있었다.

산소 플라즈마를 이용하여 원거리 플라즈마 원자층 증착법으로 형성된 하프늄 옥사이드 게이트 절연막의 특성 연구 (Characteristics of Hafnium Oxide Gate Dielectrics Deposited by Remote Plasma-enhanced Atomic Layer Deposition using Oxygen Plasma)

  • 조승찬;전형탁;김양도
    • 한국재료학회지
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    • 제17권5호
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    • pp.263-267
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    • 2007
  • Hafnium oxide $(HfO_2)$ films were deposited on Si(100) substrates by remote plasma-enhanced atomic layer deposition (PEALD) method at $250^{\circ}C$ using TEMAH [tetrakis(ethylmethylamino)hafnium] and $O_2$ plasma. $(HfO_2)$ films showed a relatively low carbon contamination of about 3 at %. As-deposited and annealed $(HfO_2)$ films showed amorphous and randomly oriented polycrystalline structure. respectively. The interfacial layer of $(HfO_2)$ films deposited using remote PEALD was Hf silicate and its thickness increased with increasing annealing temperature. The hysteresis of $(HfO_2)$ films became lower and the flat band voltages shifted towards the positive direction after annealing. Post-annealing process significantly changed the physical, chemical, and electrical properties of $(HfO_2)$ films. $(HfO_2)$ films deposited by remote PEALD using TEMAH and $O_2$ plasma showed generally improved film qualities compare to those of the films deposited by conventional ALD.

Atomic Layer Deposition으로 증착된 Al-doped ZnO Film의 전기적, 구조적 및 광학적 특성 분석 (Electrical, Structural and Optical Characteristic Analysis of Al-doped ZnO Film Deposited by Atomic Layer Deposition)

  • 임정수;정광석;신홍식;윤호진;양승동;김유미;이희덕;이가원
    • 한국전기전자재료학회논문지
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    • 제24권6호
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    • pp.491-496
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    • 2011
  • Al-doped ZnO film on glass substrate is deposited by ALD in low temperature, using 4-step process (DEZ-$H_2O$-TMA-$H_2O$). To find out the optimal film condition for TCO material, we fabricate Al-doped ZnO films by increasing Al doping concentration at $100^{\circ}C$, so that the Al-doped film of 5 at% shows the lowest resistivity ($1.057{\times}10^{-2}{\Omega}{\cdot}cm$) and the largest grain size (38.047 nm). Afterwards, the electrical and physical characteristics in Al-doped films of 5 at% are also compared in accordance with increasing deposition temperature. All the films show the optical transmittance over 80% and the film deposited at $250^{\circ}C$ demonstrates the superior resistivity ($1.237{\times}10^{-4}{\Omega}{\cdot}cm$).

Highly Efficient Flexible Perovskite Solar Cells by Low-temperature ALD Method

  • Kim, Byeong Jo;Kwon, Seung Lee;Jung, Hyun Suk
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2014년도 제46회 동계 정기학술대회 초록집
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    • pp.469.2-469.2
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    • 2014
  • All-solid-state solar cell based on Chloride doped organometallic halide perovskite, (CH3NH3)PbIxCl3-x, has achieved a highly power conversion efficiency (PCE) to over 15% [1] and further improvements are expected up to 20% [2]. In this way, solar cells using novel light absorbing perovskite material are actively being studied as a next generation solar cells. However, making solution-process require high temperature up to $500^{\circ}C$ to form compact hole blocking layer and sinter the mesoporous oxide scaffold layer. Because of this high temperature process, fabrication of flexible solar cells on plastic substrate is still troubleshooting. In this study, we fabricated highly efficient flexible perovskite solar cells with PCE in excess of 11%. Atomic layer deposition (ALD) is used to deposit dense $TiO_2$ as hole blocking layer on ITO/PEN substrate. The all fabrication process is done at low temperature below $150^{\circ}C$. This work shows that one of the important blueprint for commercial use of perovskite solar cells.

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The Effect of Thickness on Flexible, Electrical and Optical properties of Ti- ZnO films on Flexible Glass by Atomic Layer Deposition

  • 이우재;윤은영;권세훈
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2016년도 제50회 동계 정기학술대회 초록집
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    • pp.196.1-196.1
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    • 2016
  • TCO(Transparent Conducting Oxide) on flat glass is used in thin-film photovoltaic cell, flat-panel display. Nowadays, Corning(R) Willow Glass(R), known as flexible substrate, has attracted much attention due to its many advantages such as reliable roll-to-roll glass processing, high-quality flexible electronic devices, high temperature process. Also, it can be an alternative to flexible polymer substrates which have their poor stability and degradation of electrical and optical qualities. For application on willow glass, the flexibility, electrical, optical properties can be greatly influenced by the TCO thin film thickness due to the inherent characterization of thin film in nanoscale. It can be expected that while thick TCO layer causes poor transparency, its sheet resistance become low. Also, rarely reports were focusing on the influence of flexible properties by varying TCO thickness on flexible glass. Therefore, it is very important to optimize TCO thickness on flexible Willow glass. In this study, Ti-ZnO thin films, with different thickness varied from 0 nm to 50 nm, were deposited on the flexible willow glass by atomic layer deposition (ALD). The flexible, electrical and optical properties were investigated, respectively. Also, these properties of Ti-doped ZnO thin films were compared with un-doped ZnO thin film. Based on the results, when Ti-ZnO thin films thickness increased, resistivity decreased and then saturated; transmittance decreased. The Figure of Merit (FoM) and flexibility was the highest when Ti-ZnO thickness was 40nm. The flexible, electrical and optical properties of Ti-ZnO thin films were better than ZnO thin film at the same thickness.

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ZnS:Cu,Cl 형광체의 특성에 미치는 원자층 증착 초박막 HfO2의 영향 (Effect of Ultrathin Film HfO2 by Atomic Layer Deposition on the Propreties of ZnS:Cu,Cl Phosphors)

  • 김민완;한상도;김형수;김혁종;김휴석;김석환;이상우;최병호
    • 한국재료학회지
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    • 제16권4호
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    • pp.248-252
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    • 2006
  • An investigation is reported on the coating of ZnS:Cu,Cl phosphors by $HfO_2$ using atomic layer deposition method. Hafnium oxide films were prepared at the chamber temperature of $280^{\circ}C$ using $Hf[N(CH_3)_2]_4\;and\;O_2$ as precursors and reactant gas, respectively. XPS and ICP-MS analysis showed the surface composition of coated phosphor powder was hafnium oxide. In FE-SEM analysis, the surface morphology of uncoated phosphors became smoother and clearer as the number of ALD cycle increased from 900 to 1800. The photoluminescence intensity for coated phosphors showed $7.3{\sim}13.4%$ higher than that of uncoated. The effect means that the reactive surface is uniformly coated with stable hafnium oxide to reduce the dead surface layer without change of bulk properties and also its absorptance is almost negligible due to ultrathin(nano-scaled) films. The growth rate is about $1.1{\AA}/cycle$.

Enhancement of Electrochemical Activity of Ni-rich LiNi0.8Mn0.1Co0.1O2 by Precisely Controlled Al2O3 Nanocoatings via Atomic Layer Deposition

  • Ramasamy, Hari Vignesh;Sinha, Soumyadeep;Park, Jooyeon;Gong, Minkyung;Aravindan, Vanchiappan;Heo, Jaeyeong;Lee, Yun-Sung
    • Journal of Electrochemical Science and Technology
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    • 제10권2호
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    • pp.196-205
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    • 2019
  • Ni-rich layered oxides $Li(Ni_xCo_yMn_z)O_2$ (x + y + z = 1) have been extensively studied in recent times owing to their high capacity and low cost and can possibly replace $LiCoO_2$ in the near future. However, these layered oxides suffer from problems related to the capacity fading, thermal stability, and safety at high voltages. In this study, we use surface coating as a strategy to improve the thermal stability at higher voltages. The uniform and conformal $Al_2O_3$ coating on prefabricated electrodes using atomic layer deposition significantly prevented surface degradation over prolonged cycling. Initial capacity of 190, 199, 188 and $166mAh\;g^{-1}$ is obtained for pristine, 2, 5 and 10 cycles of ALD coated samples at 0.2C and maintains 145, 158, 151 and $130mAh\;g^{-1}$ for high current rate of 2C in room temperature. The two-cycle $Al_2O_3$ modified cathode retained 75% of its capacity after 500 cycles at 5C with 0.05% capacity decay per cycle, compared with 46.5% retention for a pristine electrode, at an elevated temperature. Despite the insulating nature of the $Al_2O_3$ coating, a thin layer is sufficient to improve the capacity retention at a high temperature. The $Al_2O_3$ coating can prevent the detrimental surface reactions at a high temperature. Thus, the morphology of the active material is well-maintained even after extensive cycling, whereas the bare electrode undergoes severe degradation.

ALD법으로 증착한 ZnO 박막의 열처리 분위기에 따른 구조적, 전기적 특성 비교 (Comparison of Nitrogen and Oxygen Annealing Effects on the Structural, Optical and Electrical Properties of ALD-ZnO Thin Films)

  • 박연규;박안나;이종무
    • 한국재료학회지
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    • 제15권8호
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    • pp.514-517
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    • 2005
  • Effects of nitrogen and oxygen annealing on the carrier concentration, carrier mobility, electrical resistivity and PL characteristics as well as the crystallinity of ZnO films deposited on sapphire substrates by atomic layer deposition (ALD). X-ray diffraction (XRD), Scanning electron microscope (SEM), photoluminescence (PL) analyses, and Hall measurement were performed to investigate the crystallinity, optical properties and electrical properties of the ZnO thin films, respectively. According to the XRD analysis results the crystallinity of the ZnO film annealed in an oxygen atmosphere is better than that of the ZnO film annealed in a nitrogen atmosphere. Annealing undoped ZnO films grown by ALD at a high temperature above $600^{\circ}C$ improves the crystallinity and enhances W emission but deteriorates the electrical conductivity of the flms. The resistivity of the ZnO film annealed particularly at $800^[\circ}C$ in a nitrogen atmosphere is much higher than that annealed at the same temperature in an oxygen atmosphere.

플라즈마 원자층 증착법을 이용한 구리배선용 텅스텐 나이트라이드 확산 방지막의 특성 평가 (Tungsten Nitride Diffusion Barrier with Using Plasma Atomic Layer Deposition for Copper Interconnection)

  • 박지호;심현상;김용태;김희준;장호정
    • 한국산학기술학회:학술대회논문집
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    • 한국산학기술학회 2004년도 추계학술대회
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    • pp.195-198
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    • 2004
  • 실리콘 산화막 위에 구리 확산 방지막으로서 W-N 박막을 $NH_3$ 펄스 플라즈마를 이용한 원자층 증착방법으로 형성하였다. 플라즈마 원자층 증착방법 (PPALD)은 일반적인 원자층 증착방법(ALD)의 성장 기구를 그대로 따라 간다. 그러나 일반적인 ALD 방법에 의해 증착한 W-N 박막에 비해 PPALD 방법으로 증착한 W-N 박막은 F 함유량과 비저항이 감소하였고 열적 안정성에 대한 특성도 향상되었다. 또한 $WF_6$ 가스는 실리콘 산화막과 반응을 하지 않기 때문에 $WF_6$ 가스와 $NH_3$ 가스를 사용해서 ALD 증착방법으로 실리콘 산화막 위에 W-N 박막을 증착하기 어려운 문제점(8,9)을 $NH_3$ 반응종으로 실리콘 산화막 표면을 먼저 변형시켜 $WF_6$ 가스가 산화막과 반응을 할 수 있게 함으로써 ALD 방법으로 W-N 박막을 실리콘 산화막 위에 증착 할 수 있었다.

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$Ar^+$ RF 플라즈마 처리조건이 임베디드 PCB내 전극 Cu박막과 ALD $Al_2O_3$ 박막 사이의 계면파괴에너지에 미치는 영향 (Effect of $Ar^+$ RF Plasma Treatment Conditions on Interfacial Adhesion Energy Between Cu and ALD $Al_2O_3$ Thin Films for Embedded PCB Applications)

  • 박성철;이장희;이정원;이인형;이승은;송병익;정율교;박영배
    • 마이크로전자및패키징학회지
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    • 제14권1호
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    • pp.61-68
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    • 2007
  • 임베디드 PCB 기판내 유전체 재료인 Atomic Layer Deposition(ALD) $Al_2O_3$ 박막과 전극재료인 스퍼터 증착된 Cu박막 사이의 계면접착력을 $90^{\circ}$ 필 테스트방법으로 측정하여 순수 빔 굽힘을 가정한 에너지 평형 해석을 통하여 계면파괴에너지를 구하였다. $Cu/Al_2O_3$의 계면파괴에너지(${\Gamma}$)는 매우 약하여 측정할 수 없었으나, 접착력 향상층 Cr 박막을 삽입하여 $Cr/Al_2O_3$의 계면파괴에너지는 $10.8{\pm}5.5g/mm$를 얻었다. $Al_2O_3$ 표면에 $0.123W/cm^2$ 의 power density로 2분간 $Ar^+$ RF 플라즈마 전처리를 하고 Cr박막을 삽입한 $Cr/Al_2O_3$ 계면파괴에너지는 $39.8{\pm}3.2g/mm$으로 매우 크게 증가하였는데, 이는 $Ar^+$ RF 플라즈마 전처리에 따른 mechanical interlocking효과와 Cr-O 화학결합 효과가 동시에 기여한 것으로 생각된다.

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