• 한국진공학회지
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• 제7권s1호
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• pp.183-189
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• 1998

A new computer simulation method for film growth, the kinetic Monte Carlo simulation in combination with the results obtained from molecular dynamics simulation for the transient process induced by deposited atoms, was developed. The behavior of energetic atom in Au/Au(100) thin film deposition was investigated by the method. The atomistic mechanism of energetic atom deposition that led to the smoothness enhancement and the relationship between the role of transient process and film growth mechanism were discussed. We found that energetic atoms cannot affect the film growth mode in layer-by-layer at high temperature. However, at temperature of film growth in 3-dimensional mode and in quasi-two-dimensional mode, energetic atoms can enhance the smoothness of film surface. The enhancement of smoothness is caused by the transient mobility of energetic atoms and the suppression for the formation of 3-dimensional islands.

• 한국진공학회지
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• 제12권4호
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• pp.263-268
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• 2003

차세대 반도체 및 디스플레이 소자에 적용되는 실리콘 질화막은 정확한 두께 제어와 우수한 물성을 필요로 한다. 본 연구에서는 우수한 특성의 실리콘 질화막을 형성하기 위해 Si 원료물질로 $SiC1_4$, N 원료물질로 $NH_3$을 사용하고 $500^{\circ}C$에서 $600^{\circ}C$ 온도구간에서 batch-type 장비를 이용하여 원자층 증착 방법으로 박막을 형성하고 증착된 박막의 특성을 살펴보았다. Batch-type 장비를 사용한 박막의 증착은 표면반응에 의한 균일한 원자층 증착임을 확인하였으며, 증착 cycle의 횟수를 조절하여 원하는 두께의 박막을 형성할 수 있었다. 원자층 증착된 박막의 조성, 굴절률 및 습식각 속도를 기존의 저압화학증착 방법에 의해 증착된 박막과 비교한 결과, 원자층 증착 방법을 사용하여 기존의 방법보다 증착온도를 $250^{\circ}C$ 이상 낮추면서도 유사한 물성을 가진 박막을 형성할 수 있음을 확인하였다. Pyridine을 촉매로 첨가하여 원자층 증착한 박막의 경우에는 증착속도를 50% 가량 향상시킬 수 있었으나 박막의 구조가 불안정하여 쉽게 산화되므로 반도체나 디스플레이 소자 제조에 적용하기에는 부적절한 것으로 판단된다.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2016년도 제50회 동계 정기학술대회 초록집
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• pp.421.1-421.1
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• 2016

We studied indium-doped zinc oxide (IZO) film grown by atomic layer deposition (ALD) as transparent conductive oxide (TCO). A variety of TCO layer, such as ZnO:Al (AZO), InSnO2(ITO), Zn (O,S) etc, has been grown by various method, such as ALD, chemical vapor deposition (CVD), sputtering, laser ablation, sol-gel technique, etc. Among many deposition methods, ALD has various advantages such as uniformity of film thickness, film composition, conformality, and low temperature deposition, as compared with other techniques. In this study, we deposited indium-doped zinc oxide thin films using diethyl[bis(trimethylsilyl)amido]indium [Et2InN(TMS)2] as indium precursor, DEZn as zinc precursor and H2O as oxidant for ALD and investigated the optical and electrical properties of IZO films. As an alternative, this liquid In precursor would has several advantages in indium oxide thin-film processes by ALD, especially for low resistance indium oxide thin film and high deposition rate as compared to InCp, InCl3, TMIn precursors etc. We found out that Indium oxide films grown by Et2InN(TMS)2 and H2O precursor show ALD growth mode and ALD growth window. We also found out the different growth rate of Indium oxide as the substrate and investigated the effect of the substrate on Indium oxide growth.

• JSTS:Journal of Semiconductor Technology and Science
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• 제5권2호
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• pp.120-126
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• 2005

We have proposed a characteristic method to estimate real composition when multi component oxide films are deposited by ALD. Final atomic concentration ratio was theoretically calculated from the film densities and growth rates for $HfO_2$ and $Al_2O_3$ using ALD processed HfxAhOz mms.W e have transformed initial source feeding ratio during deposition to fins] atomic ratio in $Hf_xAl_yO_z$ films through thickness factors ($R_{HFO_2}$ ami $R_{Al_2O_3}$) ami concentration factor(C) defined in our experiments. Initial source feeding ratio could be transformed into the thickness ratio by each thickness factor. Final atomic ratio was calculated from thickness ratio by concentration factor. It has been successfully confirmed that the predicted atomic ratio was in good agreement with the actual measured value by ICP-MS analysis.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2005년도 International Meeting on Information Displayvol.I
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• pp.496-498
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• 2005

We reported that high dielectric hafnium oxide nano-film deposited by thermal atomic layer deposition on the poly-silicon film (poly-Si). The poly -Si film was produced by plasma enhanced chemical vapor deposition and excimer laser annealing. We used the hafniu m chloride ($HfCl_4$) and water as the precursors and analyzed the hafnium oxide film by transmission electron microscope and secondary ion mass spectrometer. Hafnium oxide produced by the ALD method showed very good coverage on the rough surface of poly-Si film. While deposited with 200 cycles, these hafnium oxide films revealed a relatively smooth surface and good uniformity, but the cumulative roughness produced by the incomplete reaction was apparent when the amount of deposition cycle increased to 600 cycles.

• 한국재료학회:학술대회논문집
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• 한국재료학회 2009년도 춘계학술발표대회
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• pp.22.2-22.2
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• 2009

Currently, metal silicides become increasingly more essential part as a contact material in complimentary metal-oxide-semiconductor (CMOS). Among various silicides, NiSi has several advantages such as low resistivity against narrow line width and low Si consumption. Generally, metal silicides are formed through physical vapor deposition (PVD) of metal film, followed by annealing. Nanoscale devices require formation of contact in the inside of deep contact holes, especially for memory device. However, PVD may suffer from poor conformality in deep contact holes. Therefore, Atomic layer deposition (ALD) can be a promising method since it can produce thin films with excellent conformality and atomic scale thickness controllability through the self-saturated surface reaction. In this study, Ni thin films were deposited by thermal ALD using bis(dimethylamino-2-methyl-2-butoxo)nickel [Ni(dmamb)2] as a precursor and NH3 gas as a reactant. The Ni ALD produced pure metallic Ni films with low resistivity of 25 $\mu{\Omega}cm$. In addition, it showed the excellent conformality in nanoscale contact holes as well as on Si nanowires. Meanwhile, the Ni ALD was applied to area-selective ALD using octadecyltrichlorosilane (OTS) self-assembled monolayer as a blocking layer. Due to the differences of the nucleation on OTS modified surfaces toward ALD reaction, ALD Ni films were selectively deposited on un-coated OTS region, producing 3 ${\mu}m$-width Ni line patterns without expensive patterning process.

• 한국분말재료학회지
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• 제29권4호
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• pp.309-313
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• 2022

In this study, additive manufacturing of a functionally graded material (FGM) as an alternative to joining dissimilar metals is investigated using directed energy deposition (DED). FGM consists of five different layers, which are mixtures of austenitic stainless steel (type 316 L) and low-alloy steel (LAS, ferritic steel) at ratios of 100:0 (A layer), 75:25 (B layer), 50:50 (C layer), 25:75 (D layer), and 0:100 (E layer), respectively, in each deposition layer. The FGM samples are successfully fabricated without cracks or delamination using the DED method, and specimens are characterized using optical and scanning electron microscopy to monitor their microstructures. In layers C and D of the sample, the tensile strength is determined to be very high owing to the formation of ferrite and martensite structures. However, the elongation is high in layers A and B, which contain a large fraction of austenite.

• Archives of Metallurgy and Materials
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• 제64권2호
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• pp.607-611
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• 2019

Thermal/cold spray deposition were used for additive manufacture of oxide dispersion strengthened (ODS) steel layers. Mechanically alloyed F/M ODS steel powders (Fe(bal.)-10Cr-1Mo-0.25Ti-0.35Y2O3 in wt.%) were sprayed by a high velocity oxygen fuel (HVOF) and cold spray methods. HVOF, as a thermal method, was used for manufacturing a 1 mm-thick ODS steel layer with a ~95% density. The source to objective distance (SOD) and feeding rate were controlled to achieve sound manufacturing. Y₂Ti₂O₇ nano-particles were preserved in the HVOF sprayed layer; however, unexpected Cr₂O₃ phases were frequently observed at the boundary area of the powders. A cold spray was used for manufacturing the Cr₂O₃-free layer and showed great feasibility. The density and yield of the cold spray were roughly 80% and 45%, respectively. The softening of ODS powders before the cold spray was conducted using a tube furnace of up to 1200℃. Microstructural characteristics of the cold sprayed layer were investigated by electron back-scattered diffraction (EBSD), the uniformity of deformation amount inside powders was observed.

• 반도체디스플레이기술학회지
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• 제20권4호
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• pp.157-160
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• 2021

As an insulator for a thin film transistor(TFT) and an encapsulation material of organic light emitting diode(OLED), aluminum oxide (Al₂O₃) has been widely studied using several technologies. Especially, in spite of low deposition rate, atomic layer deposition (ALD) has been used as a process method of Al₂O₃ because of its low process temperature and self-limiting reaction. In the Al₂O₃ deposition by ALD method, Ar Purge had some crucial effects on the film properties. After reaction gas is injected as a formation of pulse, an inert argon(Ar) purge gas is injected for gas desorption. Therefore, the process parameter of Ar purge gas has an influence on the ALD deposited film quality. In this study, Al₂O₃ was deposited on glass substrate at a different Ar purge time and its structural characteristics were investigated and analyzed. From the results, the growth rate of Al₂O₃ was decreased as the Ar purge time increases. The surface roughness was also reduced with increasing Ar purge time. In order to obtain the high quality Al₂O₃ film, it was known that Ar purge times longer than 15 sec was necessary resulting in the self-limiting reaction.

• Korean Chemical Engineering Research
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• 제49권3호
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• pp.357-360
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• 2011

플라즈마 원자층증착 방법을 이용하여 질소를 도핑한 산화아연 나노박막을 Si(111) 기판에 제조하였다. $Zn(C_{2}H_{5})_{2}$, $O_{2}$ 및 $N_{2}$을 사용하여 rf 파워 세기를 50-300 W로 변화시키면서 N-doped ZnO 박막을 제조하였다. 박막의 구조적 광학적 전기적 특성을 각각 XRD, PL, Hall 효과를 측정하여 분석하였다. 플라즈마 rf 파워가 증가함에 따라 ZnO 나노 박막 내의 질소(N) 함유 농도가 높아지고, p형 ZnO의 특성을 보였다.