Hafnium Oxide Nano-Film Deposited on Poly-Si by Atomic Layer Deposition

  • Wei, Hung-Wen (Electronics Research & Service Organization, Industrial Technology Research Institute) ;
  • Ting, Hung-Che (Electronics Research & Service Organization, Industrial Technology Research Institute) ;
  • Chang, Chung-Shu (Electronics Research & Service Organization, Industrial Technology Research Institute)
  • Published : 2005.07.19

Abstract

We reported that high dielectric hafnium oxide nano-film deposited by thermal atomic layer deposition on the poly-silicon film (poly-Si). The poly -Si film was produced by plasma enhanced chemical vapor deposition and excimer laser annealing. We used the hafniu m chloride ($HfCl_4$) and water as the precursors and analyzed the hafnium oxide film by transmission electron microscope and secondary ion mass spectrometer. Hafnium oxide produced by the ALD method showed very good coverage on the rough surface of poly-Si film. While deposited with 200 cycles, these hafnium oxide films revealed a relatively smooth surface and good uniformity, but the cumulative roughness produced by the incomplete reaction was apparent when the amount of deposition cycle increased to 600 cycles.

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