• 한국진공학회지
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• 제17권5호
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• pp.426-434
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• 2008

고밀도 유도결합 플라즈마 장치의 $SiH_4/O_2/Ar$방전에 대한 공간 평균 시뮬레이터를 제작하였다. 제작된 시뮬레이터는 $SiH_4/O_2/Ar$ 플라즈마 방전에서 발생되는 전자, 양이온, 음이온, 중성종, 그리고 활성종들에 대해 공간 평균한 유체 방정식을 기반으로 하고 있으며, 전자가열 모델은 anomalous skin effect를 고려한 파워 흡수 모델을 적용하여 전자가 흡수하는 고주파 파워량을 결정하였다. 완성된 시뮬레이터에서 RF-파워와 압력 변화에 대한 하전입자, 중성종, 활성종들의 밀도 변화 및 전자 온도 의존성을 계산하였다.

• 한국안전학회지
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• 제9권3호
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• pp.53-59
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• 1994

Hydrogen(H$_2$) is used in the semiconductor industries, and some oxidizing gases such as fluoride(F$_2$) and chlorine trifluoride(CIF$_3$) are also used. As F$_2$and CIF$_3$are highly oxidizing gases, it were supposed to react vigorously with H$_2$. In this study, the flammability limit of F$_2$/$H_2$/Ar and CIF$_3$/$H_2$/Ar mixtures were investigated experimentally. As a result, it was found that the diluted F$_2$gas could be spontaneously ignited as compared to CIF$_3$mixture gas while being mixed with the diluted H$_2$gas. However, CIF$_3$diluted gas was not able to ignite spontaneously except for an electric spark. And the combustion characteristics and reaction kinetics were shown at the different diluted gases by the flammability diagram analyses between the F$_2$/$H_2$/Ar and CIF$_3$/$H_2$/Ar.

• 대한전기학회논문지:전기물성ㆍ응용부문C
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• 제48권9호
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• pp.616-621
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• 1999

A planar inductively coupled $CH_4/H_2/Ar$plasma was used to investigate dry etch characteristics of GaN as a function of input power, RF bias power, and etch gas composition. Etch rate of GaN increased with input power up to 600 W and was saturated at the higher power. Also, the etch rates increased with increasing RF bias power, composition of $CH_4$ and Ar gas. We achieved the maximum etch rate of $930{\AA}$/min at the input power 400 W, RF bias power 250 W, and operational pressure 10 mTorr. This paper shows that smooth etched surface having roughness less than 1 nm in rms can be obtained by using planar inductively coupled plasma with $CH_4/H_2/Ar$ gas chemistry.

• 한국표면공학회:학술대회논문집
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• 한국표면공학회 2006년도 춘계학술발표회 초록집
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• pp.133-133
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• 2006

• 반도체디스플레이기술학회지
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• 제9권1호
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• pp.35-40
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• 2010

We have investigated the effects of hydrogen injection via in-situ gas addition ($O_2$, $H_2$, or $O_2$ + $H_2$ gas) and plasma post-treatment (Ar or Ar + H plasma) on material properties of ZnO that is considered to be as a channel layer in transparent thin film transistors. The variations in the electrical resistivity, optical transmittance and bandgap energy, and crystal quality of ZnO thin films were characterized in terms of the methods and conditions used in hydrogen injection. The resistivity was significantly decreased by injection of hydrogen; approximately $10^6\;{\Omega}cm$ for as-grown, $1.2\;{\times}\;10^2\;{\Omega}cm$ for in-situ with $O_2/H_2\;=\;2/3$ addition, and $0.1\;{\Omega}cm$ after Ar + H plasma treatment of 90 min. The average transmittance of ZnO films measured at a wavelength of 400-700 nm was gradually increased by increasing the post-treatment time in Ar + H plasma. The optical bandgap energy of ZnO films was almost monotonically increased by decreasing the $O_2/H_2$ ratio in in-situ gas addition or by increasing the post-treatment time in Ar + H plasma, while the post-treatment using Ar plasma hardly affected the bandgap energy. The role of hydrogen in ZnO was discussed by considering the creation and annihilation of oxygen vacancies as well as the formation of shallow donors by hydrogen.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2005년도 International Meeting on Information Displayvol.II
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• pp.1211-1214
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• 2005

One of the important problems in recent AC-PDP technology is high efficiency. In this research, we have been investigated electro-optical characteristics of MgO protective layer after radio frequency(RF) plasma treatment using Ar, $O_2$, and $H_2$ gases. The breakdown voltage order was $O_2$ > Ar > Nontreatment > $H_2$. Also, brightness order was $O_2$ > Ar > Non-treatment > $H_2$. In this experiment, the best result was obtained after $O_2-plasma$ treatment.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2009년도 추계학술대회 논문집
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• pp.192-192
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• 2009

AZO films were prepared by $Ar:H_2$ gas RF magnetron sputtering system with a AZO (2wt% $Al_2O_3$) ceramic target at a low temperature of $100^{\circ}C$. To investigate the influence of $H_2$ flow ratio on the properties of AZO films, $H_2$ flow ratio was changed from 0.5% to 2%. As a result, the AZO films deposited with 1% $H_2$ addition showed electrical properties with a resistivity of $5.06{\times}10^{-3}{\Omega}cm$. The spectrophotometer-measurements showed the transmittance of 86.5% was obtained by the film deposited with $H_2$ flow ratio of 1% in the range of 940nm for GaAs/GaAlAs LED.

• 대한전기학회논문지:전기물성ㆍ응용부문C
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• 제49권4호
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• pp.203-209
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• 2000

This paper proposes the improvement of the etch rate of GaN using a magnetized inductively coupled $CH_4/H_2/Ar$plasma. The gradient magnetic field with the axial direction is investigated using Gauss-meter and the ion current density is measured using double Langmuir probe. The applied magnetic field changes the ion current density profile in the radial direction, resulting in producing the higher density in the outer region than in the center. GaN dry etching process is carried out based on the measurements of the ion current density. The each rate of 2000 /min is achieved with $CH_4/H_2/Ar$ chemistries at 800 W input power, 250W rf bias power, 10 mTorr pressure and 100 gauss magnetic field.

• Journal of Welding and Joining
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• 제26권6호
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• pp.42-47
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• 2008

TIG welding enables to produce high quality weldment. However it has some problems such as shallow penetration and large distortion due to low penetration aspect ratio after welding. In order to overcome those problems, there are many ongoing studies on A-TIG welding, which use active flux. In this study, the effect of arc length and shield gas on penetration aspect ratio with melt-run welding on STS 304 6t, on which active flux was spreaded, was investigated. Arc length was changed from 1mm to 3mm, and aspect ratio became higher as arc length was decreased in this range. 100% Ar gas, Ar-$H_2$ mixed gas, Ar-He mixed gas, and 100% He gas were used as shield gas in this study. When Ar-$H_2$ mixed gas, Ar-He mixed gas, and 100% He gas were applied, penetration and melting efficiency were both increased as compared with 100% Ar gas. Aspect ratio was the highest with Ar-2.5% $H_2$ mixed gas.

• 한국표면공학회지
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• 제37권3호
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• pp.164-168
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• 2004

Polycrystalline silicon thin films were deposited by inductively coupled plasma (ICP) assisted magnetron sputtering using a gas mixture of Ar and $H_2$ on a glass substrate at $250^{\circ}C$. At constant Ar mass flow rate of 10 sccm, the working pressure was changed between 10mTorr and 70mTorr with changing $H_2$ flow rate. The effects of RF power applied to ICP coil and $Ar/H_2$ gas mixing ratio on the properties of the deposited Si films were investigated. The crystallinity was evaluated by both X-ray diffraction and Raman spectroscopy. From the results of Raman spectroscopy, the crystallinity was improved as hydrogen mixing ratio was increased up to$ Ar/H_2$=10/16 sccm; the maximum crystalline fraction was 74% at this condition. When RF power applied to ICP coil was increased, the crystallinity was also increased around 78%. In order to investigate the surface roughness of the deposited films, Atomic Force Microscopy was used.