• 한국레이저가공학회:학술대회논문집
• /
• 한국레이저가공학회 2002년도 추계학술발표대회 논문개요집
• /
• pp.55-58
• /
• 2002

• 한국세라믹학회지
• /
• 제39권10호
• /
• pp.935-942
• /
• 2002

Ga 첨가된 ZnO(GZO) 박막을 5.7 wt%의 $Ga_2O_3$를 ZnO에 첨가된 세라믹 GZO 타켓을 사용하여 직류 마그넷 스퍼터에 의해 실온의 유리 기판위에 제작했다. 각각 질량이 서로 다른 Ne, Ar, Kr 가스의 다양한 전압(total gas pressure)에서 제작한 GZO 박막에 대하여, 타켓의 에로젼 영역(B영역)과 비에로젼 영역(A영역)에 대향하는 박막 영역의 전기적 특성을 조사했다. 가스 종류와 관계없이 B 영역의 대향부분은 비에로젼 영역과 비교해서, 홀 이동도와 캐리어 밀도의 감소에 의해 상대적으로 높은 비저항값을 보였다. Ne 가스를 사용한 경우, GZO 박막은 가장 높은 비저항값을 나타낸 반면, Kr 가스를 사용하여 제작한 GZO 박막은 상대적으로 가장 낮은 비저항값을 보였다. GZO 박막의 전기적 특성은 박막의 결정성에 크게 의존하고 있음을 알았으며 박막의 전기적 특성과 결정성의 저하를 일으키는 인자로서 성장중의 박막의 결정성에 크게 의존하고 있음을 알았으며 박막의 전기적 특성과 결정성의 저하를 일으키는 인자로서 성장중의 박막표면에 충돌하여 박막에 손상을 입히는 고에너지 입자를 들 수 있다. Ne, Ar, Kr 가스의 반사 중성 원자들의 에너지를 Monete Carlo simulation에 의한 계산한 결과는 실험 결과와 잘 일치함을 알 수 있었다.

• 대한전기학회논문지:전기물성ㆍ응용부문C
• /
• 제49권8호
• /
• pp.438-444
• /
• 2000

We report the effects of etch process parameters on the ohmic contact formation in the plasma etching of GaN. Planar inductively coupled plasma system with $CH_4/H_2/Ar$gas chemistry has been used as etch reactor. The contact resistance and the specific contact resistance have been investigated using transfer length method as a function of RF bias power and %Ar gas concentration in total flow rate. AES(Auger electron spectroscopy) analysis revealed that the etched GaN has nonstoichiometric Ga rich surface and was contaminated by carbon and oxygen. Especially large amount of carbon was detected at the sample etched for high bias power (or voltage) condition, where severe degradation of contact resistance was occurred. We achieved the low ohmic contact of $2.4{\times}10^{-3} {\Omega}cm^2$ specific contact resistance at the input power 400 W, RF bias power 150 W, and working pressure 10mTorr with 10 sccm $CH_4$, 15 sccm H2, 5 sccm Ar gas composition.

• 한국결정성장학회지
• /
• 제21권4호
• /
• pp.164-168
• /
• 2011

고이온밀도 플라즈마 식각에 의한 고종횡비, 고이방성을 갖는 ZnO, $SnO_2$ 나노 구조 가스 감응층 형성을 위하여 mask 재료들과의 식각 선택도를 조사하였다. $25BCl_3$/10Ar ICP 플라즈마에서는 ZnO와 Ni 간 5.1~6.1 범위의 식각 선택도가 확보된 반면에 Al의 경우 효율적인 식각 선택도를 확보할 수 없었다. $25CF_4$/10Ar ICP 플라즈마에서는 ZnO와 Ni 간에 7~17 범위의 높은 식각 선택도를 얻을 수 있었다. $SnO_2$는 $SnF_x$ 식각 생성물의 높은 휘발성에 기인하여 Ni에 비해 매우 높은 식각 속도를 나타내었고, 최고치 약 67의 매우 높은 식각 선택도를 확보하였다.

• 한국진공학회:학술대회논문집
• /
• 한국진공학회 2011년도 제40회 동계학술대회 초록집
• /
• pp.167-167
• /
• 2011

Magnetic random access memory (MRAM) is one of the prospective semiconductor memories for next generation. It has the excellent features including nonvolatility, fast access time, unlimited read/write endurance, low operating voltage, and high storage density. MRAM consists of magnetic tunnel junction (MTJ) stack and complementary metal-oxide semiconductor (CMOS). The MTJ stack is composed of various magnetic materials, metals, and a tunneling barrier layer. For the successful realization of high density MRAM, the etching process of magnetic materials should be developed. Among various magnetic materials, FePt has been used for pinned layer of MTJ stack. The previous etch study of FePt magnetic thin films was carried out using $CH_4/O_2/NH_3$. It reported only the etch characteristics with respect to the variation of RF bias powers. In this study, the etch characteristics of FePt thin films have been investigated using an inductively coupled plasma reactive ion etcher in various etch chemistries containing $CH_4$/Ar and $CH_4/O_2/Ar$ gas mixes. TiN thin film was employed as a hard mask. FePt thin films are etched by varying the gas concentration. The etch characteristics have been investigated in terms of etch rate, etch selectivity and etch profile. Furthermore, x-ray photoelectron spectroscopy is applied to elucidate the etch mechanism of FePt thin films in $CH_4$/Ar and $CH_4/O_2/Ar$ chemistries.

• 한국진공학회:학술대회논문집
• /
• 한국진공학회 2013년도 제44회 동계 정기학술대회 초록집
• /
• pp.387-387
• /
• 2013

Currently, the flash memory and the dynamic random access memory (DRAM) have been used in a variety of applications. However, the downsizing of devices and the increasing density of recording medias are now in progress. So there are many demands for development of new semiconductor memory for next generation. Magnetic random access memory (MRAM) is one of the prospective semiconductor memories with excellent features including non-volatility, fast access time, unlimited read/write endurance, low operating voltage, and high storage density. MRAM is composed of magnetic tunnel junction (MTJ) stack and complementary metal-oxide semiconductor (CMOS). The MTJ stack consists of various magnetic materials, metals, and a tunneling barrier layer. Recently, MgO thin films have attracted a great attention as the prominent candidates for a tunneling barrier layer in the MTJ stack instead of the conventional Al2O3 films, because it has low Gibbs energy, low dielectric constant and high tunneling magnetoresistance value. For the successful etching of high density MRAM, the etching characteristics of MgO thin films as a tunneling barrier layer should be developed. In this study, the etch characteristics of MgO thin films have been investigated in various gas mixes using an inductively coupled plasma reactive ion etching (ICPRIE). The Cl2/Ar, CH3OH/Ar, and CH4/Ar gas mix were employed to find an optimized etching gas for MgO thin film etching. TiN thin films were employed as a hard mask to increase the etch selectivity. The etch rates were obtained using surface profilometer and etch profiles were observed by using the field emission scanning electron microscopy (FESEM).

• 한국재료학회지
• /
• 제30권4호
• /
• pp.169-175
• /
• 2020

Silicon nitride thin films are deposited by RF (13.57 MHz) magnetron sputtering process using a Si (99.999 %) target and with different ratios of Ar/N₂ sputtering gas mixture. Corning G type glass is used as substrate. The vacuum atmosphere, RF source power, deposit time and temperature of substrate of the sputtering process are maintained consistently at 2 ~ 3 × 10^-3 torr, 30 sccm, 100 watt, 20 min. and room temperature, respectively. Cross sectional views and surface morphology of the deposited thin films are observed by field emission scanning electron microscope, atomic force microscope and X-ray photoelectron spectroscopy. The hardness values are determined by nano-indentation measurement. The thickness of the deposited films is approximately within the range of 88 nm ~ 200 nm. As the amount of N₂ gas in the Ar:N₂ gas mixture increases, the thickness of the films decreases. AFM observation reveals that film deposited at high Ar:N₂ gas ratio and large amount of N₂ gas has a very irregular surface morphology, even though it has a low RMS value. The hardness value of the deposited films made with ratio of Ar:N₂=9:1 display the highest value. The XPS spectrum indicates that the deposited film is assigned to non-stoichiometric silicon nitride and the transmittance of the glass with deposited SiO₂-Si_xN_y thin film is satisfactory at 97 %.

• Transactions on Electrical and Electronic Materials
• /
• 제10권3호
• /
• pp.93-96
• /
• 2009

The Al-doped ZnO (AZO) films were deposited on a glass substrate by RF magnetron sputtering in pure Ar and $Ar+H_2$ gas ambient at temperature of $100^{\circ}C$ and annealed in hydrogen ambient at the temperature range from 100 to 300 $^{\circ}C$, respectively. It was found that either the addition of hydrogen to the sputtering gas or the annealing treatment effectively reduced the resistivity of the AZO films. When the AZO films were annealed at the temperature of 300 $^{\circ}C$ for lhr in a hydrogen atmosphere, the resistivity decreased from $2.60{\times}10^{-3}\;{\Omega}cm$ to $8.42{\times}l0^{-4}\;{\Omega}cm$ for the film deposited in pure Ar gas ambient. Under the same annealing conditions of temperature and hydrogen ambient, the resistivity of AZO films deposited in the $Ar+H_2$ gas mixture decreased from $8.22{\times}l0^{-4}\;{\Omega}cm$ to $4.25{\times}l0^{-4}\;{\Omega}cm$. The lowest resistivity of $4.25{\times}l0^{-4}\;{\Omega}cm$ was obtained by adding hydrogen gas to the deposition and annealing process. X-ray diffraction (XRD) pattern of all films showed preferable growth orientation of (002) plane. The average transmittance is above 85 % and in the range of 400-1000 nm for all films.

• 한국분말재료학회지
• /
• 제11권1호
• /
• pp.16-21
• /
• 2004

The nano-sized Co particles were successfully synthesized by chemical vapor condensation (CVC) process using the precursor of cobalt carbonyl ($Co_2(CO)_8$). The influence of carrier gases on the microstructure and magnetic properties of nanoparticles was investigated by means of XRD, TEM, XPS and VSM. The Co nano-particles with different phases and shapes were synthesized with a change of carrier gas : long string morphologies with coexistence of fcc and hcp structure in Ar carrier gas condition; finer Co core in a mass of cobalt oxide with only fcc structure in He; rod type cobalt oxide phase in Ar＋6vol％$O_2$. The saturation magnetization and coercivity was lower in Co nanoparticles synthesized in He carrier gas, due to their finer size.

• 한국레이저가공학회지
• /
• 제10권4호
• /
• pp.1-6
• /
• 2007

This study includes the effects of shielding gas types and flow rate on Nd:YAG Laser weldability of sintered material. The types of shielding gas were evaluated for He, Ar and N2. Bending strength, porosity rate, hardness and aspect ratio testing of laser weld are carried out to evaluated the weldability. As a results, Ar gas was showed the best welding strength even it has the most porosity content on weld metal, and depend on increases the gas flow rate, it was not only got deeper penetration depth but also showed higher bending strength. Therefore we could know that bending strength is not only affect the porosity content but also melting area.