• Journal of the Korean Society for Heat Treatment
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• v.21 no.6
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• pp.293-299
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• 2008

In order to provide with fundamental data of the wrought Mg alloy for press forging, the effect of annealing temperature on the microstructure, texture development and tensile properties is studied in a commercial AZ31B Mg alloy sheet. Basal texture i.e. $(0001){\pm}5^{\circ}$[21$\bar{3}$0] is developed in a commercial AZ31B Mg sheet, and the texture is not changed considerably by annealing over $400^{\circ}C{\times}30min$, while (10$\bar{3}$0) component with high intensity can be observed due to abnormal grain growth. When the sheet is tensile-deformed with RD, $45^{\circ}$ and TD directions at room temperature, fracture strains are given by 25.8, 21.4 and 11.9% in the order of RD, $45^{\circ}$ and TD directions, respectively. With increasing annealing temperature up to $450^{\circ}C{\times}30min$, little change in mean grain size can be revealed by annealing below $300^{\circ}C{\times}30min$ but an abnormal grain growth, where some grains become significantly coarser than the rest, occurs by annealing above $400^{\circ}C{\times}30min$. The maximum tensile strain of around 25% is obtained by annealing below $300^{\circ}C{\times}30min$, but it is abruptly decreased to 16% by annealing above $400^{\circ}C{\times}30min$ owing to intergranular fracture of abnormal grown grains.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.61 no.11
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• pp.1646-1649
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• 2012

The $O_2$ annealing technique has considerably suppressed the leakage current of GaN power devices, but this forms NiO at Ni-based Schottky contact with increasing on-resistance. The purpose of the present study was to fabricate 1.5 kV GaN Schottky barrier diodes by improving $O_2$-annealing process and GaN buffer. The proposed $O_2$ annealing performed after alloying ohmic contacts in order to avoid NiO construction. The ohmic contact resistance ($R_C$) was degraded from 0.43 to $3.42{\Omega}-mm$ after $O_2$ annealing at $800^{\circ}C$. We can decrease RC by lowering temperature of $O_2$ annealing. The isolation resistance of test structure which indicated the surface and buffer leakage current was significantly increased from $2.43{\times}10^7$ to $1.32{\times}10^{13}{\Omega}$ due to $O_2$ annealing. The improvement of isolation resistance can be caused by formation of group-III oxides on the surface. The leakage current of GaN Schottky barrier diode was also suppressed from $2.38{\times}10^{-5}$ to $1.68{\times}10^{-7}$ A/mm at -100 V by $O_2$ annealing. The GaN Schottky barrier diodes achieved the high breakdown voltage of 700, 1400, and 1530 V at the anode-cathode distance of 5, 10, and $20{\mu}m$, respectively. The optimized $O_2$ annealing and $4{\mu}m$-thick C-doped GaN buffer obtained the high breakdown voltage at short drift length. The proposed $O_2$ annealing is suitable for next-generation GaN power switches due to the simple process and the low the leakage current.

• Transactions of Materials Processing
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• v.28 no.6
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• pp.354-360
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• 2019

The plastic strain ratio is one of the factors that affect the deep drawability of metal sheets. The plastic strain ratio of fully annealed Cu sheet is low because its texture has {001}<100>. In order to improve the deep drawability of Cu sheet, it is necessary to increase the plastic strain ratio of Cu sheet. This study investigate the increase of plastic strain ratio of a Cu sheet after the first asymmetry rolling and annealing, and the second asymmetry rolling and annealing in air and Ar gas conditions. The average plastic strain ratio (R_m) was 0.951 and |ΔR| value was 1.27 in the initial Cu sheet. After the second 30.1% asymmetric rolling and annealing of Cu sheet at 1000℃ in air condition, the average plastic strain ratio (R_m) was 1.03 times higher. However, |ΔR| was 0.12 times lower than that of the initial specimen. After the second 18.8% asymmetric rolling and annealing of Cu sheet at 630℃ in Ar gas condition, the average plastic strain ratio (R_m) was 1.68 times higher and |ΔR| was 0.82 times lower than that of the initial specimen. These results are attributed to the change of the texture of Cu sheet due to the different annealing conditions.

• Transactions on Electrical and Electronic Materials
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• v.5 no.2
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• pp.66-70
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• 2004

The Sr$\_$0.7/Bi$\_$2.3/Ta$_2$O$\_$9/(SBT)thin films are deposited on Pt-coated electrode (Pt/TiO$_2$/SiO$_2$/Si) using a RE magnetron sputtering method. The ferroelectric properties of SBT capacitors with annealing times were studied. As a result of conducting the X-ray diffraction analysis and the electron microscopy analysis, the perovskite phase began to grow from 10 minutes after annealing the specimen, and excellent crystallization was accomplished at 60 minutes after annealing the specimen. The remanet polarization (2P$\_$r/) value and the coercive electric field (E$\_$c/) of the SBT thin film specimen showed the most excellent characteristics at 60 minutes after annealing the specimen, which were approximately 12.40 C/$\textrm{cm}^2$ and 30 kV/cm, respectively. The leakage current density of the SBT thin film specimen as annealed for 60 minutes was approximately 2.81${\times}$10$\^$－9/A/$\textrm{cm}^2$.

• Applied Science and Convergence Technology
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• v.27 no.5
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• pp.100-104
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• 2018

Herein, we present the behavior of plasma-doped graphene upon high-temperature vacuum annealing. An ammonia plasma-treated graphene sample underwent vacuum annealing for 1 h at temperatures ranging from 100 to $500^{\circ}C$. According to Raman analysis, the structural healing of the plasma-treated sample is more pronounced at elevated annealing temperatures. The crystallite size of the plasma-treated sample increases from 13.87 to 29.15 nm after vacuum annealing. In addition, the doping level by plasma treatment reaches $2.2{\times}10^{12}cm^{-2}$ and maintains a value of $1.6{\times}10^{12}cm^{-2}$, even after annealing at $500^{\circ}C$, indicating high doping stability. A relatively large decrease in the pyrrolic bonding components is observed by X-ray photoelectron spectroscopy as compared to other configurations, such as pyridinic and amino bindings, after the annealing. This study indicates that high-vacuum annealing at elevated temperatures provides a method for the structural reorganization of plasma-treated graphene without a subsequent decrease in doping level.

• Advances in Energy Research
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• v.3 no.2
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• pp.117-124
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• 2015

In this paper, we have reported an enhancement in thermoelectric properties of un-doped zinc oxide (ZnO) grown by molecular beam epitaxy (MBE) on silicon (001) substrate by annealing treatment. The grown ZnO thin films were annealed in oxygen environment at $500^{\circ}C-800^{\circ}C$, keeping a step of $100^{\circ}C$ for one hour. Room temperature Seekbeck measurements showed that Seebeck coefficient and power factor increased from 222 to $510{\mu}V/K$ and $8.8{\times}10^{-6}$ to $2.6{\times}10^{-4}Wm^{-1}K^{-2}$ as annealing temperature increased from 500 to $800^{\circ}C$ respectively. This observation was related with the improvement of crystal structure of grown films with annealing temperature. X-ray diffraction (XRD) results demonstrated that full width half maximum (FWHM) of ZnO (002) plane decreased and crystalline size increased as the annealing temperature increased. Photoluminescence study revealed that the intensity of band edge emission increased and defect emission decreased as annealing temperature increased because the density of oxygen vacancy related donor defects decreased with annealing temperature. This argument was further justified by the Hall measurements which showed a decreasing trend of carrier concentration with annealing temperature.

• Proceedings of the IEEK Conference
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• 1998.10a
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• pp.1041-1044
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• 1998

In this paper the cellular neural networks with annealing capability is designed. The annealing capability helps the networks escape from the local-minimum points and quickly search for the global-minimum point. A 6$\times$6 CNN chip is designed using a $0.8\mu\textrm{m}$ CMOS technology, and the chip area is 2.89mm$\times$2.89mm. The simulation results for hole filling image processing show that the general CNN has a local-minimum problem, but the annealed CNN finds the global-minimum solutions very efficiently.

• Journal of the Korean Vacuum Society
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• v.2 no.4
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• pp.468-473
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• 1993

Damages on Si substrate induced by Ar ion implantation and it annealing behavior during rapid thermal annealing were investigated by the cross-sectional TEM (transmissin electron microscopy), RB(Rutherfordbackscattering) spectra an dthermal wave (TW) modulation reflectance methods. Continuous amorphous layer extending to the surface were generated by Ar ion implantation for higher doses than 1 $\times$1015cm-2. The recrystallization of the amorphous layer prodeeded as the annealing temperature increased . However the amorphous /crystal interfacial undulations caused the micro twins and damage clusters. Damage clusters generated by lower doses than 1 $\times$1015 cm-2 disappeared slowly as the annealing temperature increased, but even at 110$0^{\circ}C$ a few damage clusters still remained.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.11a
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• pp.107-108
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• 2007

In order to investigate the electrical properties of Hf-silicate as a function of annealing temperature, Hf-silicate deposited by atomic layer deposition (ALD) was studied. After Hf-silicate film deposition, annealing was proceeded at $500^{\circ}C\;and\;700^{\circ}C$. The hysteresis of C-V curves and trapping charge densities were decreased after annealing process. As annealing temperature became higher from $500^{\circ}C\;to\;700^{\circ}C$, the capacitance equivalent thickness (CET) was increased from 1.66 nm to 1.76 nm and the leakage current at -1 V was decreased from $1.70{\times}10^{-4}\;to\;5.68{\times}10^{-5}\;A/cm^2$.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2005.05a
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• pp.58-61
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• 2005

In an effort to improve the electrical properties of ZnO:Al transparent electrode films, post-annealing treatment in hydrogen atmosphere was attempted with varying annealing time at 573 K for compatibility with typical display device fabrication processes. It was observed that carrier concentrations and mobilities increased with longer annealing time with small changes in crystallinity. This resulted in substantial decrease in resistivity from $4.80{\times}10^{-3}$ to $8.30{\times}10^{-4}{\Omega}cm$ due to increased carrier concentration. Such improvements in electrical properties are attributed to the passivation of the grain boundary surfaces. The optical properties of the films, which changed in accordance with the Burstein-Moss effect, were consistent with the observed changes in electrical properties.