• 제목/요약/키워드: Annealing Process

검색결과 1,578건 처리시간 0.028초

혼합 유전 알고리즘을 이용한 GDP/MINLP로 표현된 공정 최적화 (Process Optimization Formulated in GDP/MINLP Using Hybrid Genetic Algorithm)

  • 송상옥;장영중;김구회;윤인섭
    • 제어로봇시스템학회논문지
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    • 제9권2호
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    • pp.168-175
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    • 2003
  • A new algorithm based on Genetic Algorithms is proposed f3r solving process optimization problems formulated in MINLP, GDP and hybrid MINLP/GDP. This work is focused especially on the design of the Genetic Algorithm suitable to handle disjunctive programming with the same level of MINLP handling capability. Hybridization with the Simulated Annealing is experimented and many heuristics are adopted. Real and binary coded Genetic Algorithm initiates the global search in the entire search space and at every stage Simulated Annealing makes the candidates to climb up the local hills. Multi-Niche Crowding method is adopted as the multimodal function optimization technique. and the adaptation of probabilistic parameters and dynamic penalty systems are also implemented. New strategies to take the logical variables and constraints into consideration are proposed, as well. Various test problems selected from many fields of process systems engineering are tried and satisfactory results are obtained.

수소 분위기에서 후열처리한 상온증착 ZnO:Al 박막의 전기적 특성 분석 (Analysis of Electrical Property of Room Temperature-grown ZnO:Al Thin films Annealed in Hydrogen Ambient)

  • 정윤환;진호;김호걸;박춘배
    • 한국전기전자재료학회논문지
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    • 제22권4호
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    • pp.318-322
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    • 2009
  • In this paper, to establish growth technology of ZnO:Al thin films at low temperature applied to photoelectronic devices, ZnO:Al were prepared by RF magnetron sputtering on glass substrate at room temperature using different RF power with subsequent annealing process at different temperature in $H_2$ ambient. The resistivity of hydrogen-annealed ZnO:Al thin film at temperature of $300^{\circ}C$ was reduced to $8.32{\times}10^{-4}{\Omega}cm$ from $9.44{\times}10^{-4}{\Omega}cm$ which was optimal value for as-grown films. X-ray photoelectron spectroscopy(XPS) revealed that improved electrical properties are ascribed to desorption of the negatively charged oxygen species from the grain boundary surfaces by the hydrogen annealing process.

Size-controlled Growth of Fe Nanoparticles in Gas Flow Sputtering Process

  • Sakuma, H.;Aoshima, H.;Ishii, K.
    • Journal of Magnetics
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    • 제11권3호
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    • pp.103-107
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    • 2006
  • In grain oriented electrical steel process, hot band annealing has thought to be essential for obtaining good magnetic properties. New hot rolling method of heavy reduction in early hot rolling stage was applied to obtain good magnetic properties in GO process without hot band annealing. Hot rolling was carried out by varyinghot rolling reduction distribution along hot rolling pass. The heavy hot rolling reduction in rear stand improves the magnetic flux density in the case of no hot band annealing. The hot band specimens of the heavy reduction in front stand shows the elongated hot deformed microstructures in the center layer and strong {001}<110> texture.On the contrary, the heavily reduced specimens in rear stand shows the recrystallization in the center layer of hot band and strong {111}<112> and {110}<001> textures.

RTA를 이용하여 수소 열처리한 실리콘 웨이퍼의 표면 및 근처의 변화 연구 (Investigation into the variation on Si wafer by RTA annealing in $H_2$ gas)

  • 정수천;이보영;유학도
    • 한국결정성장학회지
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    • 제10권1호
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    • pp.42-47
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    • 2000
  • 일반적인 쵸크랄스키(CZ)방법으로 성장된 실리콘 단결정봉(Ingot)을 가공하여 경면 연마한 후 RTA법으로 수소 분위기에서 열처리하여 실리콘 웨이퍼 표면 및 표면 근처의 특성 변화에 대하여 고찰하였다 수소 열처리를 통하여 표면의 COP (결정결함)가 현저히 감소하는 것을 확인하였고 깊이 5um까지의 영역에서도 결정결함의 밀도가 감소하였다. 또한 수소 열처리에 의해 실리콘 웨이퍼 표면이 에칭 및 실리콘의 재배열에 의해 형성되는 테라스(Terrace) 형태도 관찰되었다.

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대기압 플라즈마를 이용한 산화물 박막 트랜지스터 표면처리에 관한 연구 (The Study of Improvement in the Characteristics of Oxide Thin Film Transistor by using Atmospheric Pressure Plasma)

  • 김가영;김경남;염근영
    • 한국표면공학회지
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    • 제48권1호
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    • pp.7-10
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    • 2015
  • Recently, oxide TFTs has attracted a lot of interests due to their outstanding properties such as excellent environmental stability, high mobility, wide-band gap energy and high transparency, and investigated through the method using vacuum system and wet solution. In the case of the method using wet solution, process is very simple, however, annealing process should be included. In this study, to overcome the problem of annealing process, atmospheric pressure plasma was used for annealing, and the electrical characteristics such as on/off ration and mobility of device were investigated.

대기압 이상의 열처리 공정압력이 Cu2ZnSn(S,Se)4(CZTSSe) 박막 성장에 미치는 영향 (Effect of Annealing Process Pressure Over Atmospheric Pressure on Cu2ZnSn(S,Se)4 Thin Film Growth)

  • 이병훈;류혜선;장준성;이인재;김지훈;조은애;김진혁
    • 한국재료학회지
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    • 제29권9호
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    • pp.553-558
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    • 2019
  • $Cu_2ZnSn(S,Se)_4(CZTSSe)$ thin film solar cells areone of the most promising candidates for photovoltaic devices due to their earth-abundant composition, high absorption coefficient and appropriate band gap. The sputtering process is the main challenge to achieving high efficiency of CZTSSe solar cells for industrialization. In this study, we fabricated CZTSSe absorbers on Mo coated soda lime glass using different pressures during the annealing process. As an environmental strategy, the annealing process is performed with S and Se powder, without any toxic $H_2Se$ and/or $H_2S$ gases. Because CZTSSe thin films have a very narrow stable phase region, it is important to control the condition of the annealing process to achieve high efficiency of the solar cell. To identify the effect of process pressure during the sulfo-selenization, we experiment with varying initial pressure from 600 Torr to 800 Torr. We fabricate a CZTSSe thin film solar cell with 8.24 % efficiency, with 435 mV for open circuit voltage($V_{OC}$) and $36.98mA/cm^2$ for short circuit current density($J_{SC}$), under a highest process pressure of 800 Torr.

Negative-bias Temperature Instability 및 Hot-carrier Injection을 통한 중수소 주입된 게이트 산화막의 신뢰성 분석 (Reliability Analysis for Deuterium Incorporated Gate Oxide Film through Negative-bias Temperature Instability and Hot-carrier Injection)

  • 이재성
    • 한국전기전자재료학회논문지
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    • 제21권8호
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    • pp.687-694
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    • 2008
  • This paper is focused on the improvement of MOS device reliability related to deuterium process. The injection of deuterium into the gate oxide film was achieved through two kind of method, high-pressure annealing and low-energy implantation at the back-end of line, for the purpose of the passivation of dangling bonds at $SiO_2/Si$ interface. Experimental results are presented for the degradation of 3-nm-thick gate oxide ($SiO_2$) under both negative-bias temperature instability (NBTI) and hot-carrier injection (HCI) stresses using P and NMOSFETs. Annealing process was rather difficult to control the concentration of deuterium. Because when the concentration of deuterium is redundant in gate oxide excess traps are generated and degrades the performance, we found annealing process did not show the improved characteristics in device reliability, compared to conventional process. However, deuterium ion implantation at the back-end process was effective method for the fabrication of the deuterated gate oxide. Device parameter variations under the electrical stresses depend on the deuterium concentration and are improved by low-energy deuterium implantation, compared to conventional process. Our result suggests the novel method to incorporate deuterium in the MOS structure for the reliability.

PV 모듈 커버글라스 오염방지 코팅의 열처리 특성분석 (Characteristics of Annealing Properties of Anti-pollution Coatings for the Cover Glass of PV Module)

  • 정세진;임윤식;김정현;최원석
    • 전기학회논문지P
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    • 제66권4호
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    • pp.263-266
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    • 2017
  • In this study, the characteristics of anti-pollution coatings on glass substrates through annealing treatment were investigated. To investigate the change of properties by coating method and number of annealing treatment, after the anti-pollution coating was performed on the surface of glass substrate in three ways, the annealing treatment was performed by setting three kinds of annealing treatment conditions. The annealing treatment method is a torch using gas, which is advantage in that it can be installed directly on the site in an easy way compared with a annealing treatment process which is generally difficult. The anti-pollution properties, contact angle, transmittance, hardness, and adhesion of films on glass substrate were measured under 9 conditions of combination of coating methods and annealing treatment conditions. It was confirmed that as the number of annealing treatment increases, the anti-pollution property of the film synthesized on glass substrate becomes better.

$SnO_2$ 박막 특성에 미치는 annealing 효과 (Annealing Effect on $SnO_2$ Thin Films Properties)

  • 박경희;서용진;이우선;박진성
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2003년도 춘계학술대회 논문집 센서 박막재료 반도체 세라믹
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    • pp.99-102
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    • 2003
  • Tin dioxide thin films were deposited at $375^{\circ}C$ on alumina substrate by metal-organic chemical vapor deposition process to find the relationship between physicochemical properties and the annealing treatments. The small grains with heat treatments grew to the bunch of grains and then showed the hillocks on the film surface. The thickness decreased with annealing treatment. The measured binding energy (BE) and branching ratio of the Sn 3d spin-orbital doublet were typical of oxidized states of Sn and the BE of the O1s core level of about 530~530.65eV also confirmed the presence of O-Sn bonds. The BE of oxygen and tin with annealing treatment shifted to higher position. O/Sn atomic ratios of films deposited at $375^{\circ}C$ for 2min and 4min were 1.99 and 2.01, respectively. The value of the atomic ratio O/Sn of films deposited at $375^{\circ}C$ for 2min changed from 1.99 to 2.45 with annealing treatment. Gas sensitivity depended on annealing temperature, the sensitivity increased with increasing annealing temperature.

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비선형공정계획에서 가공순서 결정을 위한 시뮬레이티드 어닐링 알고리듬 (Simulated Annealing Algorithms for Operation Sequencing in Nonlinear Process Planning)

  • 이동호
    • 대한산업공학회지
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    • 제27권3호
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    • pp.315-327
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    • 2001
  • This paper considers the problem of operation sequencing in nonlinear process planning, which is the problem of selecting and sequencing operations required to produce a part with the objective of minimizing the sum of operation processing costs and machine, setup and tool change costs. Main constraints are the precedence relations among operations. The problem can be decomposed into two subproblems: operation selection and operation sequencing. We suggest four simulated annealing algorithms, which solve the two subproblems iteratively until a good solution is obtained. Here, the operation selection problem can be solved using a shortest path algorithm. Application of the algorithms is illustrated using an example. Also, to show the performances of the suggested algorithms, computational experiments were done on randomly generated test problems and the results are reported. In particular, one of the suggested algorithms outperforms an existing simulated annealing algorithm.

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