• Composites Research
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• 제35권6호
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• pp.431-438
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• 2022

전자 기기의 발달에 따라 발생하는 발열 문제를 해결하기 위해 높은 열전도도를 갖는 방열소재의 개발이 필요하다. 고분자 복합소재는 고분자의 장점과 열전도성 필러의 장점을 동시에 지녀 경량 방열소재로 각광받고 있다. 하지만, 산업적으로 요구되는 열전도도를 달성하기 위해서는 볼륨비로 60 이상의 고함량의 필러 충진이 요구되므로 최근에는 필러의 구조 제어를 통해 비교적 저함량의 필러 충진으로도 열 전달 경로를 최적화할 수 있는 연구들이 진행되고 있다. 본 리뷰에서는 고분자 복합소재 내 열전도성 이방성 필러의 구조를 제어해 비교적 적은 필러 함량으로 고열전도성 방열소재를 제작하는 다양한 전략을 소개하고자 한다.

• 한국재료학회지
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• 제10권3호
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• pp.184-190
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• 2000

비전도성 충진재를 포함한 개선된 이방성 전도 접착제의 열적/기계적 특성과 이를 이용한 유기 기판용 플립 칩의 신뢰성에 미치는 충진재 양의 영향을 고찰하였다. 비전도성 충진재 양이 다른 개선된 이방성 접착제의 특성을 살펴보기 위해 differential scanning calorimeter (DSC), thermo-gravimetric analyzer (TGA), dynamic mechanical analyzer (DMA), thermo-mechanical analyzer (TMA)을 사용하였다. 비전도성 충진재의 양이 증가함에 따라 열팽창계수는 감소하였고, 상온에서의 storage modulus는 증가하였다. 추가로, 충진재의 양이 증가하면 DSC에 의한 유리전이온도와 TMA에 의한 유리전이온도도 증가하였다. 그러나 TGA 거동은 거의 변화가 없었다. 이방성 전도 접착제를 사용한 유기 기판 플립 칩의 신뢰성 테스트를 위해 열주기 시험, 고온고습 시험, 고온건조 시험을 수행하였는데, 주로 열주기 시험에서 이방서 전도 접착제의 열팽창계수의 영향이 컸다. 비전도성 충진재를 포함해서 낮은 열팽창계수와 높은 storage modulus를 갖는 이방성 전도 접착제에 의해 부착된 플립 칩의 신뢰성이 비전도성 충진재를 포함하지 않은 이방성 전도 접착제에 의한 플립 칩의 신뢰성보다 더 좋게 나타났다.

• Composites Research
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• 제28권5호
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• pp.270-276
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• 2015

Polyvinylidene fluoride (PVDF)-based nanocomposites are fabricated by incorporation of boron nitride (BN) nanosheets with anisotropic orientation for a potential high thermal conducting ferroelectric materials. The PVDF is dissolved in dimethylformamide (DMF) and homogeneously mixed with exfoliated BN nanosheets, which is then cast into a polyimide film under application of high magnetic fields (0.45~10 T), where the direction of the filler alignment was controlled. The BN nanosheets are exfoliated by a mixed way of solvothermal method and ultrasonication prior to incorporation into the PVDF-based polymer suspension. X-ray diffraction, scanning electron microscope and thermal diffusivity are measured for the characterization of the polymer nanocomposites. Analysis shows that BN nanosheets are exfoliated into the fewer layers, whose basal planes are oriented either perpendicular or parallel to the composite surfaces without necessitating the surface modification induced by high magnetic fields. Moreover, the nanocomposites show a dramatic thermal diffusivity enhancement of 1056% by BN nanosheets with perpendicular orientation in comparison with the pristine PVDF at 10 vol % of BN, which relies on the degree of filler orientation. The mechanism for the magnetic field-induced orientation of BN and enhancement of thermal property of PVDF-based composites by the BN assembly are elucidated.

• Journal of the Korean Wood Science and Technology
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• 제42권5호
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• pp.499-509
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• 2014

Wood filler is a porous and anisotropic material having different size, shape, and aspect ratio. The use of wood fillers such as wood particle, wood flour, and wood pulp in wood plastic composites (WPCs) are growing rapidly because these wood fillers give improved strength and stiffness to WPCs. However, the wood fillers have originally poor compatibility with plastic matrix affecting the mechanical properties of WPCs. Therefore, to improve compatibility between wood and plastic, numbers of physical and chemical treatments were investigated. While the various treatments led to improved performances in WPC industries using petroleum-based plastics, full biodegradation is still issues due to increased environmental concerns. Hence, bio-based plastics such as polylactide and polyhydroxybutyrate having biodegradable characteristics are being applied to WPCs, but relatively expensive prices of existing bio-based plastics prevent further uses. As conventional processing methods, extrusion, injection, and compression moldings have been used in WPC industries, but to apply WPCs to engineered or structural places, new processing methods should be developed. As one system, co-extrusion technique was introduced to WPCs and the co-extruded WPCs having core-shell structures make the extended applications of WPCs possible.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2000년도 Proceedings of 5th International Joint Symposium on Microeletronics and Packaging
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• pp.9-15
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• 2000

Flip chip assembly on organic substrates using ACAs have received much attentions due to many advantages such as easier processing, good electrical performance, lower cost, and low temperature processing compatible with organic substrates. ACAs are generally composed of epoxy polymer resin and small amount of conductive fillers (less than 10 wt. %). As a result, ACAs have almost the same CTE values as an epoxy material itself which are higher than conventional underfill materials which contains lots of fillers. Therefore, it is necessary to lower the CTE value of ACAs to obtain more reliable flip chip assembly on organic substrates using ACAs. To modify the ACA composite materials with some amount of conductive fillers, non-conductive fillers were incorporated into ACAs. In this paper, we investigated the effect of fillers on the thermo-mechanical properties of modified ACA composite materials and the reliability of flip chip assembly on organic substrates using modified ACA composite materials. For the characterization of modified ACAs composites with different content of non-conducting fillers, dynamic scanning calorimeter (DSC), and thermo-gravimetric analyzer (TGA), dynamic mechanical analyzer (DMA), and thermo-mechanical analyzer (TMA) were utilized. As the non-conducting filler content increased, CTE values decreased and storage modulus at room temperature increased. In addition, the increase in tile content of filler brought about the increase of Tg$^{DSC}$ and Tg$^{TMA}$. However, the TGA behaviors stayed almost the same. Contact resistance changes were measured during reliability tests such as thermal cycling, high humidity and temperature, and high temperature at dry condition. It was observed that reliability results were significant affected by CTEs of ACA materials especially at the thermal cycling test. Results showed that flip chip assembly using modified ACA composites with lower CTEs and higher modulus by loading non-conducting fillers exhibited better contact resistance behavior than conventional ACAs without non-conducting fillers.ers.

• 마이크로전자및패키징학회지
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• 제7권1호
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• pp.41-49
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• 2000

Flip chip assembly on organic substrates using ACAs have received much attentions due to many advantages such as easier processing, good electrical performance, lower cost, and low temperature processing compatible with organic substrates. ACAs are generally composed of epoxy polymer resin and small amount of conductive fillers (less than 10 wt.%). As a result, ACAs have almost the same CTE values as an epoxy material itself which are higher than conventional underfill materials which contains lots of fillers. Therefore, it is necessary to lower the CTE value of ACAs to obtain more reliable flip chip assembly on organic substrates using ACAs. To modify the ACA composite materials with some amount of conductive fillers, non-conductive fillers were incorporated into ACAs. In this paper, we investigated the effect of fillers on the thermo-mechanical properties of modified ACA composite materials and the reliability of flip chip assembly on organic substrates using modified ACA composite materials. For the characterization of modified ACAs composites with different content of non-conducting fillers, dynamic scanning calorimeter (DSC), and thermo-gravimetric analyser (TGA), dynamic mechanical analyzer (DMA), and thermo-mechanical analyzer (TMA) were utilized. As the non-conducting filler content increased, CTE values decreased and storage modulus at room temperature increased. In addition, the increase in the content of filler brought about the increase of $Tg^{DSC}$ and $Tg^{TMA}$. However, the TGA behaviors stayed almost the same. Contact resistance changes were measured during reliability tests such as thermal cycling, high humidity and temperature, and high temperature at dry condition. It was observed that reliability results were significantly affected by CTEs of ACA materials especially at the thermal cycling test. Results showed that flip chip assembly using modified ACA composites with lower CTEs and higher modulus by loading non-conducting fillers exhibited better contact resistance behavior than conventional ACAs without non-conducting fillers.

• 폴리머
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• 제34권1호
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• pp.52-57
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• 2010

고 신뢰도와 높은 물성을 갖는 이방성 전도성접착제(anisotropic conductive adhesive, ACA)용 레진 개발을 위하여, 환원특성을 갖는 카르복실산을 포함한 bisphenol F계열의 에폭시 레진에 저융점 솔더입자(low melting point alloys, LMPA)를 분산시켜 제조하였다. LMPA의 융점에서의 에폭시 레진의 경화특성 및 온도에 따른 유변학 특성을 동적 시차 주사 열량계(differential scanning calorimeter, DSC)와 레오미터(rheometer)로 측정하여 최적화된 ACA 접합 공정을 설계하였다. 접합 공정시 LMPA 표면에 생성되는 산화막을 제거하여 높은 전기전도도와 안정적인 전기적 특성을 얻을 수 있도록 세가지 종류의 카르복실산을 환원제로 사용하여 각각의 젖음(wetting) 특성을 확인하였다. 부틸 카르복실산은 $28^{\circ}$의 낮은 젖음각을 나타내었으나, 경화반응 중 다량의 기포가 발생하는 문제가 있었다. 그러나, 이관능성 카르복실산(1,3-bis(2-carboxypropyl)tetramethyl disaoxane(2-CTMS)) 및 1,3-bis(3-carboxypropyl)tetramethyl disiloxane(3-CTMS))의 경우, 기포의 발생 없이 각각 $18^{\circ}$와 $20.3^{\circ}$의 매우 우수한 젖음 특성을 보였다.

• 한국재료학회지
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• 제7권2호
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• pp.121-128
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• 1997

이방성과 등방성을 갖는 두 종류의 피치계 탄소섬유를 TGA장치를 이용하여 $CO_{2}$gas와 공기중에서 등온산화반응을 실시하였다. $CO_{2}$ gas보다 공기중에서의 산화가 훨씬 빠르게 일어났으며, $600^{\circ}C$공기중에서 등방성 T-10IS섬유는 이방성 HM-60섬유보다 23.9배나 빠른 산화속도를 보였다. 실험적으로 구한 활성화에너지를 저온에서 36-56Kcal/mole의 값을 가지며, 고온에서는 6-13Kcal/mole의 값을 나타내었다. 반응기구(zone 1,2,3)의 천이도는 T-10IS섬유보다 HM-60 섬유가 높았으며, 공기중에서보다 $CO_{2}$ gas분위기에서 더 높게 나타났다. SEM으로 관찰된 표면상변화로부터 탄소섬유의 산화반응은 섬유의 결함을 따라 진행된다는 것을 알 수 있었다.

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2009년 추계학술발표대회
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• pp.73-73
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• 2009

In this sutdy, a new class ACA(Anisotropic Conductive Adhesive) with low-melting-point alloy(LMPA) and self-organized interconnection method were developed. This developed self-organized interconnection method are achieved by the flow, melting, coalescence and wetting characteristics of the LMPA fillers in ACA. In order to observe self-interconnection characteristic, the QFP($14{\times}14{\times}2.7mm$ size and 1mm lead pitch) was used. Thermal characteristic of the ACA and temperature-dependant viscosity characteristics of the polymer were observed by differential scanning calorimetry(DSC) and torsional parallel rheometer, respectively. A electrical and mechanical characteristics of QFP bonding were measured using multimeter and pull tester, respectively. Wetting and coalescence characteristics of LMPA filler particles and morphology of conduction path were observed by microfocus X-ray inspection systems and cross-sectional optical microscope. As a result, the developed self-organized interconnection method has a good electrical characteristic($2.41m{\Omega}$) and bonding strength(17.19N) by metallurgical interconnection of molten solder particles in ACA.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2001년도 Proceedings of 6th International Joint Symposium on Microeletronics and Packaging
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• pp.35-43
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• 2001

Flip chip assembly on organic substrates using ACAs have received much attentions due to many advantages such as easier processing, good electrical performance, lower cost, and low temperature processing compatible with organic substrates. ACAs are generally composed of epoxy polymer resin and small amount of conductive fillers (less than 10 wt.%). As a result, ACAs have almost the same CTE values as an epoxy material itself which are higher than conventional underfill materials which contains lots of fillers. Therefore, it is necessary to lower the CTE value of ACAs to obtain more reliable flip chip assembly on organic substrates using ACAs. To modify the ACA composite materials with some amount of conductive fillers, non-conductive fillers were incorporated into ACAs. In this paper, we investigated the effect of fillers on the thermo-mechanical properties of modified ACA composite materials and the reliability of flip chip assembly on organic substrates using modified ACA composite materials. Contact resistance changes were measured during reliability tests such as thermal cycling, high humidity and temperature, and high temperature at dry condition. It was observed that reliability results were significantly affected by CTEs of ACA materials especially at the thermal cycling test. Results showed that flip chip assembly using modified ACA composites with lower CTEs and higher modulus by loading non-conducting fillers exhibited better contact resistance behavior than conventional ACAs without non-conducting fillers. Microwave model and high-frequency measurement of the ACF flip-chip interconnection was investigated using a microwave network analysis. ACF flip chip interconnection has only below 0.1nH, and very stable up to 13 GHz. Over the 13 GHz, there was significant loss because of epoxy capacitance of ACF. However, the addition of $SiO_2filler$ to the ACF lowered the dielectric constant of the ACF materials resulting in an increase of resonance frequency up to 15 GHz. Our results indicate that the electrical performance of ACF combined with electroless Wi/Au bump interconnection is comparable to that of solder joint.