• Composites Research
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• v.35 no.6
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• pp.431-438
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• 2022

Efficient heat dissipation in current electronics is crucial to ensure the best performance and lifespan of the devices along with the users' safety. Materials with high thermal conductivity are often used to dissipate the generated heat from the electronics to the surroundings. For this purpose, polymer composites have been attracted much attention as they possess advantages rooted from both polymer matrix and thermally conductive filler. In order to meet the thermal conductivity required by relevant industries, composites with high filler loadings (i.e., >60 vol%) have been fabricated. At such high filler loadings, however, composites lose benefits originated from the polymer matrix. To achieve high thermal conductivity at a relatively low filler loading, therefore, constructing the heat conduction pathway by controlling filler structure within the composites may represent a judicious strategy. To this end, this review introduces several recent approaches to manufacturing heat dissipating materials with high thermal conductivity by manipulating thermally conductive filler structures in polymer composites.

• Korean Journal of Materials Research
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• v.10 no.3
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• pp.184-190
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• 2000

We investigated the effect of filler content on the thermo-mechanical properties of modified ACA composite materials by incorporation of non-conducting fillers and the reliability of flip chip assembly on organic substrates using modified ACA composite materials. For the characterization of modified ACA s composites with different content of non-conducting fillers, differential scanning calorimeter (DSC), and thermo-gravimetric analyzer (TGA), dynamic mechanical analyzer (DMA), and thermo-mechnical analyzer (TMA) were utilized. As the non-conducting filler content increased, CTE values decreased and storage modulus at room temperature increased. In addition, the increase in the content of filler brought about the increase of Tg^{DSC}$ and $Tg^{TMA}$. However, the TGA behaviors stayed almost the same. Contact resistance changes were measured during reliability tests such as thermal cycling, high humidity and temperature, and high temperature at dry condition. It was observed that reliability results were significantly affected by CTEs of ACA materials especially at the thermal cycling test. Results showed that flip chip assembly using modified ACA composites with lower CTEs and higher modulus by loading non-conducting fillers exhibited better contact resistance behavior than conventional ACAs without non-conducting fillers.

• Composites Research
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• v.28 no.5
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• pp.270-276
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• 2015

Polyvinylidene fluoride (PVDF)-based nanocomposites are fabricated by incorporation of boron nitride (BN) nanosheets with anisotropic orientation for a potential high thermal conducting ferroelectric materials. The PVDF is dissolved in dimethylformamide (DMF) and homogeneously mixed with exfoliated BN nanosheets, which is then cast into a polyimide film under application of high magnetic fields (0.45~10 T), where the direction of the filler alignment was controlled. The BN nanosheets are exfoliated by a mixed way of solvothermal method and ultrasonication prior to incorporation into the PVDF-based polymer suspension. X-ray diffraction, scanning electron microscope and thermal diffusivity are measured for the characterization of the polymer nanocomposites. Analysis shows that BN nanosheets are exfoliated into the fewer layers, whose basal planes are oriented either perpendicular or parallel to the composite surfaces without necessitating the surface modification induced by high magnetic fields. Moreover, the nanocomposites show a dramatic thermal diffusivity enhancement of 1056% by BN nanosheets with perpendicular orientation in comparison with the pristine PVDF at 10 vol % of BN, which relies on the degree of filler orientation. The mechanism for the magnetic field-induced orientation of BN and enhancement of thermal property of PVDF-based composites by the BN assembly are elucidated.

• Journal of the Korean Wood Science and Technology
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• v.42 no.5
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• pp.499-509
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• 2014

Wood filler is a porous and anisotropic material having different size, shape, and aspect ratio. The use of wood fillers such as wood particle, wood flour, and wood pulp in wood plastic composites (WPCs) are growing rapidly because these wood fillers give improved strength and stiffness to WPCs. However, the wood fillers have originally poor compatibility with plastic matrix affecting the mechanical properties of WPCs. Therefore, to improve compatibility between wood and plastic, numbers of physical and chemical treatments were investigated. While the various treatments led to improved performances in WPC industries using petroleum-based plastics, full biodegradation is still issues due to increased environmental concerns. Hence, bio-based plastics such as polylactide and polyhydroxybutyrate having biodegradable characteristics are being applied to WPCs, but relatively expensive prices of existing bio-based plastics prevent further uses. As conventional processing methods, extrusion, injection, and compression moldings have been used in WPC industries, but to apply WPCs to engineered or structural places, new processing methods should be developed. As one system, co-extrusion technique was introduced to WPCs and the co-extruded WPCs having core-shell structures make the extended applications of WPCs possible.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2000.04a
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• pp.9-15
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• 2000

Flip chip assembly on organic substrates using ACAs have received much attentions due to many advantages such as easier processing, good electrical performance, lower cost, and low temperature processing compatible with organic substrates. ACAs are generally composed of epoxy polymer resin and small amount of conductive fillers (less than 10 wt. %). As a result, ACAs have almost the same CTE values as an epoxy material itself which are higher than conventional underfill materials which contains lots of fillers. Therefore, it is necessary to lower the CTE value of ACAs to obtain more reliable flip chip assembly on organic substrates using ACAs. To modify the ACA composite materials with some amount of conductive fillers, non-conductive fillers were incorporated into ACAs. In this paper, we investigated the effect of fillers on the thermo-mechanical properties of modified ACA composite materials and the reliability of flip chip assembly on organic substrates using modified ACA composite materials. For the characterization of modified ACAs composites with different content of non-conducting fillers, dynamic scanning calorimeter (DSC), and thermo-gravimetric analyzer (TGA), dynamic mechanical analyzer (DMA), and thermo-mechanical analyzer (TMA) were utilized. As the non-conducting filler content increased, CTE values decreased and storage modulus at room temperature increased. In addition, the increase in tile content of filler brought about the increase of Tg$^{DSC}$ and Tg$^{TMA}$. However, the TGA behaviors stayed almost the same. Contact resistance changes were measured during reliability tests such as thermal cycling, high humidity and temperature, and high temperature at dry condition. It was observed that reliability results were significant affected by CTEs of ACA materials especially at the thermal cycling test. Results showed that flip chip assembly using modified ACA composites with lower CTEs and higher modulus by loading non-conducting fillers exhibited better contact resistance behavior than conventional ACAs without non-conducting fillers.ers.

• Journal of the Microelectronics and Packaging Society
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• v.7 no.1
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• pp.41-49
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• 2000

Flip chip assembly on organic substrates using ACAs have received much attentions due to many advantages such as easier processing, good electrical performance, lower cost, and low temperature processing compatible with organic substrates. ACAs are generally composed of epoxy polymer resin and small amount of conductive fillers (less than 10 wt.%). As a result, ACAs have almost the same CTE values as an epoxy material itself which are higher than conventional underfill materials which contains lots of fillers. Therefore, it is necessary to lower the CTE value of ACAs to obtain more reliable flip chip assembly on organic substrates using ACAs. To modify the ACA composite materials with some amount of conductive fillers, non-conductive fillers were incorporated into ACAs. In this paper, we investigated the effect of fillers on the thermo-mechanical properties of modified ACA composite materials and the reliability of flip chip assembly on organic substrates using modified ACA composite materials. For the characterization of modified ACAs composites with different content of non-conducting fillers, dynamic scanning calorimeter (DSC), and thermo-gravimetric analyser (TGA), dynamic mechanical analyzer (DMA), and thermo-mechanical analyzer (TMA) were utilized. As the non-conducting filler content increased, CTE values decreased and storage modulus at room temperature increased. In addition, the increase in the content of filler brought about the increase of $Tg^{DSC}$ and $Tg^{TMA}$. However, the TGA behaviors stayed almost the same. Contact resistance changes were measured during reliability tests such as thermal cycling, high humidity and temperature, and high temperature at dry condition. It was observed that reliability results were significantly affected by CTEs of ACA materials especially at the thermal cycling test. Results showed that flip chip assembly using modified ACA composites with lower CTEs and higher modulus by loading non-conducting fillers exhibited better contact resistance behavior than conventional ACAs without non-conducting fillers.

• Polymer(Korea)
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• v.34 no.1
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• pp.52-57
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• 2010

The low viscous epoxy resin(bisphenol F) with carboxylic acid as the reductants was introduced for high performance and reliability in the ACA with a low melting point alloy filler system. The curing characteristics of the epoxy resin and temperature dependant viscosity characteristic of epoxy resin at the melting temperature of LMPA were investigated by dynamic mode of differential scanning calorimetry (DSC) and rheometer, respectively. Based on these thermo-rheological characteristics of epoxy resin and LMPA, the optimum process system was designed. In order to remove the oxide layer on the surface of LMPA particle, three different types of carboxyl acid-based reductant were added to the epoxy resin. The wetting angles were about $18^{\circ}$ for carboxypropyldisilioxane, and $20.3^{\circ}$ for the carboxy-2-methylethylsiloxane, respectively.

• Korean Journal of Materials Research
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• v.7 no.2
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• pp.121-128
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• 1997

Two-types of carbon fiber, anisotropic- and isotropic- pitch based, were expose to isothermal oxidation in air and $CO_{2}$ gas and the weight change rates was measured by TGA apparatus. Thc oxidation rate was laster in air than in $CO_{2}$ gas, and the oxidation rare of isotropic T- 101s liher was over 23 9 times faster than that of anisotropic HM-60 filler at $600^{\circ}C$ in air. The activation energy was 36-56 Kcal/mole at lower temperature range and 6- 13 Kcal/molc at higher temperature range. It was higher that the transition temperalure 01 reaction zone(zone 1. 2, :i) of 11M-GO fiber than that of T-101s fiber, and it was higher in $CO_{2}$ gas than in air. From SEM observation, it Lvas found that the oxidation of carbon fibers was progressed through the imperfection.

• Proceedings of the KWS Conference
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• 2009.11a
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• pp.73-73
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• 2009

In this sutdy, a new class ACA(Anisotropic Conductive Adhesive) with low-melting-point alloy(LMPA) and self-organized interconnection method were developed. This developed self-organized interconnection method are achieved by the flow, melting, coalescence and wetting characteristics of the LMPA fillers in ACA. In order to observe self-interconnection characteristic, the QFP($14{\times}14{\times}2.7mm$ size and 1mm lead pitch) was used. Thermal characteristic of the ACA and temperature-dependant viscosity characteristics of the polymer were observed by differential scanning calorimetry(DSC) and torsional parallel rheometer, respectively. A electrical and mechanical characteristics of QFP bonding were measured using multimeter and pull tester, respectively. Wetting and coalescence characteristics of LMPA filler particles and morphology of conduction path were observed by microfocus X-ray inspection systems and cross-sectional optical microscope. As a result, the developed self-organized interconnection method has a good electrical characteristic($2.41m{\Omega}$) and bonding strength(17.19N) by metallurgical interconnection of molten solder particles in ACA.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2001.04a
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• pp.35-43
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• 2001

Flip chip assembly on organic substrates using ACAs have received much attentions due to many advantages such as easier processing, good electrical performance, lower cost, and low temperature processing compatible with organic substrates. ACAs are generally composed of epoxy polymer resin and small amount of conductive fillers (less than 10 wt.%). As a result, ACAs have almost the same CTE values as an epoxy material itself which are higher than conventional underfill materials which contains lots of fillers. Therefore, it is necessary to lower the CTE value of ACAs to obtain more reliable flip chip assembly on organic substrates using ACAs. To modify the ACA composite materials with some amount of conductive fillers, non-conductive fillers were incorporated into ACAs. In this paper, we investigated the effect of fillers on the thermo-mechanical properties of modified ACA composite materials and the reliability of flip chip assembly on organic substrates using modified ACA composite materials. Contact resistance changes were measured during reliability tests such as thermal cycling, high humidity and temperature, and high temperature at dry condition. It was observed that reliability results were significantly affected by CTEs of ACA materials especially at the thermal cycling test. Results showed that flip chip assembly using modified ACA composites with lower CTEs and higher modulus by loading non-conducting fillers exhibited better contact resistance behavior than conventional ACAs without non-conducting fillers. Microwave model and high-frequency measurement of the ACF flip-chip interconnection was investigated using a microwave network analysis. ACF flip chip interconnection has only below 0.1nH, and very stable up to 13 GHz. Over the 13 GHz, there was significant loss because of epoxy capacitance of ACF. However, the addition of $SiO_2filler$ to the ACF lowered the dielectric constant of the ACF materials resulting in an increase of resonance frequency up to 15 GHz. Our results indicate that the electrical performance of ACF combined with electroless Wi/Au bump interconnection is comparable to that of solder joint.