• 대한전자공학회:학술대회논문집
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• 대한전자공학회 2002년도 ITC-CSCC -1
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• pp.70-73
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• 2002

High frequency digital LSI circuits are usually composed of many sub-circuits coupled with interconnects. They sometimes causes serious problems of the fault switching by time-delays, crosstalks, reflections of signals and so on. Therefore, it is very important to develop a user-friendly simulator for solving these problems. Although a moment matching method is widely used as the reduction technique of interconnects, it may happen to arise erroneous results for evaluating the poles far from the origin. In this paper, we show an asymptotic method in the complex frequency-domain, where we calculate the exact poles and residues giving large effect to the transient responses. Then, the interconnects are replaced by the asymptotic equivalent circuits using the poles and residues. Thus, we can develop a users-friendly simulator using the equivalent circuits.

• 한국산업융합학회 논문집
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• 제26권1호
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• pp.105-112
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• 2023

We analyze the global market for flexible electronic circuits, technical considerations, and analyze the market for application areas and regions. In the market analysis of the application field, the display field has the greatest influence in terms of market size and annual growth rate, and the OLE D lighting market size is expected to grow by nearly 50% in 2026. The multilayer flexible electronics, which dependently requires the semiconductor technology, has a larger market size than other structures and its growth rate is relatively large, leading the market and will be further analyzed in depth. The market size of multilayer flexible electronics applied to display field is expected to show an annual growth rate of 21.1% from $2.7 billion in 2017 to $9.8 billion in 2026, and the OLED market is expected to grow by 75.2% during the same periods. Recently, as electronic products have been miniaturized and advanced, and robust installation in a small space is required, companies that preoccupy multilayer structure or rigid flexible electronic circuit technology have an advantage in competitiveness, so many companies are trying to obtain this technology. These efforts are systematically supported by many countries because they can achieve mutual growth by strengthening the competitiveness of the application field and the same industry. In the case of Korea, a support system is established, but it is required to expand and activate it, and to localize manufacturing equipment and materials.

• Design & Manufacturing
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• 제14권1호
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• pp.15-21
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• 2020

Smart systems in different application areas such as automotive, medical and consumer electronics require a novel manufacturing method of electronic, optical and mechanical functions into products. Traditional methods including mechanical assembly, bonding of plastic and electronic circuit cause the problems in large size of products and complicated manufacturing processes. In this study, thermoforming and film insert molding were applied to fabricate a dome shaped plastic part embedded with electronic circuits. The deformation of patterns printed on PET film was predicted by thermoforming simulation using T-SIM, and the results were compared with those by experiment. In order to decrease spring-back after thermoforming, the Taguchi method of design of experiment was used. Through ANOVA analysis, it was found that mold temperature was the most dominant parameter for spring-back. By using flow analysis, gate design was performed to decrease injection pressure. During film insert molding, the wash-out of ink printed on film occurred for Polycarbonate. When the resin was changed to PMMA, the wash-out disappeared due to low melt temperature.

• 대한전자공학회:학술대회논문집
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• 대한전자공학회 2008년도 하계종합학술대회
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• pp.147-148
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• 2008

A MultiSIM software is very friendly tool that analysis of electronic circuits. The integrated capture and simulation is much easier to use and provides features that currently meet or exceed those of another capture and simulation tools. And actual hardware use the NI ELVIS to easily and quickly measure circuits and comparison and analysis of simulated actual data. In this paper, we introduce a combination of MultiSIM, the NI ELVIS, and NI LabVIEW and this combination gives to college and university a comprehensive, hands-on experience throughout the entire educational cycle.

• 대한전자공학회논문지
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• 제10권2호
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• pp.23-35
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• 1973

ECAP을 사용하여 직류, 교류, 과도현상에 대한 회로해석을 논하였으며 2단 가청주파 증폭기의 저주파 및 고주파 영역에서의 주파수 특성을 ECAP방식을 사용하여 해석하였다. 또한 근사식과 실험을 통하여 전류, 전압의 이득을 구하여 콤퓨터에 의한 값과 비교하여 본 결과 잘 일치함을 보였다.

• Nuclear Engineering and Technology
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• 제38권5호
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• pp.423-426
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• 2006

A developed neutron activation analysis(NAA) and gamma-spectrometry were applied to improve the analytical sensitivity and precision of impurities in electronic-circuit raw materials. It is well known that soft errors in high precision electronic circuits can be induced by alpha particles emitted from naturally occurring radioactive impurities such as U and Th. As electronic circuits have recently become smaller in dimension and higher in density, these alpha-particle emitting radioactive impurities must be strictly controlled. Therefore, new NAA methods have been established using a HTS(Hydraulic Transfer System) irradiation facility and a background reduction method. For eliminating or stabilizing fluctuated background caused by Rn-222 and its progeny nuclides in air, a nitrogen purging system is used. Using the developed NAA and gamma-spectrometry, ultra trace amounts of U(0.1ng/g) and Th(0.01ng/g) in an alumina ball and high purity silica used for an epoxy molding compound (EMC) could be determined.

• Journal of Power Electronics
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• 제15권2호
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• pp.567-575
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• 2015

An improvement in the current fed parallel resonant half bridge (CFPRHB) circuits used in fluorescent lamp electronic ballasts is provided in this paper. The CFPRHB belongs to the self-oscillating family which includes the current fed push-pull and series resonant inverters, most of which are used in instant-start applications. However, many failure modes are related to the bypass capacitor according to an analysis of failed samples. In this paper, the operating functions of the existing topology in the steady state are analyzed and the main root cause of failure modes has been found. Comparisons between the two topologies are conducted in terms of the voltage stress of the bypass capacitor as well as the thermal and performance of the ballasts to verify the advantages of the proposed topology. It is found that the improved topology is capable of enhancing the reliability and reducing the cost of products without having a negative influence on the system performance.

• 대한전자공학회논문지
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• 제10권6호
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• pp.62-71
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• 1973

능동 filter에 쓰에는 Gyrator를 구성하여 그 특성을 ECAP(Electronic Circuit Analysis Program)로써 해석하였고 그 결과로 나타난 문제점을 해결하고 특성을 개선하기 위한 조치로서 Colletor 측의 저항을 높이기 위하여 정전류전원회로를 이용하여 전원전압을 줄이고 ECAP로써 해석하여 그 조치가 정당함을 확인하였다.

• 전력전자학회:학술대회논문집
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• 전력전자학회 2002년도 전력전자학술대회 논문집
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• pp.330-333
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• 2002

The design of high power electronic circuits and the verification of the design by practical experiments are time and cost consuming. Recently power circuit simulation technique is developing to do it easily. However, most of the simulation has used the ideal switch model consists of passive component that can not describe the physical characteristics of semiconductor devices and cannot describe the switching transient state. For the design of such power electronic circuits by the simulation, the switching transients are very important. Therefore the simulation models must describe the switching transient and the stationary behavior as precisely as possible on the hand and as fast as possible the other hand. This paper introduces the application of the physical models of power devices that are developed by TUM(Technical University of Munich, Germany) for the power electronic circuit analysis.

• 센서학회지
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• 제26권4호
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• pp.292-296
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• 2017

It has become ever harder to design reliable circuits with each nanometer technology node under normal operation conditions, a transistor device can be affected by various aging effects resulting in performance degradation and eventually design failure. The reliability (aging) effect has traditionally been the area of process engineers. However, in the future, even the smallest of variations can slow down a transistor's switching speed, and an aging device may not perform adequately at a very low voltage. Because of such dilemmas, the transistor aging is emerging as a circuit designer's problem. Therefore, in this paper, the impact of aging effects on the delay and power dissipation of digital circuits by using nanomneter MOSFET power gating structure has been analyzed.. Based on this analyzed aging models, a reliable digital circuits can be designed.