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A study on the molding of dome shaped plastic parts embedded with electronic circuits  

Seong, Gyeom-Son (Dep. of Aeronautical & Mechanical Design Eng., Korea Nat'l Univ. of Transportation)
Lee, Ho-Sang (Dep. of Aeronautical & Mechanical Design Eng., Korea Nat'l Univ. of Transportation)
Publication Information
Design & Manufacturing / v.14, no.1, 2020 , pp. 15-21 More about this Journal
Abstract
Smart systems in different application areas such as automotive, medical and consumer electronics require a novel manufacturing method of electronic, optical and mechanical functions into products. Traditional methods including mechanical assembly, bonding of plastic and electronic circuit cause the problems in large size of products and complicated manufacturing processes. In this study, thermoforming and film insert molding were applied to fabricate a dome shaped plastic part embedded with electronic circuits. The deformation of patterns printed on PET film was predicted by thermoforming simulation using T-SIM, and the results were compared with those by experiment. In order to decrease spring-back after thermoforming, the Taguchi method of design of experiment was used. Through ANOVA analysis, it was found that mold temperature was the most dominant parameter for spring-back. By using flow analysis, gate design was performed to decrease injection pressure. During film insert molding, the wash-out of ink printed on film occurred for Polycarbonate. When the resin was changed to PMMA, the wash-out disappeared due to low melt temperature.
Keywords
Electronic Circuits; Film Insert Molding; Pattern; Thermoforming; Wash-out;
Citations & Related Records
Times Cited By KSCI : 4  (Citation Analysis)
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