• 제목/요약/키워드: Amorphous Silicon (a-Si)

검색결과 488건 처리시간 0.026초

다공성실리콘 위의 탄화규소 박막의 증착 및 발광특성 (Deposition and Photoluminescence Characteristics of Silicon Carbide Thin Films on Porous Silicon)

  • 전희준;최두진;장수경;심은덕
    • 한국세라믹학회지
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    • 제35권5호
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    • pp.486-492
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    • 1998
  • Silicon carbide (SiC) thin films were deposited on the porous silicon substrates by chemical vapour de-position(CVD) using MTS as a source material. The deposited films were ${\beta}$-SiC with poor crystallity con-firmed by XRD measurement. It was considered that the films showed the mixed characteistics of cry-stalline and amorphous SiC where amorphous SiC where amorphous SiC played a role of buffer layer in interface between as-dep films and Si substrate. The buffer layer reduced lattice mismatch to some extent the generally occurs when SiC films are deposited on Si. The low temperature (10K) PL (phtoluminescence) studies showed two broad bands with peaks at 600 and 720 for the films deposited at 1100$^{\circ}C$ The maximum PL peak of the crystalline SiC was observed at 600 nm and the amrophous SiC of 720 nm was also confirmed. PL peak due the amorphous SiC was smaller than that of the crystalline SiC, PL of porous Si might be disapperared due to densification during heat treatment.

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Joule-heating Induced Crystallization (JIC) of Amorphous Silicon Films

  • Ko, Da-Yeong;Ro, Jae-Sang
    • 마이크로전자및패키징학회지
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    • 제25권4호
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    • pp.101-104
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    • 2018
  • An electric field was applied to a Mo conductive layer in the sandwiched structure of $glass/SiO_2/Mo/SiO_2/a-Si$ to induce Joule heating in order to generate the intense heat needed to carry out the crystallization of amorphous silicon. Polycrystalline silicon was produced via Joule heating through a solid state transformation. Blanket crystallization was accomplished within the range of millisecond, thus demonstrating the possibility of a new crystallization route for amorphous silicon films. The grain size of JIC poly-Si can be varied from few tens of nanometers to the one having the larger grain size exceeding that of excimer laser crystallized (ELC) poly-Si according to transmission electron microscopy. We report here the blanket crystallization of amorphous silicon films using the $2^{nd}$ generation glass substrate.

Effect of p-type a-SiO:H buffer layer at the interface of TCO and p-type layer in hydrogenated amorphous silicon solar cells

  • Kim, Youngkuk;Iftiquar, S.M.;Park, Jinjoo;Lee, Jeongchul;Yi, Junsin
    • Journal of Ceramic Processing Research
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    • 제13권spc2호
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    • pp.336-340
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    • 2012
  • Wide band gap p-type hydrogenated amorphous silicon oxide (a-SiO:H) buffer layer has been used at the interface of transparent conductive oxide (TCO) and hydrogenated amorphous silicon (a-Si:H) p-type layer of a p-i-n type a-Si:H solar cell. Introduction of 5 nm thick buffer layer improves in blue response of the cell along with 0.5% enhancement of photovoltaic conversion efficiency (η). The cells with buffer layer show higher open circuit voltage (Voc), fill factor (FF), short circuit current density (Jsc) and improved blue response with respect to the cell without buffer layer.

비정질 규소막의 공정조건이 HSG-Si 형성에 미치는 영향 (Influence of the process conditions for the amorphous silicon on the HSG-Si formation)

  • 정재영;강성준;정양희
    • 한국전자통신학회논문지
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    • 제10권11호
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    • pp.1251-1256
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    • 2015
  • 본 논문은 비정질 규소막 성장의 공정 조건이 저장 전극의 표면에 HSG-Si를 형성할 때 미치는 영향을 조사하였다. 그 결과 비정질 규소막의 인 농도가 $5.5{\pm}0.1E19atoms/cm^3$ 이상이면 HSG-Si가 제대로 형성되지 않는 인 농도 의존성을 나타내었다. 또한 HSG 두께가 $500{\AA}$ 이상에서는 전극과 전극을 단락시키는 비트 불량을 유발하기 때문에 비정질 규소막의 인농도는 $4.5E19atoms/cm^3$, HSG 임계 두께는 $450{\AA}$이 최적 조건임을 확인하였다.

Crystallization of Amorphous Silicon Films Using Joule Heating

  • Ro, Jae-Sang
    • 한국표면공학회지
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    • 제47권1호
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    • pp.20-24
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    • 2014
  • Joule heat is generated by applying an electric filed to a conductive layer located beneath or above the amorphous silicon film, and is used to raise the temperature of the silicon film to crystallization temperature. An electric field was applied to an indium tin oxide (ITO) conductive layer to induce Joule heating in order to carry out the crystallization of amorphous silicon. Polycrystalline silicon was produced within the range of a millisecond. To investigate the kinetics of Joule-heating induced crystallization (JIC) solid phase crystallization was conducted using amorphous silicon films deposited by plasma enhanced chemical vapor deposition and using tube furnace in nitrogen ambient. Microscopic and macroscopic uniformity of crystallinity of JIC poly-Si was measured to have better uniformity compared to that of poly-Si produced by other methods such as metal induced crystallization and Excimer laser crystallization.

The Substrate Effects on Kinetics and Mechanism of Solid-Phase Crystallization of Amorphous Silicon Thin Films

  • Song, Yoon-Ho;Kang, Seung-Youl;Cho, Kyoung-Ik;Yoo, Hyung-Joun
    • ETRI Journal
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    • 제19권1호
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    • pp.26-35
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    • 1997
  • The substrate effects on solid-phase crystallization of amorphous silicon (a-Si) films deposited by low-pressure chemical vapor deposition (LPCVD) using $Si_2H_6$ gas have been extensively investigated. The a-Si films were prepared on various substrates, such as thermally oxidized Si wafer ($SiO_2$/Si), quartz and LPCVD-oxide, and annealed at 600$^{\circ}C$ in an $N_2$ ambient for crystallization. The crystallization behavior was found to be strongly dependent on the substrate even though all the silicon films were deposited in amorphous phase. It was first observed that crystallization in a-Si films deposited on the $SiO_2$/Si starts from the interface between the a-Si and the substrate, so called interface-interface-induced crystallization, while random nucleation process dominates on the other substrates. The different kinetics and mechanism of solid-phase crystallization is attributed to the structural disorderness of a-Si films, which is strongly affected by the surface roughness of the substrates.

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평판 표시기를 위한 수소화된 비정질실리콘 박막트랜지스터의 제작 (Fabrication of Hydrogenated Amorphous Silicon Thin-Film Transistors for Flat Panel Display)

  • 김남덕;김충기;최광수;장진;이주천
    • 대한전자공학회논문지
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    • 제24권3호
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    • pp.453-458
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    • 1987
  • Amorphous silicon thin-film transtors (TFT's) have been designed and fabricated on glass substrates. The hydrogenated amorphous silicon (a-Si:H) thin-film has been deposited by decomposing silane(SiH4) in hydorgen ambient by rf glow discharge method. Amorphous silicon nitride(a-Si:H) has been chosen as the gate dielectric material. It has been prepared by decomposing the mixed gas of silane(SiH4) and ammonia(NH3). The electrical properties and performance characteristics of the thin-film transistrs have been measured and compared with the requirements for the switching elements in liquid crystal flat panel display. The results show that liquid crystal flat panel displays can be fabricated using the thin-film transistors described in this paper.

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VHF-CVD를 이용한 a-Si:H/c-Si 이종접합태양전지 표면 패시배이션 연구 (Surface passivation study of a-Si:H/c-Si heterojunction solar cells using VHF-CVD)

  • 송준용;정대영;김경민;박주형;송진수;김동환;이정철
    • 한국신재생에너지학회:학술대회논문집
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    • 한국신재생에너지학회 2011년도 춘계학술대회 초록집
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    • pp.128.1-128.1
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    • 2011
  • In amorphous silicon and crystalline silicon(a-Si:H/c-Si) heterojuction solar cells, intrinsic hydrogenated amorphous silicon(a-Si:H) films play an important role to passivate the crystalline silicon wafer surfaces. We have studied the correlation between the surface passivation quality and nature of the Si-H bonding at the a-Si:H/c-Si interface. The samples were obtained by VHF-CVD under different deposition conditions. The passivation quality and analysis of all structures studied was performed by means of quasi steady state photoconductance(QSSPC) methods and fourier transform infrared spectrometer(FTIR) measurements respectively.

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Excimer Laser Annealing 결정화 방법 및 고유전 게이트 절연막을 사용한 poly-Si TFT의 특성 (Characteristics of poly-Si TFTs using Excimer Laser Annealing Crystallization and high-k Gate Dielectrics)

  • 이우현;조원주
    • 한국전기전자재료학회논문지
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    • 제21권1호
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    • pp.1-4
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    • 2008
  • The electrical characteristics of polycrystalline silicon (poly-Si) thin film transistor (TFT) crystallized by excimer laser annealing (ELA) method were evaluated, The polycrystalline silicon thin-film transistor (poly-Si TFT) has higher electric field-effect-mobility and larger drivability than the amorphous silicon TFT. However, to poly-Si TFT's using conventional processes, the temperature must be very high. For this reason, an amorphous silicon film on a buried oxide was crystallized by annealing with a KrF excimer laser (248 nm)to fabricate a poly-Si film at low temperature. Then, High permittivity $HfO_2$ of 20 nm as the gate-insulator was deposited by atomic layer deposition (ALD) to low temperature process. In addition, the solid phase crystallization (SPC) was compared to the ELA method as a crystallization technique of amorphous-silicon film. As a result, the crystallinity and surface roughness of poly-Si crystallized by ELA method was superior to the SPC method. Also, we obtained excellent device characteristics from the Poly-Si TFT fabricated by the ELA crystallization method.

RF-PECVD법에 의한 Ti-Si-N 박막의 증착거동 (Deposition Behaviors of Ti-Si-N Thin Films by RF Plasma-Enhanced Chemical Vapor Deposition.)

  • 이응안;이윤복;김광호
    • 한국표면공학회지
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    • 제35권4호
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    • pp.211-217
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    • 2002
  • Ti-Si-N films were deposited onto WC-Co substrate by a RF-PECVD technique. The deposition behaviors of Ti-Si-N films were investigated by varying the deposition temperature, RF power, and reaction gas ratio (Mx). Ti-Si-N films deposited at 500, 180W, and Mx 60% had a maximum hardness value of 38GPa. The microstructure of films with a maximum hardness was revealed to be a nanocomposite of TiN crystallites penetrated by amorphous silicon nitride phase by HRTEM analyses. The microstructure of maximum hardness with Si content (10 at.%) was revealed to be a nanocomposite of TiN crystallites penetrated by amorphous silicon nitride phase, but to have partly aligned structure of TiN and some inhomogeniety in distribution. and At above 10 at.% Si content, TiN crystallite became finer and more isotropic also thickness of amorphous silicon nitride phase increased at microstructure.