Journal of the Korean institute of surface engineering (한국표면공학회지)

The Korean Institute of Surface Engineering (한국표면공학회)
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Deposition Behaviors of Ti-Si-N Thin Films by RF Plasma-Enhanced Chemical Vapor Deposition.

RF-PECVD법에 의한 Ti-Si-N 박막의 증착거동

  • Published : 2002.08.01
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Abstract

Ti-Si-N films were deposited onto WC-Co substrate by a RF-PECVD technique. The deposition behaviors of Ti-Si-N films were investigated by varying the deposition temperature, RF power, and reaction gas ratio (Mx). Ti-Si-N films deposited at 500, 180W, and Mx 60% had a maximum hardness value of 38GPa. The microstructure of films with a maximum hardness was revealed to be a nanocomposite of TiN crystallites penetrated by amorphous silicon nitride phase by HRTEM analyses. The microstructure of maximum hardness with Si content (10 at.%) was revealed to be a nanocomposite of TiN crystallites penetrated by amorphous silicon nitride phase, but to have partly aligned structure of TiN and some inhomogeniety in distribution. and At above 10 at.% Si content, TiN crystallite became finer and more isotropic also thickness of amorphous silicon nitride phase increased at microstructure.

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References

  1. W. D. Munz, and D. Hofmann: Thin Solid films. 37 (1983) 233
  2. C. Subramanian, and N. Straffort : Wear 165 (1993) 85 https://doi.org/10.1016/0043-1648(93)90376-W
  3. H. Ichimura, and A. Kawana : J. Mater. Res. 8 (1993) 1093 https://doi.org/10.1557/JMR.1993.1093
  4. 김충완, 김광호 : 한국요업학회지 34 (1997) 512
  5. 박범희, 김정애, 이종영, 김광호 : 37 (2000) 96
  6. Hiroyuki Hasegawa, Ayako Kimura, and Tetsuya Suzuki: Surf. Coat. TechnoL 132 (1999) 76
  7. Li Shizhi, Shi Yulong, and Peng Hongrui : Plasma Chern. Plasma Proc. 12 (3) (1992) 287 https://doi.org/10.1007/BF01447027
  8. A. Niederhofer, T. Bolom, P. Nesladek, K. Moto, C. Eggs, D.S. Patil, and S. Veprek : 146-147 (2001) 183 https://doi.org/10.1016/S0257-8972(01)01469-4
  9. L. Rebouta, C.J. Tavares, R. Aimo, Z. Wang, K. Pischow, E. Alves, T.C. Rojas, and J.A. Odriozola: Surf. Coat. TechnoL 133-134 (2000) 234 https://doi.org/10.1016/S0257-8972(00)00934-8
  10. M. Oring: The Materials Science of Thin Films, Milton Oring, Academic press, New York, (1992),179
  11. S. Veprek and S. Reiprich : Thin Solid Films 268 (1995) 64 https://doi.org/10.1016/0040-6090(95)06695-0
  12. A. Niederhofer, P. Nesladek, H.-D. Mannling, K. Moto, S. Vepreck, and M. Jileck: Surf Coat. Technol. 120-121 (1999) 173 https://doi.org/10.1016/S0257-8972(99)00451-X
  13. S. Veprek, A. Niederhofer, K. Moto, T. Bolom, H.-D. Mannling, P. Nesladek, G. Dollinger, and A. Bergmaier : Surf. Coat. Technol. 133-134 (2000) 152 https://doi.org/10.1016/S0257-8972(00)00957-9
  14. F. Vaz, L. Rebouta, S. Ramos, M. F. da Silva, J. and C. Soares: Surf. Coat. Technol. 108-109 (1998) 236 https://doi.org/10.1016/S0257-8972(98)00620-3
  15. S. Veprek, and M. Haussmann, S. Reiprich, Li Shizhi, J. Dian: Surf. Coat. Technol. 86-87 (1996) 394 https://doi.org/10.1016/S0257-8972(96)02988-X
  16. J. Patscheider, T. Zehnder, and M. Diserens : Surf. Coat. Technol. 146-147 (2001) 201 https://doi.org/10.1016/S0257-8972(01)01389-5