• 한국표면공학회지
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• 제53권6호
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• pp.271-279
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• 2020

Non-ferrous metals, widely used in the mechanical industry, are difficult to machine, particularly by drilling and tapping. Since non-ferrous metals have a strong tendency to adhere to the cutting tool, the tool life is greatly deteriorated. Diamond-like carbon (DLC) is one of the promising candidates to improve the performance and life of cutting tool due to their low frictional property. In this study, a sacrificial DLC layer is applied on the hard nitride coated drill tool to improve the durability. The DLC coatings are fabricated by controlling the acceleration voltage of the linear ion source in the range of 0.6~1.8 kV. As a result, the optimized hardness(20 GPa) and wear resistance(1.4 x 10-8 ㎣/N·m) were obtained at the 1.4 kV. Then, the optimized DLC coating is applied as an sacrificial layer on the hard nitride coating to evaluate the performance and life of cutting tool. The Vickers hardness of the composite coatings were similar to those of the nitride coatings (AlCrN, AlTiSiN), but the friction coefficients were significantly reduced to 0.13 compared to 0.63 of nitride coatings. The drilling test were performed on S55C plate using a drilling machine at rotation speed of 2,500 rpm and penetration rate of 0.25 m/rev. The result showed that the wear width of the composite coated drills were 200 % lower than those of the AlCrN, AlTiSiN coated drills. In addition, the cutting forces of the composite coated drills were 13 and 15 % lower than that of AlCrN, AlTiSiN coated drills, respectively, as it reduced the aluminum clogging. Finally, the application of the DLC sacrificial layer prevents initial chipping through its low friction property and improves drilling quality with efficient chip removal.

• 마이크로전자및패키징학회지
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• 제22권4호
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• pp.65-70
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• 2015

히트 싱크용 소재에 응용할 목적으로 단층금속과 2층 단면구조 복합재료에 대해 열전도 특성을 연구하였다. 단층금속으로는 알루미늄합금(Al6061)을 사용했으며, 2층 단면구조 복합재료로는 Al6061기판에 질화알루미늄(AlN)을 스크린 인쇄한 층상구조 복합재료를 선택하였다. 섬광법으로 측정한 열확산계수와 비열 및 밀도를 사용해서 열전도도를 측정하였다. 실험을 통해 얻은 열전도 특성 값을 참고문헌에 보고된 자료를 사용해 계산한 값과 비교하였다. Al6061 기판에 스크린인쇄법으로 AlN 후막을 형성시킨 2층 단면구조 복합재료 시편의 열전도도는 AlN 후막의 두께가 증가할수록 선형적으로 감소하였다. 측정한 복합재료의 열전도도는 두께가 $53{\mu}m$과 $163{\mu}m$일 때, 각각 $114.1W/m{\cdot}K$와 $72.3W/m{\cdot}K$로 나타났다. 또한, 스크린 인쇄한 AlN 후막의 열전도도를 열전도비저항에 대한 혼합법칙을 적용해서 평가하였다. AlN 후막의 두께가 $53{\mu}m$와 $163{\mu}m$인 경우, 스크린 인쇄한 AlN 후막의 열전도도는 각각 $9.35W/m{\cdot}K$와 $12.40W/m{\cdot}K$로 나타났다.

• 한국세라믹학회지
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• 제42권1호
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• pp.69-75
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• 2005

고온자전연소법에 의한 질화알루미늄 합성에 있어서, 반응물(Al) 형상과 희석제(AlN) 입도 등의 형상학적 조건이 반응생성물에 미치는 영향을 조사하였다. 평균 입경(34$\mu$m)이 같은 두 종류의 Al 분말(입상, 편상)과 평균입경이 다른 4종류의 AM분말을 희석제로 사웅하여 반응 성형체를 준비하였다. 반응성형체의 충진밀도는 이론밀도의 $35\%로 고정하였고, 초기 질소압은 $1\~10MPa$, 희석을은 $0.4\~0.7$로 변화시키면서 반응을 실시하였다. 반응물과 희석제의 입도를 비슷하게 조절함으로써, 상대적으로 질소압이 낮은 1MPa의 조건에서도 순도 $98\% 이상, 입경 수십 $\mu$m의 AlN 합성이 가능함을 확인하였다. 이러한 고순도, 고입경화는 연소파 진행 후, 성형체 내부로 질소가스 투입 용이성의 차이에 의한 현상이라고 판단된다.

• 한국세라믹학회지
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• 제31권8호
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• pp.893-901
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• 1994

In this study, AlN powder of fine particle size and of high purity was synthesized by the carbothermal reduction-nitridation of monodisperse, spherical Al(OH)3 which had been prepared by sol-gel method using Al(O-sec-C4H9)3 as the starting material. Depending on the mixing order and kinds of reducing agents, the optimum condition for the preparation of AlN was determined as follows. AlN single-phase was produced by the carbothermal reduction-nitridation of (1) Benzene-washed Al(OH)3 and the reducing agent, carbon, which was mixed in a ball mill: for 5 hours at 140$0^{\circ}C$ under NH3 atmosphere; (2) The mixture prepared by hydrolysis of alkoxide solution into which carbon had been dispersed beforehand: for 5 hours at 135$0^{\circ}C$ ; (3) Al(OH)3 Poly(furfuryl alcohol) composite powder: for 2.5 hours at 135$0^{\circ}C$; (4) The mixture of Al(OH)3 and polyacrylonitrile: for 5 hours at 140$0^{\circ}C$. Addition of CaF2 increased the nitridation rate when carbon or polyacrylonitrile was used as the reducing agent; but it had no effect on the nitridation rate when furfuryl alcohol was used as the reducing agent.

• 한국전기전자재료학회논문지
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• 제23권10호
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• pp.759-762
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• 2010

In this investigation, the effects of $N_2/(Ar+N_2)$ gas partial pressure on the structural, electrical, and thermal properties of AlN dielectric layers prepared on aluminum substrates using RF-magnetron sputtering method were analyzed. Among the films, the AlN dielectric film deposited under $N_2/(Ar+N_2)$ gas partial pressure of 75% exhibit the highest AlN (002) preferred orientation, which was grain size of about 15.32 nm and very dense structure. We suggest the possibilities of it's application as a dielectric layer for metal PCB because the AlN films prepared at optimized gas partial pressure can improving the insulating property, the thermal conductivity, and thermal diffusivity of the films.

• 한국정밀공학회지
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• 제20권5호
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• pp.218-224
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• 2003

This paper describes a novel MEMS integration technique on a CMOS chip. MEMS integration on CMOS circuit has many advantages in view of manufacturing cost and reliability. The surface topography of a CMOS chip from a commercial foundry has 0.9 ${\mu}{\textrm}{m}$ bumps due to the conformal coating on aluminum interconnect patterns, which are used for addressing each MEMS element individually. Therefore, it is necessary to achieve a flat mirror-like CMOS chip fer the microelectromechanical system (MEMS) such as micro mirror array. Such CMOS chip needs an additional thickness of the dielectric passivation layer to ease the subsequent planarization process. To overcome a temperature limit from the aluminum thermal degradation, this study uses RF sputtering of silicon nitride at low temperature and then polishes the CMOS chip together with the surrounding dummy pieces to define a polishing plane. Planarization reduces 0.9 ${\mu}{\textrm}{m}$ of the bumps to less than 25 nm.

• 한국세라믹학회지
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• 제26권1호
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• pp.100-108
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• 1989

Aluminum hydroxides were prepared by the alkoxide hydrolysis method using Al-isopropoxide as a starting material and NH4OH as a catalytic agent. When Al-isopropoxide was hydrolyzed in a H2O-NH3 system, only Al(OH)3 was obtained over all pH values. However, AlOOH was formed besides Al(OH)3 when Al-isopropoxide was hydrolyzed in a H2O-NH3-isopropyl alcohol system. The AlOOH/Al(OH)3 ratio was increased as the isopropyl alcohol content was increased. The hydroxides, Al(OH)3 and AlOOH, obtained in this study and the commerical products, $\alpha$-Al2O3 and AlOOH were subjected to the carbothermal reduction and nitridation reaction to product AlN powder, using carbon black as a reducing agent under N2 atmosphere at various temperatures. AlN was synthesized from the obtained Al(OH)3 and the commercial AlOOH at 145$0^{\circ}C$, however, synthesized from the obtained AlOOH and the commercial alpha-alumina at 135$0^{\circ}C$. The temperature difference is assumed to be attributed to the reactivity of those powders. AlN powder prepared from the Al-isopropoxide was observed to have the narrower particle size distribution than that prepared from the commercial $\alpha$-Al2O3 or AlOOH.

• 한국분말재료학회지
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• 제12권3호
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• pp.214-219
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• 2005

In order to investigate the formation of AlN, mechanical alloying was carried out in $N_2$ and $NH_3$ atmosphere. Differential thermal analysis (DTA), x-ray diffraction (XRD) and chemical analysis were carried out to examine the formation behavior of aluminum nitrides. No diffraction pattern of AlN was observed in XRD analysis of the as-milled powders in $NH_3\;or\;N_2$ atmosphere. However, DTA and chemical analysis indicated that the precursors for AlN were formed in the Al powders milled in $NH_3$ atmosphere. The AlN precursors transformed to AlN after heat treatment at and above $600^{\circ}C$. It was considered that the reaction between Al and $NH_3$ was possible by the formation of fresh Al surface during mechanical alloying of Al powders.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2000년도 하계학술대회 논문집
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• pp.743-746
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• 2000

Metal-ferroelectric-insulator-semiconductor(MFIS) devices using Pt/$LiNbO_3$/Si structure were successfully fabricated. The dielectric constant of the AIN film calculated from the capacitance in the accumulation region in the capacitance-voltage(C-V) curve was about 8.2. The gate leakage current density of MIS devices using a aluminum electrode showed the least value of 1$\times$$1O^{-8}$A/$cm^2$ order at the electric field of 500kV/cm. The dielectric constant of $LiNbO_3$film on AIN/Si structure was about 23 derived from 1MHz capacitance-voltage (C-V) measurement and the resistivity of the film at the field of 500kV/cm was about 5.6$\times$ $1O^{13}$ $\Omega$.cm.

• 마이크로전자및패키징학회지
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• 제25권4호
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• pp.95-99
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• 2018

최근 고집적 고출력 전자 패키지의 효율적인 열전달을 위한 기판 및 방열소재로서 절연성 고열전도 필름의 수요가 커지고 있어, 알루미나, 질화알루미늄, 질화보론, 탄소나노튜브 및 그래핀 등의 고열전도 필러소재를 사용한 고방열 복합소재에 대한 많은 연구가 이루어지고 있다. 그 중에서도 육방정 질화보론(h-BN) 나노시트가 절연성 고열전도 필러 소재로서 유력한 후보 물질로 선택되고 있다. 본 연구는 이 h-BN 나노시트와 PVA로 된 세라믹/폴리머 복합체 필름의 방열특성 향상에 관한 것이다. h-BN 나노시트는 h-BN 플레이크 원료 분말을 유기용매를 사용한 볼밀링과 초음파 처리에 의한 물리적 박리공정으로 만들었으며, 이를 사용한 h-BN/PVA 복합 필름을 제조한 결과 성형된 복합필름의 면방향과 두께방향 열전도도는 50 vol%의 필러함량에서 각각 $2.8W/m{\cdot}K$ 및 $10W/m{\cdot}K$의 높은 열전도도가 나타났다. 이 복합필름을 PVA의 유리전이온도 이상에서 일축 가압하여 h-BN 판상분말의 얼라인먼트를 향상시킴으로써 면방향 열전도도를 최대 $13.5W/m{\cdot}K$까지 증가시킬 수 있었다.