• 한국정밀공학회지
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• 제16권5호통권98호
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• pp.98-103
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• 1999

The application field of porous mold is more and more expended. A mixture of alumina and cast iron is used for making porous mold using slip and vacuum casting method in this study. Slip casting is a process that slurry is poured into silicon rubber mold, dried in vacuum oven, debinded and sintered in furnace, In this procedure, slurry is composed of powder, binder, dispersion agent, and water. Vacuum casting is a technique for removing air bubbles existed in the slurry under vacuum condition. Since ceramics has a tendency of over-shrinkage after sintering, cast iron is used to compensate dimensional change. The results shows that sintering temperature has a great effect on characteristics of alumina-cast iron composite sintered parts. Finally ceramic-metal composite sintered mold can be used for aluminum alloy casting of shoe mold using this process.

• 한국전기전자재료학회논문지
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• 제32권6호
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• pp.483-489
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• 2019

For machine learning techniques, a large amount of high-quality material property data should be accumulated. In this study, several data for an alumina tape casting process were produced with the variables of slurry viscosity, gap size, and coating speed. The alumina tapes were manufactured in the range of 1,000~6,000 cps for slurry viscosity, $300{\sim}1,000{\mu}m$ for gap size, and 0.5~2.0 m/min for coating speed. As a result, the lower the viscosity, coating speed, and gap size, the more pore-free tapes could be manufactured. The viscosity of the slurry limited the minimum thickness of the tape. Green sheets with high packing density were manufactured from the slurry of 100~6,000 cps slurry viscosity, coating speed of 0.5 m/min, and a $300{\sim}500{\mu}m$ gap size.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2006년도 하계학술대회 논문집 Vol.7
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• pp.567-568
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• 2006

To investigate the recycle possibility of slurry for the oxide-chemical mechanical polishing (oxide-CMP) application, three kinds of retreated methods were introduced as follows: First, the effects on the addition of silica abrasives and the diluted silica slurry (DSS) on CMP performances were investigated. Second, the characteristics of mixed abrasive slurry (MAS) using non-annealed and annealed alumina ($Al_2O_3$) powder as an abrasive added within DSS were evaluated to achieve the improvement of removal rates (RRs) and within-wafer non-uniformity (WIWNU%). Third, the oxide-CMP wastewater was examined in order to evaluate the possible ways of reusing it. And then, we have discussed the CMP characteristics of silica slurry retreated by mixing of original slurry and used slurry (MOS).

• 한국세라믹학회지
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• 제39권2호
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• pp.164-170
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• 2002

Acrylate 수계 결합제를 사용한 알루미나 테이프 캐스팅용 슬러리의 완전분산을 위한 최적의 분산제와 분산제량을 결정하기 위해 침강실험, 분말 함유량 실험, 점도 및 zeta 전위 측정을 행하였다. 알루미나 슬러리의 완전분산은 분산제를 polycarboxylic acid로 했을 때 얻어졌으며, 최적의 첨가량은 알루미나 100에 대하여 0.23∼0.24g 이었다. 분말에 대한 분산제량이 증가할수록 분산은 잘 이루어졌으나, 일정량 이상이 첨가되면 분산제가 용매 안에 과잉으로 존재하여 분산을 저해하는 요인으로 작용하였다. 테이프 캐스팅용 슬러리는 100g의 알루미나 분말에 0.2g의 polycarboxylic acid를 첨가하였을 때 분산 및 테이프 특성이 가장 우수하였고, 이 때 혼합한 결합제는 acrylate였고, 가소제는 Benzoflex를 사용하였다. 이 때 슬러리 최적 점도는 약 570 cps였고, 테이프 내 알루미나 량은 57 vol%이었다.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2002년도 춘계 기술심포지움 논문집
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• pp.274-278
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• 2002

The purpose of this study was to characterize the reaction of Cu surface with Cu slurry and CMP performance as a function of additives in CMP slurry. The polish rate of Cu was dependent on the kind of organic acids added in slurry. It was considered that polish rate of Cu was dependent on the concentration of carboxylates and mean particle size. When the etchant and oxidant were added in slurry, the highest removal rate and lower etch rate were measured at neutral pH. The addition of etchant, oxidant and pH adjustor played key roles of CMP ability in slurry. As the pH increased, polish rate of Cu was increased by the enhanced the mechanical effects due to effective dispersion of slurry particles. Alumina abrasives was more desirable for 1st step slurry because of high removal rate of Cu and high selectivity ratio among TaN and Cu.

• 한국세라믹학회지
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• 제47권2호
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• pp.151-156
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• 2010

Porous mullite/alumina composites have been fabricated by a freeze casting technique using TBA-based coal fly ash/alumina slurry. After sintering, unidirectional macropore channels aligned regularly along the TBA ice growth direction were developed; simultaneously, small sized micropores fromed in the outer walls of the pore channels. The physical and mechanical properties (e.g. porosity and compressive strength) of the sintered porous composites were roughly dependant of processing conditions, due to the complexity of the factors affecting them. However, with increasing solid loading and sintering temperature, the compressive strength generally increased and the porosity decreased. After sintering $1500^{\circ}C$ for 2 h, the porous specimen (porosity: 52.1%) showed a maximum compressive strength of 70.0 MPa.

• 한국전기전자재료학회논문지
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• 제17권2호
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• pp.156-161
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• 2004

We investigated the effects of oxidizer additive on the performance of Cu-CMP process using commonly used tungsten slurry. In order to compare the removal rate and non-uniformity as a function of oxidizer contents, we used alumina-based tungsten slurry and copper blanket wafers deposited by DC sputtering method. According to the CMP removal rates and particle size distribution, and the microstructures of surface layer by SEM image as a function or oxidizer contents were greatly influenced by the slurry chemical composition of oxidizers. The difference in removal rate and roughness of copper surface are believed to cause by modification in the mechanical behavior of $Al_2$O$_3$abrasive particles in CMP slurry.

• 한국재료학회지
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• 제16권12호
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• pp.731-738
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• 2006

It is seriously considered using Al CMP (chemical mechanical planarization) process for the next generation 45 nm Al wiring process. Al CMP is known that it has a possibility of reducing process time and steps comparing with conventional RIE (reactive ion etching) method. Also, it is more cost effective than Cu CMP and better electrical conductivity than W via process. In this study, we investigated 4 different kinds of slurries based on abrasives for reducing scratches which contributed to make defects in Al CMP. The abrasives used in this experiment were alumina, fumed silica, alkaline colloidal silica, and acidic colloidal silica. Al CMP process was conducted as functions of abrasive contents, $H_3PO_4$ contents and pressures to find out the optimized parameters and conditions. Al removal rates were slowed over 2 wt% of slurry contents in all types of slurries. The removal rates of alumina and fumed silica slurries were increased by phosphoric acid but acidic colloidal slurry was slightly increased at 2 vol% and soon decreased. The excessive addition of phosphoric acid affected the particle size distributions and increased scratches. Polishing pressure increased not only the removal rate but also the surface scratches. Acidic colloidal silica slurry showed the highest removal rate and the lowest roughness values among the 4 different slurry types.

• 한국전기전자재료학회논문지
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• 제17권2호
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• pp.138-143
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• 2004

CMP (Chemical Mechanical Polishing) technology for global planarization of multilevel interconnection structure has been widely studied for the next generation devices. Among the consumables for CMP process, especially, slurry and their chemical compositions play a very important role in the removal rates and within-wafer non-uniformity (WIWNU) for global planarization ability of CMP process. However, CMP slurries contain abrasive particles exceeding 1 ${\mu}{\textrm}{m}$ size, which can cause micro-scratch on the wafer surface after CMP process. Such a large size particle in these slurries may be caused by particle agglomeration in slurry supply-line. In this work, to investigate the effects of agglomeration on the performance of oxide CMP slurry, we have studied an aging effect of silica slurry as a function of particle size distribution and aging time during one month. We Prepared and compared the self-developed silica slurry by adding of alumina powders. Also, we have investigated the oxide CMP characteristics. As an experimental result, we could be obtained the relatively stable slurry characteristics comparable to aging effect of original silica slurry. Consequently, we can expect the saving of high-cost slurry.

• 청정기술
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• 제25권3호
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• pp.256-262
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• 2019

Hydroxylammonium nitrate (HAN) 기반 액상 추진제는 발암물질이 아니며 연소가스 또한 독성이 거의 없어서 환경 친화적인 추진제로 주목을 받고 있다. 추력기에서 HAN 기반 액체추진제를 분해하는데 사용되는 촉매는 저온 활성 및 고내열성을 동시에 보유하고 있어야 한다. 본 연구의 목적은 metal foam 표면에 alumina slurry를 wash coating 방법으로 담지한 후, 루테늄(ruthenium) 전구체를 그 위에 담지하여 Ru/alumina/metal foam 촉매를 제조하고, 이 촉매의 HAN 수용액 분해 활성을 평가하는 것이다. Wash coating 방법으로 metal foam 지지체에 알루미나를 담지시키는 과정에서 wash coating 반복 횟수가 alumina/metal foam의 물리적 특성에 미치는 영향을 분석하였다. 알루미나 wash coating 횟수가 증가할수록 약 7 nm의 직경을 갖는 메조기공이 지속적으로 발달하여 표면적과 기공 부피가 증가하는데, metal foam에 알루미나를 코팅하는 과정을 12 회 반복하는 것이 최적이라고 판단하였다. 이 지지체에 Ru을 담지한 Ru/alumina/metal foam 촉매의 표면에도 메조기공이 잘 발달하였다. 활성금속과 알루미나를 담지하지 않은 metal foam 자체만으로도 HAN 수용액의 분해반응을 촉진할 수 있음을 알 수 있었다. Ru/alumina/metal foam-550촉매의 경우는 열분해 반응에 비해서 분해개시온도를 큰 폭으로 낮추었고, ${\Delta}P$를 크게 증가시킬 수 있어서, HAN 수용액 분해 반응에서 우수한 활성을 보였다. 그러나 이 촉매를 $1,200^{\circ}C$에서 소성하면 반응 활성이 저하되는데 이는 촉매의 표면적과 기공 부피가 급격하게 감소하고 Ru이 소결되기 때문이다. 추가적인 연구를 통해서 Ru/alumina/metal foam의 내열성을 개선할 필요성이 있다.