• Title/Summary/Keyword: Alignment optimization

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Design Optimization of Planar 3-DOF Parallel Manipulator for Alignment of Micro-Components (마이크로 부품 조립을 위한 평면 3 자유도 병렬 정렬기의 최적설계)

  • Lee, Jeong-Jae;Song, Jun-Yeob;Lee, Moon-G.
    • Journal of the Korean Society of Manufacturing Technology Engineers
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    • v.20 no.3
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    • pp.322-328
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    • 2011
  • This paper presents inverse kinematics and workspace analysis of a planar three degree-of-freedom (DOF) parallel manipulator. Furthermore, optimization problem of the manipulator is presented. The manipulator adopts PRR (Prismatic-Revolute-Revolute) mechanism and the prismatic actuators are fixed to the base. This leads to a reduction of the inertia of the moving links and hence enables it to move with high speed. The actuators are linear electric motors. First, the mechanism based on the geometry of the manipulator is introduced. Second, a workspace analysis is performed. Finally, design optimization is carried out to have large workspace. The proposed approach can be applied to the design optimization of various three DOF parallel manipulators in order to maximize their workspace. The performance of mechanism is improved and satisfies the requirements of workspace to align micro-components.

A Study on the Imprinting Process for an Optical Interconnection of PLC Device (광소자의 광 정렬 및 연결 구조 구현용 임프린트 공정 연구)

  • Kim, Young Sub;Cho, Sang Uk;Kang, Ho Ju;Jeong, Myung Yung
    • Journal of the Korean Society for Precision Engineering
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    • v.29 no.12
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    • pp.1376-1381
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    • 2012
  • Optical devices are used extensively in the field of information network. Increasing demand for optical device, optical interconnection has been a important issue for commercialization. However many problems exist in the interconnection between optical device and optical fiber, and in the case of the multi-channel, problems of the optical alignment and optical array arise. For solving the alignment and array problem of optical device and the optical fiber, we fabricated fiber alignment and array by using imprint technology. Achieved higher precision of optical fiber alignment and array due to fabricating using imprint technology. The silicon stamp with different depth was fabricated using the conventional photolithography. Using the silicon stamp, a nickel stamp was fabricated by electroforming process. We conducted imprint process using the nickel stamp with different depth. The optical alignment and array by fabricating the patterns of optical device and fiber alignment and array using imprint process, and achieved higher precision of decreasing the dimensional error of the patterns by optimization of process. The fabricated optical interconnection of PLC device was measured 3.9 dB and 4.2 dB, lower than criteria specified by international standard.

Optical Packaging and Interconnection Technology (광 패키징 및 인터커넥션 기술)

  • Kim, Dong Min;Ryu, Jin Hwa;Jeong, Myung Yung
    • Journal of the Microelectronics and Packaging Society
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    • v.19 no.4
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    • pp.13-18
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    • 2012
  • By the need for high-speed data transmission in PCB, the studies on the optical PCB has been conducted with optical interconnection and its packaging technology. Particularly, the polymer-based optical interconnection has been extensively studied with the advantages such as cost-effective and ease of process. For high-efficiency and passive alignment, the studies were performed using the 45 degree mirrors, MT connector, and etc. In this work, integrated PLC device and fiber alignment array block was fabricated by using imprint technology to solve the alignment and array problem of optical device and the optical fiber. The fabricated integrated block for optical interconnection of PLC device has achieved higher precision of decreasing the dimensional error of the patterns by optimization of process and its insertion loss has an average value of 4.03dB, lower than criteria specified by international standard. In addition, a optical waveguide with built-in lens has been proposed for high-efficiency and passive alignment. By simulation, it was confirmed that the proposed structure has higher coupling efficiency than conventional no-lens structure and has the broad tolerance for the spatial offset of optical waveguide.

Optimum Rotor Shaping for Torque Improvement of Double Stator Switched Reluctance Motor

  • Tavakkoli, Mohammadali;Moallem, Mehdi
    • Journal of Electrical Engineering and Technology
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    • v.9 no.4
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    • pp.1315-1323
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    • 2014
  • Although the power density in Double Stator Switched Reluctance Motor (DSSRM) has been improved, the torque ripple is still very high. So, it is important to reduce the torque ripple for specific applications such as Electric Vehicles (EVs). In This paper, an effective rotor shaping optimization technique for torque ripple reduction of DSSRM is presented. This method leads to the lower torque pulsation without significant reduction in the average torque. The method is based on shape optimization of the rotor using Finite Element Method and Taguchi's optimization method for rotor reshaping for redistribution of the flux so that the phase inductance profile has smoother variation as the rotor poles move into alignment with excited stator poles. To check on new design robustness, mechanical analysis was used to evaluate structural conformity against local electromagnetic forces which cause vibration and deformation. The results show that this shape optimization technique has profound effect on the torque ripple reduction.

A case study on the optimal shafting alignment concerning bearing stiffness for 10,100 TEU container carrier (베어링 강성을 고려한 10,100 TEU 컨테이너 운반선의 최적 추진축계 배치에 관한 사례 연구)

  • Lee, Jae-Ung
    • Journal of Advanced Marine Engineering and Technology
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    • v.40 no.3
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    • pp.185-190
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    • 2016
  • Damages of the main engine aftmost bearing and the after stern tube bearing tend to increase due to misalignment. And as the shafting system becomes stiffer due to the large engine power, whereas the hull structure becomes more flexible due to optimization by using high tensile thin steel plates. And this is the reason that more sophisticated shaft alignments are required. In this study, the optimum shafting alignment calculation was carried out, considering the thermal expansion effect, exploiting the sensitivity index, which indicates the reasonable position of forward intermediate shaft bearing for shaft alignment. and as the main subject in this study, the elastic deformation on intermediate shaft and main engine bearings occurred by vertical load of shaft mass were examined thoroughly and analyzed allowable load of bearings, reaction influence numbers of all bearings. As the result, a reliable optimum shafting alignment was derived theoretically. To verify these results, they were referred to the engine maker's technical information of main engine installation and being used shafting alignment programs of both Korean Register of Shipping and Det Norske Veritas, their reliability were reviewed.

A Study of Flexible Protein Structure Alignment Using Three Dimensional Local Similarities (단백질 3차원 구조의 지역적 유사성을 이용한 Flexible 단백질 구조 정렬에 관한 연구)

  • Park, Chan-Yong;Hwang, Chi-Jung
    • The KIPS Transactions:PartB
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    • v.16B no.5
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    • pp.359-366
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    • 2009
  • Analysis of 3-dimensional (3D) protein structure plays an important role of structural bioinformatics. The protein structure alignment is the main subjects of the structural bioinformatics and the most fundamental problem. Protein Structures are flexible and undergo structural changes as part of their function, and most existing protein structure comparison methods treat them as rigid bodies, which may lead to incorrect alignment. We present a new method that carries out the flexible structure alignment by means of finding SSPs(Similar Substructure Pairs) and flexible points of the protein. In order to find SSPs, we encode the coordinates of atoms in the backbone of protein into RDA(Relative Direction Angle) using local similarity of protein structure. We connect the SSPs with Floyd-Warshall algorithm and make compatible SSPs. We compare the two compatible SSPs and find optimal flexible point in the protein. On our well defined performance experiment, 68 benchmark data set is used and our method is better than three widely used methods (DALI, CE, FATCAT) in terms of alignment accuracy.

Implementation and Analysis of Railway Design Model using ei-Rail with Joong-Ang and Seo-Hae Lines (ei-Rail을 활용한 노선설계 모형의 적용 및 중앙선/서해안선 사례분석)

  • Shin, Youngho;Kim, Jeong Hyun;Oh, Jitaek
    • KSCE Journal of Civil and Environmental Engineering Research
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    • v.35 no.2
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    • pp.407-415
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    • 2015
  • The railway route and alignment planning have been executed with a limited number of alternatives based on the site pre-survey and the topographic map. This study developed an intelligent railway alignment planning program (ei-Rail) which can derive all the considerable design alternatives and provide the data for the alternative evaluation such as constructions cost, operation cost, and etc. According to the comparisons with prevailing planned railway projects, the time and cost for planning can be reduced as well as the construction costs. This program may contribute to the development of railway industry by reducing the time and cost for planning as well as the total project cost.

Micro-bump Joining Technology for 3 Dimensional Chip Stacking (반도체 3차원 칩 적층을 위한 미세 범프 조이닝 기술)

  • Ko, Young-Ki;Ko, Yong-Ho;Lee, Chang-Woo
    • Journal of the Korean Society for Precision Engineering
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    • v.31 no.10
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    • pp.865-871
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    • 2014
  • Paradigm shift to 3-D chip stacking in electronic packaging has induced a lot of integration challenges due to the reduction in wafer thickness and pitch size. This study presents a hybrid bonding technology by self-alignment effect in order to improve the flip chip bonding accuracy with ultra-thin wafer. Optimization of Cu pillar bump formation and evaluation of various factors on self-alignment effect was performed. As a result, highly-improved bonding accuracy of thin wafer with a $50{\mu}m$ of thickness was achieved without solder bridging or bump misalignment by applying reflow process after thermo-compression bonding process. Reflow process caused the inherently-misaligned micro-bump to be aligned due to the interface tension between Si die and solder bump. Control of solder bump volume with respect to the chip dimension was the critical factor for self-alignment effect. This study indicated that bump design for 3D packaging could be tuned for the improvement of micro-bonding quality.

Feature Selection via Embedded Learning Based on Tangent Space Alignment for Microarray Data

  • Ye, Xiucai;Sakurai, Tetsuya
    • Journal of Computing Science and Engineering
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    • v.11 no.4
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    • pp.121-129
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    • 2017
  • Feature selection has been widely established as an efficient technique for microarray data analysis. Feature selection aims to search for the most important feature/gene subset of a given dataset according to its relevance to the current target. Unsupervised feature selection is considered to be challenging due to the lack of label information. In this paper, we propose a novel method for unsupervised feature selection, which incorporates embedded learning and $l_{2,1}-norm$ sparse regression into a framework to select genes in microarray data analysis. Local tangent space alignment is applied during embedded learning to preserve the local data structure. The $l_{2,1}-norm$ sparse regression acts as a constraint to aid in learning the gene weights correlatively, by which the proposed method optimizes for selecting the informative genes which better capture the interesting natural classes of samples. We provide an effective algorithm to solve the optimization problem in our method. Finally, to validate the efficacy of the proposed method, we evaluate the proposed method on real microarray gene expression datasets. The experimental results demonstrate that the proposed method obtains quite promising performance.