• 제목/요약/키워드: Alignment optimization

검색결과 95건 처리시간 0.024초

마이크로 부품 조립을 위한 평면 3 자유도 병렬 정렬기의 최적설계 (Design Optimization of Planar 3-DOF Parallel Manipulator for Alignment of Micro-Components)

  • 이정재;송준엽;이문구
    • 한국생산제조학회지
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    • 제20권3호
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    • pp.322-328
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    • 2011
  • This paper presents inverse kinematics and workspace analysis of a planar three degree-of-freedom (DOF) parallel manipulator. Furthermore, optimization problem of the manipulator is presented. The manipulator adopts PRR (Prismatic-Revolute-Revolute) mechanism and the prismatic actuators are fixed to the base. This leads to a reduction of the inertia of the moving links and hence enables it to move with high speed. The actuators are linear electric motors. First, the mechanism based on the geometry of the manipulator is introduced. Second, a workspace analysis is performed. Finally, design optimization is carried out to have large workspace. The proposed approach can be applied to the design optimization of various three DOF parallel manipulators in order to maximize their workspace. The performance of mechanism is improved and satisfies the requirements of workspace to align micro-components.

광소자의 광 정렬 및 연결 구조 구현용 임프린트 공정 연구 (A Study on the Imprinting Process for an Optical Interconnection of PLC Device)

  • 김영섭;조상욱;강호주;정명영
    • 한국정밀공학회지
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    • 제29권12호
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    • pp.1376-1381
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    • 2012
  • Optical devices are used extensively in the field of information network. Increasing demand for optical device, optical interconnection has been a important issue for commercialization. However many problems exist in the interconnection between optical device and optical fiber, and in the case of the multi-channel, problems of the optical alignment and optical array arise. For solving the alignment and array problem of optical device and the optical fiber, we fabricated fiber alignment and array by using imprint technology. Achieved higher precision of optical fiber alignment and array due to fabricating using imprint technology. The silicon stamp with different depth was fabricated using the conventional photolithography. Using the silicon stamp, a nickel stamp was fabricated by electroforming process. We conducted imprint process using the nickel stamp with different depth. The optical alignment and array by fabricating the patterns of optical device and fiber alignment and array using imprint process, and achieved higher precision of decreasing the dimensional error of the patterns by optimization of process. The fabricated optical interconnection of PLC device was measured 3.9 dB and 4.2 dB, lower than criteria specified by international standard.

광 패키징 및 인터커넥션 기술 (Optical Packaging and Interconnection Technology)

  • 김동민;류진화;정명영
    • 마이크로전자및패키징학회지
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    • 제19권4호
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    • pp.13-18
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    • 2012
  • By the need for high-speed data transmission in PCB, the studies on the optical PCB has been conducted with optical interconnection and its packaging technology. Particularly, the polymer-based optical interconnection has been extensively studied with the advantages such as cost-effective and ease of process. For high-efficiency and passive alignment, the studies were performed using the 45 degree mirrors, MT connector, and etc. In this work, integrated PLC device and fiber alignment array block was fabricated by using imprint technology to solve the alignment and array problem of optical device and the optical fiber. The fabricated integrated block for optical interconnection of PLC device has achieved higher precision of decreasing the dimensional error of the patterns by optimization of process and its insertion loss has an average value of 4.03dB, lower than criteria specified by international standard. In addition, a optical waveguide with built-in lens has been proposed for high-efficiency and passive alignment. By simulation, it was confirmed that the proposed structure has higher coupling efficiency than conventional no-lens structure and has the broad tolerance for the spatial offset of optical waveguide.

Optimum Rotor Shaping for Torque Improvement of Double Stator Switched Reluctance Motor

  • Tavakkoli, Mohammadali;Moallem, Mehdi
    • Journal of Electrical Engineering and Technology
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    • 제9권4호
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    • pp.1315-1323
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    • 2014
  • Although the power density in Double Stator Switched Reluctance Motor (DSSRM) has been improved, the torque ripple is still very high. So, it is important to reduce the torque ripple for specific applications such as Electric Vehicles (EVs). In This paper, an effective rotor shaping optimization technique for torque ripple reduction of DSSRM is presented. This method leads to the lower torque pulsation without significant reduction in the average torque. The method is based on shape optimization of the rotor using Finite Element Method and Taguchi's optimization method for rotor reshaping for redistribution of the flux so that the phase inductance profile has smoother variation as the rotor poles move into alignment with excited stator poles. To check on new design robustness, mechanical analysis was used to evaluate structural conformity against local electromagnetic forces which cause vibration and deformation. The results show that this shape optimization technique has profound effect on the torque ripple reduction.

베어링 강성을 고려한 10,100 TEU 컨테이너 운반선의 최적 추진축계 배치에 관한 사례 연구 (A case study on the optimal shafting alignment concerning bearing stiffness for 10,100 TEU container carrier)

  • 이재웅
    • Journal of Advanced Marine Engineering and Technology
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    • 제40권3호
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    • pp.185-190
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    • 2016
  • 선박이 고출력화, 초대형화 됨에 따라 대형저속 2행정 엔진을 탑재한 선박에서 축계배치의 잘못에 기인하는 주기관 선미측 베어링과, 선미관 후부 베어링의 손상이 증가하는 경향이 있다. 또한 고출력화에 의한 추진축의 강성은 증가한 반면에 선체는 고장력 후판을 사용하므로 이전의 선체보다 훨씬 더 쉽게 변형하는 실정이다. 이는 기존의 선박보다 더욱 정교한 축계배치가 요구됨을 의미한다. 본 연구에서는 열팽창 효과, 감도지수를 이용한 중간축 베어링의 최적위치 선정 및 베어링의 강성을 고려하여, 베어링의 하중 분석 및 영향 계수를 분석함으로서 축계 배치가 이론적으로 최적이 되는 것을 검토하였다. 이를 위하여 축계 배치 계산시 대형 엔진 제조사의 엔진 거치기준을 참조하고, 한국선급 및 DnV 선급의 축계 배치 프로그램을 이용하여 검토하고 그 신뢰성을 검증하였다.

단백질 3차원 구조의 지역적 유사성을 이용한 Flexible 단백질 구조 정렬에 관한 연구 (A Study of Flexible Protein Structure Alignment Using Three Dimensional Local Similarities)

  • 박찬용;황치정
    • 정보처리학회논문지B
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    • 제16B권5호
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    • pp.359-366
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    • 2009
  • 구조적 생물 정보학 분야는 단백질의 3차원 구조를 대상으로 단백질을 연구하는 분야이며, 본 논문에서는 구조적 생물 정보학 분야의 핵심 연구 주제중의 하나인 Flexible 단백질 구조 정렬에 관한 새로운 알고리즘을 제시한다. Flexible 단백질 구조 정렬을 위하여, 단백질의 3차원 구조의 지역적인 유사성을 이용하여 두 단백질의 유사한 부분 구조를 추출해 내고, 이 추출된 유사 구조간에 연결 가능성을 검색하여 정렬이 가능한 모든 유사 구조를 찾고, 이 유사 구조에 꺽임점을 도입하여 Flexible 단백질 구조 정렬을 수행하였다. 이 과정에서 단백질의 지역적 유사성을 정확히 비교하기 위하여 RDA를 이용한 방법을 제안하였고, Flexible 단백질 구조 정렬시 신뢰성 있는 꺽임점 위치 선정 방법과 그래프를 이용한 최적화 방법을 제안하였다. 성능 평가를 위하여 다양한 방법으로 Flexible 단백질 구조 정렬의 성능 평가를 수행하였고, 기존의 방법인 DALI, CE, FATCAT 보다 성능의 우수함을 나타내었다.

ei-Rail을 활용한 노선설계 모형의 적용 및 중앙선/서해안선 사례분석 (Implementation and Analysis of Railway Design Model using ei-Rail with Joong-Ang and Seo-Hae Lines)

  • 신영호;김정현;오지택
    • 대한토목학회논문집
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    • 제35권2호
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    • pp.407-415
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    • 2015
  • 철도사업을 추진함에 있어, 지금까지 대부분의 사업은 노선과 선형계획은 엔지니어가 현장 사전조사 결과 및 지형도 등을 이용하여 한정된 수의 대안을 설정하여 분석하는 방식으로 수행되어 왔다. 본 연구에서는 유전자 알고리즘을 이용한 지능형 철도선형계획 프로그램(ei-Rail)을 개발하여, 가능한 모든 대안에 대하여 선형요소 및 공사비에 대한 평가를 가능하게 하였다. 그리고 기존에 계획된 노선에 대한 비교 평가를 통하여 기존 대안보다 사업비를 절감할 수 있을 뿐만 아니라, 이에 소요되는 비용과 시간도 단축할 수 있는 것으로 나타났다. 본 연구의 결과는 향후 국내외 철도사업 계획 수립에 소요되는 비용과 시간, 그리고 전체 사업비 절감을 가능케 함으로써 철도분야 발전에 도움이 될 수 있을 것으로 기대할 수 있다.

반도체 3차원 칩 적층을 위한 미세 범프 조이닝 기술 (Micro-bump Joining Technology for 3 Dimensional Chip Stacking)

  • 고영기;고용호;이창우
    • 한국정밀공학회지
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    • 제31권10호
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    • pp.865-871
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    • 2014
  • Paradigm shift to 3-D chip stacking in electronic packaging has induced a lot of integration challenges due to the reduction in wafer thickness and pitch size. This study presents a hybrid bonding technology by self-alignment effect in order to improve the flip chip bonding accuracy with ultra-thin wafer. Optimization of Cu pillar bump formation and evaluation of various factors on self-alignment effect was performed. As a result, highly-improved bonding accuracy of thin wafer with a $50{\mu}m$ of thickness was achieved without solder bridging or bump misalignment by applying reflow process after thermo-compression bonding process. Reflow process caused the inherently-misaligned micro-bump to be aligned due to the interface tension between Si die and solder bump. Control of solder bump volume with respect to the chip dimension was the critical factor for self-alignment effect. This study indicated that bump design for 3D packaging could be tuned for the improvement of micro-bonding quality.

Feature Selection via Embedded Learning Based on Tangent Space Alignment for Microarray Data

  • Ye, Xiucai;Sakurai, Tetsuya
    • Journal of Computing Science and Engineering
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    • 제11권4호
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    • pp.121-129
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    • 2017
  • Feature selection has been widely established as an efficient technique for microarray data analysis. Feature selection aims to search for the most important feature/gene subset of a given dataset according to its relevance to the current target. Unsupervised feature selection is considered to be challenging due to the lack of label information. In this paper, we propose a novel method for unsupervised feature selection, which incorporates embedded learning and $l_{2,1}-norm$ sparse regression into a framework to select genes in microarray data analysis. Local tangent space alignment is applied during embedded learning to preserve the local data structure. The $l_{2,1}-norm$ sparse regression acts as a constraint to aid in learning the gene weights correlatively, by which the proposed method optimizes for selecting the informative genes which better capture the interesting natural classes of samples. We provide an effective algorithm to solve the optimization problem in our method. Finally, to validate the efficacy of the proposed method, we evaluate the proposed method on real microarray gene expression datasets. The experimental results demonstrate that the proposed method obtains quite promising performance.