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A Study on the Imprinting Process for an Optical Interconnection of PLC Device

광소자의 광 정렬 및 연결 구조 구현용 임프린트 공정 연구

  • Kim, Young Sub (Department of Cogno-Mechatronics Engineering, Pusan Nat'l Univ.) ;
  • Cho, Sang Uk (Department of Cogno-Mechatronics Engineering, Pusan Nat'l Univ.) ;
  • Kang, Ho Ju (Department of Cogno-Mechatronics Engineering, Pusan Nat'l Univ.) ;
  • Jeong, Myung Yung (Department of Cogno-Mechatronics Engineering, Pusan Nat'l Univ.)
  • 김영섭 (부산대학교 인지메카트로닉스공학과) ;
  • 조상욱 (부산대학교 인지메카트로닉스공학과) ;
  • 강호주 (부산대학교 인지메카트로닉스공학과) ;
  • 정명영 (부산대학교 인지메카트로닉스공학과)
  • Received : 2012.08.08
  • Accepted : 2012.09.25
  • Published : 2012.12.01

Abstract

Optical devices are used extensively in the field of information network. Increasing demand for optical device, optical interconnection has been a important issue for commercialization. However many problems exist in the interconnection between optical device and optical fiber, and in the case of the multi-channel, problems of the optical alignment and optical array arise. For solving the alignment and array problem of optical device and the optical fiber, we fabricated fiber alignment and array by using imprint technology. Achieved higher precision of optical fiber alignment and array due to fabricating using imprint technology. The silicon stamp with different depth was fabricated using the conventional photolithography. Using the silicon stamp, a nickel stamp was fabricated by electroforming process. We conducted imprint process using the nickel stamp with different depth. The optical alignment and array by fabricating the patterns of optical device and fiber alignment and array using imprint process, and achieved higher precision of decreasing the dimensional error of the patterns by optimization of process. The fabricated optical interconnection of PLC device was measured 3.9 dB and 4.2 dB, lower than criteria specified by international standard.

Keywords

References

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