• 제목/요약/키워드: AlN layer

검색결과 731건 처리시간 0.028초

전도성 고분자를 Buffer층으로 사용한 유기 발광 소자의 제작과 특성 연구 (Characteristics of organic electroluminescent devices using conducting polymer materials with buffer layers)

  • 이호식;박종욱;김태완;강도열
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 1998년도 추계학술대회 논문집
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    • pp.125-128
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    • 1998
  • Electroluminescent(EL) devices based on organic thin films have attracted lots of interests in large-area light-emitting display. One of the problems of such device is a lifetime, where a degradation of the cell is possibly due to an organic layer's thickness, morphology and interface with electrode. In this study, light-emitting organic electroluminescent devices were fabricated using Alq$_3$(8-hydroxyquinolinate aluminum) and TPD(N,N'-diphenyl-N,N'-bis(3-methylphenyl)-[1-1'-biphenyl]-4,4'-diamine).Where Alq$_3$ is an electron-transport and emissive layer, TPD is a hole-transport layer. The cell structure is ITO/TPD/Alq$_3$/Al and the cell is fabricated by vacuum evaporation method. In a measurement of current-voltage characteristics, we obtained a turn-on voltage at about 9 V. And we used other buffer layer of PPy(Polypyrrole) with ITO/PPy/TPD/Alq$_3$/Al structure. We observed a surface morphology by AFM(Atomic Force Microscopy), UV/visible absorption spectrum, and PL(Photoluminescence) spectrum. We obtained the UV/visible absorption peak at 358nm in TPD and at 359nm in Alq$_3$, and at 225nm and the PL peaks at 410nm in TPD and at 510nm in Alq$_3$ and at 350nm. We also studied EL spectrum in the cell structure of ITO/TPD/Alq$_3$/Al and ITO/PPy/TPD/Alq$_3$/Al and we observed the EL spectrum peak at 510nm from our cell

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DRAM에서 $Al_2O_3$를 식각 정지막으로 이용한 레지스터 형성에 관한 연구 (Study on the Resistor Formation using an $Al_2O_3$ Etch-Stop Layer in DRAM)

  • 박종표;김길호
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2005년도 하계학술대회 논문집 Vol.6
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    • pp.153-156
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    • 2005
  • 원자층 증착 (atomic layer deposit : ALD) 방식으로 증착한 $Al_2O_3$의 건식식각 특성을 연구하였다. 전자 싸이클로트론 공진 (electron cyclotron resonance : ECR) 방식의 건식식각장치에서 source power, bias power, 압력 그리고 $Cl_2$ 가스를 변수로 하여 $Al_2O_3$의 식각속도와 Poly-Si 의 $Al_2O_3$에 대한 선택비를 측정하였다. bias power가 감소할수록 그리고 압력이 증가할수록 $Al_2O_3$의 식각속도는 감소하였고 Poly-Si 의 $Al_2O_3$에 대한 선택비는 증가하였다. 이 특성을 이용하여 TiN/$Al_2O_3$/Poly-Si 구조의 캐패시터와 Periphery 회로영역의 레지스터를 $Al_2O_3$를 식각 정지막으로 이용하여 구현하였다.

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Ridge Formation by Dry-Etching of Pd and AlGaN/GaN Superlattice for the Fabrication of GaN Blue Laser Diodes

  • 김재관;이동민;박민주;황성주;이성남;곽준섭;이지면
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2012년도 제42회 동계 정기 학술대회 초록집
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    • pp.391-392
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    • 2012
  • In these days, the desire for the precise and tiny displays in mobile application has been increased strongly. Currently, laser displays ranging from large-size laser TV to mobile projectors, are commercially available or due to appear on the market [1]. In order to achieve a mobile projectors, the semiconductor laser diodes should be used as a laser source due to their size and weight. In this presentation, the continuous etch characteristics of Pd and AlGaN/GaN superlattice for the fabrication of blue laser diodes were investigated by using inductively coupled $CHF_3$ and $Cl_2$ -based plasma. The GaN laser diode samples were grown on the sapphire (0001) substrate using a metal organic chemical vapor deposition system. A Si-doped GaN layer was grown on the substrate, followed by growth of LD structures, including the active layers of InGaN/GaN quantum well and barriers layer, as shown in other literature [2], and the palladium was used as a p-type ohmic contact metal. The etch rate of AlGaN/GaN superlattice (2.5/2.5 nm for 100 periods) and n-GaN by using $Cl_2$ (90%)/Ar (10%) and $Cl_2$ (50%)/$CHF_3$ (50%) plasma chemistry, respectively. While when the $Cl_2$/Ar plasma were used, the etch rate of AlGaN/GaN superlattice shows a similar etch rate as that of n-GaN, the $Cl_2/CHF_3$ plasma shows decreased etch rate, compared with that of $Cl_2$/Ar plasma, especially for AlGaN/GaN superlattice. Furthermore, it was also found that the Pd which is deposited on top of the superlattice couldn't be etched with $Cl_2$/Ar plasma. It was indicating that the etching step should be separated into 2 steps for the Pd etching and the superlattice etching, respectively. The etched surface of stacked Pd/superlattice as a result of 2-step etching process including Pd etching ($Cl_2/CHF_3$) and SLs ($Cl_2$/Ar) etching, respectively. EDX results shows that the etched surface is a GaN waveguide free from the Al, indicating the SLs were fully removed by etching. Furthermore, the optical and electrical properties will be also investigated in this presentation. In summary, Pd/AlGaN/GaN SLs were successfully etched exploiting noble 2-step etching processes.

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DC 스퍼터링 증착에 의한 AI 전극을 갖는 전계발광소자 제작 (Fabrication of the Electroluminescence Devices with Al electrode deposited by DC sputtering)

  • 윤석범
    • 한국전기전자재료학회논문지
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    • 제13권5호
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    • pp.376-382
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    • 2000
  • We successfully fabricated OLED(Organic Light Emitting Diodes) with Al cathodes electrode deposited by the DC magnetron sputtering. The effects of a controlled Al cathode layer of an Indium Tin Oxide (ITO)/blended single polymer layer (PVK Bu:PBD:dye)/Al light emitting diodes are described. The PVK (Poly(N-vinylcarbazole)) and Bu-PBD (2-(4-biphenyl-phenyl)-1,3,4-oxadiazole) are used hole transport polymer and electron transport molecule respectively. We found that both current injection and electroluminescence output are significantly different with a variable DC sputtering power. The difference is believed to be due to the influence near the blended polymer layer/cathode interface that results from the DC power and H$\sub$2//O in a chamber. And DC sputtering deposition is an effective way to fabricate Al electrodes with pronounced orientational characteristics without damage occurring to metal-organic interface during the sputtering deposition.

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TiAlN+WC/C 다층코팅 SCM415강의 마찰•마모 특성에 관한 연구 (A Study on the Friction and Wear Characteristics of TiAlN+WC/C Multilayer Coating of SCM415 Steel)

  • 장정환;김남경;김해지;장기;허철수;류성기
    • 한국기계가공학회지
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    • 제9권2호
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    • pp.40-46
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    • 2010
  • The purpose of this study is to show the friction and wear characteristics on the vapor deposited coating layers on the SCM415 steel. In this research, frictional wear characteristic of coating materials such as TiAlN+WC/C Multilayer Coating was investigated under room temperature, normal air pressure and nothing lubricating condition. Therefore this study carried out research on the friction coefficient, micro hardness(Hv), roughness, EPMA on the vapor deposited coating layers on the SCM415 steel. As the wear experimental result, the coefficient of friction decreased according to experimental load increases.

하이브리드 코팅 시스템을 이용한 $CrAlC_xN_{1-x}$ 코팅의 합성과 기계적 특성 (Synthesis and mechanical properties of $CrAlC_xN_{1-x}$ coatings by a hybrid coating system)

  • 최지환;홍영수;김광호
    • 한국표면공학회:학술대회논문집
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    • 한국표면공학회 2009년도 추계학술대회 초록집
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    • pp.200-200
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    • 2009
  • 아크이온플래이팅 기술과 DC 마그네트론 스퍼터링 기술이 결합된 하이브리드 코팅 시스템을 이용하여 STS 304와 Si 기판에 4성분계 CrAlCxN1-x 코팅을 증착하였다. 합성된 CrAlCxN1-x 코팅은 주로 유도결합형로 f구성되었다. CrAlCxN1-x 코팅의 carbon 함량이 0.17 at.%일 때 약 34 GPa을 나타내었으며 마찰계수는 carbon 함량이 0에서 1 at.%로 증가함에 따라 0.82에서 0.38까지 크게 감소하였다. 이는 코팅 표면과 steel 볼 사이에 amorphous carbon layer가 형성되어 고체윤활제로 작용한 것으로 사료된다.

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Pressure Sensing Properties of AlN Thin Films Sputtered at Room Temperature

  • Seok, Hye-Won;Kim, Sei-Ki;Kang, Yang-Koo;Lee, Youn-Jin;Hong, Yeon-Woo;Ju, Byeong-Kwon
    • 센서학회지
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    • 제23권2호
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    • pp.94-98
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    • 2014
  • Aluminum nitride (AlN) thin films with a TiN buffer layer have been fabricated on SUS430 substrate by RF reactive magnetron sputtering at room temperature under 25~75% $N_2$ /Ar. The characterization of film properties were performed using surface profiler, X-ray diffraction, X-ray photoelectron spectroscopy(XPS), and pressure-voltage measurement system. The deposition rates of AlN films were decreased with increasing the $N_2$ concentration owing to lower mass of nitrogen ions than Ar. The as-deposited AlN films showed crystalline phase, and with increasing the $N_2$ concentration, the peak of AlN(100) plane and the crystallinity became weak. Any change in the preferential orientation of the as-deposited AlN films was not observed within our $N_2$ concentration range. But in the case of 50% $N_2$ /Ar condition, the peak of (002) plane, which is determinant in pressure sensing properties, appeared. XPS depth profiling of AlN/TiN/SUS430 revealed Al/N ratio was close to stoichiometric value (45:47) when deposited under 50% $N_2/Ar$ atmosphere at room temperature. The output signal voltage of AlN sensor showed a linear behavior between 26~85 mV, and the pressure-sensing sensitivity was calculated as 7 mV/MPa.

수치적 계산을 이용한 Bragg Reflector형 탄성파 공진기의 특성 분석 (Numerical Analysis of Bragg Reflector Type Film Bulk Acoustic Wave Resonator)

  • 김주형;이시형;안진호;주병권;이전국
    • 한국세라믹학회지
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    • 제38권11호
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    • pp.980-986
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    • 2001
  • 5.2GHz 중심 주파수를 갖는 Bragg reflector형 FBAR를 제작하여 주파수 응답 특성을 측정하고, 공진기 구조에서 각 층의 탄성 손실(acoustic loss)을 고려한 주파수 응답의 수치적 계산을 통해서 그 특성을 분석하였다. W과 $SiO_2$쌍을 선택하여 RF sputtering법으로 총 9층의 Bragg reflector를 제작하였고, 공진기의 압전층으로 pulsed dc 전원에 의한 sputtering법으로 AlN과 Al 전극을 증착하여 제작하였다. 제작된 공진기의 반사손실( $S_{11}$)은 중심주파수 5.38GHz에서 12dB이었고 직렬 공진 주파수( $f_{s}$)는 5.376GHz, 병렬 공진 주파수 ( $f_{p}$)는 5.3865GHz로 관찰되었다. 공진기의 성능지수인 유효 전기기계결합계수( $K_{ef{f^2}}$)값이 약 0.48%, 품질계수 ( $Q_{s}$) 값이 411이었다. 수치적으로 계산된 주파수 응답 특성으로부터 AlN 박막의 acoustic 상수들과 Bragg reflector의 반사계수를 도출한 결과 AlN 박막의 material acoustic impedance와 wave velocity는 AlN 고유의 값보다 감소되었으며, AlN 박막의 전기기계 결합계수( $K^2$)값은 c축 배향성 저하에 의해 매우 작은 값(0.49%)을 가졌다. 주파수 대역에서 Bragg reflector의 반사계수는 약 0.99966으로 계산되었으며 약 2.5 GHz에서 9.5 GHz까지의 넓은 반사대역을 나타내었다.다.었다.

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Investigation of Buffer Traps in AlGaN/GaN Heterostructure Field-Effect Transistors Using a Simple Test Structure

  • Jang, Seung Yup;Shin, Jong-Hoon;Hwang, Eu Jin;Choi, Hyo-Seung;Jeong, Hun;Song, Sang-Hun;Kwon, Hyuck-In
    • JSTS:Journal of Semiconductor Technology and Science
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    • 제14권4호
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    • pp.478-483
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    • 2014
  • We propose a new method which can extract the information about the electronic traps in the semi-insulating GaN buffer of AlGaN/GaN heterostructure field-effect transistors (HFETs) using a simple test structure. The proposed method has a merit in the easiness of fabricating the test structure. Moreover, the electric fields inside the test structure are very similar to those inside the actual transistor, so that we can extract the information of bulk traps which directly affect the current collapse behaviors of AlGaN/GaN HEFTs. By applying the proposed method to the GaN buffer structures with various unintentionally doped GaN channel thicknesses, we conclude that the incorporated carbon into the GaN back barrier layer is the dominant origin of the bulk trap which affects the current collapse behaviors of AlGaN/GaN HEFTs.

용사법에 의해 제조된 Al/SiC 복합재료의 마모거동 (2) - 작용하중의 영향 - (Wear Behavior of Al/SiC Composites Fabricated by Thermal Spray Process (2) - Effect of Applied Load on Wear Behavior -)

  • 이광진;김균택;김영식
    • Tribology and Lubricants
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    • 제29권5호
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    • pp.298-303
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    • 2013
  • In this work, the effect of applied load on the wear behavior of Al/SiC composites was studied. Al/SiC composites were fabricated following the thermal spray process. Dry sliding wear tests were performed on these composites under four different applied loads, i.e., 5, 10, 15, and 20 N. The wear behaviors of the composites under these applied loads were investigated using scanning electron microscopy (SEM) and energy dispersive X-ray spectroscopy (EDS). Under applied loads of up to 15 N, the wear rates of Al/SiC composites decreased with an increase in the applied load because of the formation of an adhesion layer on the worn surface. However in the case of an applied load of 20 N, the wear rate was significantly high because the formation and fracture of the adhesion layer were repeated continuously. These results show that the wear behaviors of the tested composites are significantly influenced owing to the applied loads.