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Investigation of Buffer Traps in AlGaN/GaN Heterostructure Field-Effect Transistors Using a Simple Test Structure

  • Jang, Seung Yup (IGBT Part, System IC R&D Laboratory, LG Electronics) ;
  • Shin, Jong-Hoon (IGBT Part, System IC R&D Laboratory, LG Electronics) ;
  • Hwang, Eu Jin (IGBT Part, System IC R&D Laboratory, LG Electronics) ;
  • Choi, Hyo-Seung (School of Electrical and Electronics Engineering, Chung-Ang University) ;
  • Jeong, Hun (School of Electrical and Electronics Engineering, Chung-Ang University) ;
  • Song, Sang-Hun (School of Electrical and Electronics Engineering, Chung-Ang University) ;
  • Kwon, Hyuck-In (School of Electrical and Electronics Engineering, Chung-Ang University)
  • Received : 2012.09.22
  • Accepted : 2013.01.28
  • Published : 2014.08.30

Abstract

We propose a new method which can extract the information about the electronic traps in the semi-insulating GaN buffer of AlGaN/GaN heterostructure field-effect transistors (HFETs) using a simple test structure. The proposed method has a merit in the easiness of fabricating the test structure. Moreover, the electric fields inside the test structure are very similar to those inside the actual transistor, so that we can extract the information of bulk traps which directly affect the current collapse behaviors of AlGaN/GaN HEFTs. By applying the proposed method to the GaN buffer structures with various unintentionally doped GaN channel thicknesses, we conclude that the incorporated carbon into the GaN back barrier layer is the dominant origin of the bulk trap which affects the current collapse behaviors of AlGaN/GaN HEFTs.

Keywords

References

  1. M. Ishida, T. Ueda, T. Tanaka, and D. Ueda, "GaN on Si technologies for power switching devices," IEEE Trans. Electron Devices, vol. 60, no. 10, pp. 3053-3059, Oct. 2013. https://doi.org/10.1109/TED.2013.2268577
  2. S. Arulkumaran, G. I. Ng, and Z. H. Liu, "Effect of gate-source and gate-drain Si3N4 passivation on current collapse in AlGaN/GaN high-electronmobility transistors on silicon," Appl. Phys. Lett., vol. 90, no. 17, pp. 173504-1-173504-3, Apr. 2007. https://doi.org/10.1063/1.2730748
  3. M. J. Uren, J. Möreke, and M. Kuball, "Buffer design to minimize current collapse in GaN/AlGaN HFETs," IEEE Trans. Electron Devices, vol. 59, no. 12, pp. 3327-3333, Dec. 2012. https://doi.org/10.1109/TED.2012.2216535
  4. Z. Q. Fang, B. Claflin, D. C. Look, D. S. Green, R. Vetury, "Deep traps in AlGaN/GaN heterostructures studied by deep level transient spectroscopy: Effect of carbon concentration in GaN buffer layers," J. Appl. Phys., vol. 108, no. 6, pp. 063706-1-063706-6, Sep. 2010. https://doi.org/10.1063/1.3488610
  5. M. Marso, M. Wolter, P. Javorka, P. kordos, and H. Luth, "Investigation of buffer traps in an AlGaN/GaN/Si high electron mobility transistor by backgating current deep level transient spectroscopy," Appl. Phys. Lett., vol. 82, no. 4, pp. 633-635, Jan. 2003. https://doi.org/10.1063/1.1540239
  6. M. J. Uren, M. Silverstri, M. Casar, G. A. M. Hurkx, J. A. Croon, J. Sonsky, and M. Kuball, "Intentionally carbon-doped AlGaN/GaN HEMTs: Necessaty for vertical leakage paths," IEEE Electron Device Lett., vol. 35, no. 3, pp. 327-329, Mar. 2014. https://doi.org/10.1109/LED.2013.2297626
  7. J. Joh and J. del Alamo, "Impact of electrical degradation on trapping characteristics of GaN high electron mobility transistors," in IEDM Tech. Dig., 2008, pp. 461-464.
  8. J. Joh and J. del Alamo, "A current-transient methodology for trap analysis for GaN high electron mobility transistors," IEEE Trans. Electron Devices, vol. 58, no. 1, pp. 132-140, Jan. 2011. https://doi.org/10.1109/TED.2010.2087339
  9. D. Bisi, M. Meneghini, C. de Santi, A. Chini, M. Dammann, P. Bruckner, M. Mikulla, G. Meneghesso, and E. Zanoni, "Deep-level characterization in GaN HEMTs-Part I: Advantages and limitations of drain current transient measurements," IEEE Trans. Electron Devices, vol. 60, no. 10, pp. 3166-3175, Oct. 2013. https://doi.org/10.1109/TED.2013.2279021
  10. P. Boguslawski and J. Bernholc, "Doping properties of C, Si, Ge impurities in GaN and AlN," Phys. Rev. B, vol. 56, no. 15, pp. 9496-9505, Jul. 1997. https://doi.org/10.1103/PhysRevB.56.9496
  11. A. F. Wright, "Substitutional and interstitial carbon in wurtzite GaN," J. Appl. Phys., vol. 92, no. 5, pp. 2575-2585, Sep. 2002. https://doi.org/10.1063/1.1498879

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