• 한국전기전자재료학회논문지
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• 제20권8호
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• pp.666-670
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• 2007

Aluminuim doped zinc oxide(ZnO:AL)Films have been prepared on Polyimide(PI) and Coming 7059 glass substrates by r.f. magnetron sputtering method. The structural of the ZnO:Al films were studied in accordance with various deposition R.F power and working pressure by XRD, SEM. And The electrical and optical properties of ZnO:Al films were characterized by Hall effect and UN visible spectrophotometer measurements, ZnO:Al films had were hexagonal wurtzite structure and dominant c-axis orientation. The R.f power and working pressure for optimum condition to fabricate the transparent conductive films using a PI substrate were 2 mTorr and 100W, respectively. The resistivity of the ZnO:Al films prepared under this condition were $9.6{\times}10^{-4}{\Omega}cm$. The optical transmittance of 400nm thick films at 550nm is ${\sim}85 %$.

• 한국표면공학회:학술대회논문집
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• 한국표면공학회 2011년도 춘계학술대회 및 Fine pattern PCB 표면 처리 기술 워크샵
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• pp.33-35
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• 2011

Films of CrAlN and CrZrN were deposited on a steel substrate by closed field unbalanced magnetron sputtering, and their oxidation behaviors were investigated. CrAlN films consisted of dense, polycrystalline CrN and AlN fine columns. The formed oxides consisted primarily of crystalline $Cr_2O_3$ incorporated with $Al_2O_3$. The oxide layers were thin and compact so as to make CrAlN films more protective than CrN films. In case of CrZrN films, Zr atoms were dissolved in the CrN phase. Zr atoms advantageously refined the columnar structure, reduced the surface roughness, and increased the micro-hardness. However, the addition of Zr did not increased oxidation resistance, mainly because Zr was not a protective element. All the deposited films displayed relatively good oxidation resistance, owing to the formation of the highly protective $Cr_2O_3$ on their surface. The $Cr_{40}Zr_9N$ and $Cr_{31}Zr_{16}N$ films oxidized to $Cr_2O_3$ as the major phase and ${\alpha}-ZrO_2$ as the minor one, whereas the CrN film oxidized to $Cr_2O_3$.

• 한국진공학회지
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• 제10권1호
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• pp.22-26
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• 2001

Plasma assisted molecular beam epitaxy(PAMBE)를 사용하여 Si 기판위에 성장시킨 AlN 박막에 대하여 성장온도 및 기판의 방향성에 따른 박막의 결정성 변화를 분석하였다. Reflection high energy electron diffraction(RHEED) 패턴을 이용하여 성장 중의 결정성을 관찰하였고, 성장 후에는 X-ray diffraction(XRD), double crystal X-ray diffraction(DCXD), transmission electron microscopy/diffraction(TEM/TED)분석을 하였다. $850^{\circ}C$이상의 온도에서 Si(100)위에 성장된 AlN박막은 육방정계의 c축 방향으로 우선 배향되어 있음을 확인하였으며 Si(111)위에 성장된 AlN박막의 경우 AlN(0001)/Si(111), AlN(1100)/Si(110), AlN(1120)/Si(112)의 결정방위를 가지고 성장하였음을 확인하였다. 또한 Si(111) 기판 위에서는 전위와 적층결함 등 많은 결정결함에 의해 DCD패턴의 반치폭이 2$\theta$=$36.2^{\circ}$에서 약 3000arcsec에 이르는 등 결정성은 좋지 않았으나 AlN박막이 단결정으로 성장된 것으로 나타났다.

• 한국전기전자재료학회논문지
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• 제13권10호
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• pp.828-833
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• 2000

Growth characteristics and microstructure of AIN thin films grown by plasma assisted molecular beam epitaxy on Si substrates have been investigated. Growing temperature and substrate orientation were chosen as major variables of the experiment. Reflection high energy electron diffraction (RHEED), X-ray diffraction (XRD), atomic force microscopy (AFM) and transmission electron microscopy/diffraction (TEM/TED) techniques were employed to characterize the micorstructure of the films. On Si(100) substrates, AlN thin films were grown along the hexagonal c-axis preferred orientation at temperature range 850-90$0^{\circ}C$. However on Si(111), the AlN films were epitaxially grown with directional coherency in AlN(0001)/Si(111), AlN(1100)/Si(110), and AlN(1120)/Si(112) at 85$0^{\circ}C$ and the epitaxial coherencry seemed to be slightly distorted with increasing temperature. The microstructure of AlN thin films on Si(111) substrates showed that the films include a lot of crystal defects and there exist micro-gaps among the columns.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 1994년도 추계학술대회 논문집
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• pp.106-108
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• 1994

Electromigration(EM) tests were carried out on Al and Cu films in HV systems to study surface migration. The Al films were made on oxidized silicon wafers by thermal evaporation, in-situ annealed at 300$^{\circ}C$, patterned, and EM tested at 260$^{\circ}C$ and 4.5MA/$\textrm{cm}^2$. SEM observation with back scattered electron mode on the EM tested Al films disclosed that thinning took place under the native Al oxide. In the case of Cu films, tested using in-situ TEM, thinning was also observed at the early stage of void formation even though the thinned areas were much less than those of the Al films.

• 한국세라믹학회지
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• 제24권2호
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• pp.101-110
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• 1987

The relative electrical conductivity of vacuum deposited Al films on a soda-lime(2947) and an alumino boro silicate(7809) glass was investigated with the variation of the relative humidity,temperature and film thickness. The structure and microstructure of Al films before and after exposure to the humidity wereexamined by the X-ray Diffractormenter(XRD) and Scanning Electron Microscope(SEM). As the relative humidity increased, the electrical conductivity of Al films on both glasses was decreased. However, the Al films on 7809 glass showed higher conductivity than that of 2947 glass under the same testing conditions. The decreasing of electrical conductivity was caused by the formation of Aluminum hydroxide which was made by the reaction between the aluminum films and water vapor.

• 한국표면공학회:학술대회논문집
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• 한국표면공학회 2013년도 춘계학술대회 논문집
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• pp.150-150
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• 2013

Al-Mg films were prepared onto steel sheet according to deposition condition by eco-friendly electron beam vacuum evaporation method. The influence of Al-Mg films on corrosion resistance was evaluated by salt spray test and electrochemical method etc.. From the experimented results, it was found that the Al-Mg films which showed good corrosion resistance tend to have fine structure with homogenious composition distribution. In addition, it was shown that the property of coating films can be improve by controlling thickness ratio and uniform distribution of intermetallic compounds in Al-Mg films.

• 한국표면공학회지
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• 제48권2호
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• pp.50-55
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• 2015

$Al_2O_3$ thin films were deposited on the moth eye anti-reflective nanostructured polycarbonate films by atomic layer deposition (ALD) techniques. Without ALD-$Al_2O_3$ thin films, moth eye anti-reflective nanostructured films had a high optical transmittance of 95.47% at a wavelength of 550 nm and a very poor hardness of 0.1381 GPa. With increasing the thickness of $Al_2O_3$ thin films from 5 to 25 nm, the transmittance of moth eye anti-reflective nanostructured films was gradually decreased from 94.94 to 93.12%. On the other hand, the hardness of the films was greatly increased from 0.3498 to 0.7806 GPa with increasing the thickness of $Al_2O_3$ thin films. This result shows that ALD thin films can be applied to improve mechanical properties with an adequate optical transmittance of the conventional moth eye anti-reflection nanostructure films.

• 한국표면공학회지
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• 제49권2호
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• pp.202-210
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• 2016

This study was intended to investigate the effect of the amount of magnesium addition and heat treatment in the Al-Mg coating film in order to improve corrosion resistance of aluminum coating. Al-Mg alloy films were deposited on cold rolled steel by physical vapor deposition sputtering method. Heat treatment was fulfilled in an nitrogen atmosphere at the temperature of $400^{\circ}C$ for 10 min. The morphology was observed by SEM, component and phase of the deposited films were investigated by using GDLS and XRD, respectively. The corrosion behaviors of Al-Mg films were estimated by exposing salt spray test at 5 wt.% NaCl solution and measuring polarization curves in deaerated 3 wt.% NaCl solution. With the increase of magnesium content, the morphology of the deposited Al-Mg films changed from columnar to featureless structure and particle size was became fine. The x-ray diffraction data for deposited Al-Mg films showed only pure Al peaks. However, Al-Mg alloy peaks such as $Al_3Mg_2$ and $Al_{12}Mg_{17}$ were formed after heat treatment. All the sputtered Al-Mg films obviously showed good corrosion resistance compared with aluminum and zinc films. And corrosion resistance of Al-Mg film was increased after heat treatment.

• 한국표면공학회지
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• 제36권2호
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• pp.109-115
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• 2003

Quaternary Ti-Al-Si-N films were deposited on WC-Co substrates by a hybrid deposition system of arc ion plating (AIP) method for Ti-Al source and DC magnetron sputtering technique for Si incorporation. The synthesized Ti-Al-Si-N films were revealed to be composites of solid-solution (Ti, Al, Si)N crystallites and amorphous Si3N4 by instrumental analyses. The Si addition in Ti-Al-N films affected the refinement and uniform distribution of crystallites by percolation phenomenon of amorphous silicon nitride, similarly to Si effect in TiN film. As the Si content increased up to about 9 at.%, the hardness of Ti-Al-N film steeply increased from 30 GPa to about 50 GPa. The highest microhardness value (~50 GPa) was obtained from the Ti-Al-Si-N film haying the Si content of 9 at.%, the microstructure of which was characterized by a nanocomposite of nc-(Ti,Al,Si) N/a$-Si_3$$N_4$.