• Journal of the Microelectronics and Packaging Society
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• v.7 no.3
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• pp.55-61
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• 2000

Sn-37Pb and Sn-3.5Ag-0.7Cu solder balls of 0.3 mm diameter were reflow soldered with the variation of soldering peak temperature and conveyer speed of reflow machine. The peak temperatures far soldering were changed in the range of 220~$240^{\circ}C$ for Sn-37Pb and 230~$260^{\circ}C$ for Sn-3.5Ag-0.7Cu. As the results of experiments, optimum soldering condition for Sn-37Pb was $230^{\circ}C$ of soldering temp., 0.7~0.8 m/min of conveyer speed. The optimum condition for the Sn-3.5Ag-0.7Cu was $250^{\circ}C$ and 0.6 m/min. The maximum shear strength for the soldered joints of Sn-37Pb was 555 gf and of Sn-3.5Ag-0.7Cu was 617 gf. Thickness of the intermetallic compound Cu6Sn5 on the soldered interface was 1.13~1.45 $\mu\textrm{m}$ for Sn-37Pb and 2.5~4.3 $\mu\textrm{m}$ for Sn-3.5Ag-0.7Cu.

• Korean Journal of Metals and Materials
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• v.50 no.1
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• pp.71-77
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• 2012

We studied the effect of heat treatment on the microstructures and mechanical strength of the solder joints in the Light Emitting Diode (LED) packages. The commercial LED packages were mounted on the a flame resistance-4 (FR4) Printed Circuit Board (PCB) in the reflow process, and then the joints were aged at $125^{\circ}C$ for 100, 200, 300, 500 and 1000 hours, respectively. After the heat treatment, we measured the shear strength of the solder joints between the PCB and the LED packages to evaluate their mechanical property. We used Pb-free Sn-3.0Ag-0.5Cu solder to bond between the LED packages and the PCBs using two different surface finishes, Electroless Nickel-Immersion Gold (ENIG) and Electroless Nickel-Electroless Palladium-Immersion Gold (ENEPIG). The microstructure of the solder joints was observed by a scanning electron microscope (SEM). (Cu,Ni)6Sn5 intermetallic compounds (IMCs) formed between the solder and the PCB, and the thickness of the IMCs was increased with increasing aging time. The shear strength for the ENIG finished LED package increased until aging for 300 h and then decreased with increasing aging time. On the other hand, in the case of an ENEPIG finished LED package, the shear strength decreased after aging for 500 h.

• Journal of Korea Foundry Society
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• v.18 no.6
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• pp.570-577
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• 1998

An investigation has been conducted to describe solidification characteristics in Sn-Zn binary system and Sn-Zn-Ag ternary system added by Ag produced by the continuous casting process using heated mold as a basic study for developing Pb-free solder materials. To obtain the continuous casting rods with mirror surface and near net shape at higher casting speed, water flow rates must be increased and mold temperature must be lowered. However, surface tearing in the casting rods occured at lower continuous casting speed while break out occured at higher continuous casting speed even if optimum conditions such as water flow rate and heated mold temperature are determined. Primary ${\alpha}Sn$ and eutectic structure in unidirectioally solidified Sn-Zn alloys were finer with increased casting speed. But, directionality may not be expected for primary Zn in hypereutectic Sn-Zn alloy. It was found that the addition of $0.2{\sim}0.8%$ Ag promoted the growth of primary ${\alpha}Sn$ dendrites. The changes of tensile strength and elongation in Sn-Zn binary alloys were not observed while the increase of tensile strength and the decrease of elongation in Sn-Zn-Ag ternary alloys were observed with increased casting speed.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2003.11a
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• pp.76-79
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• 2003

본 실험에서는 $S0.7wt\%Cu,\;Sn3.8wt\%Ag0.7wt\%Cu$ solder와 금속층으로서의 좋은 특성을 가지고 있지만 아직 연구 보고 된 적 없는 Pt층과의 리플로 반응에 의해 형성되는 계면금속간화합물의 상 분석을 시도 하였다 또한 솔더내 Cu함량에 따른 계면금속간화합물의 변화에 대하여 연구하기 위해 $Sn1.7wt\%Cu$솔더와 Pt층의 계면반응 현상에 대한 연구도 수행하였다. $Sn0.7(1.7)wt\%Cu$솔더는 순수한 Sn과 Cu를 이용하여 중량비로 제조하였고, $Sn3.8wt\%Ag0.7wt\%Cu$솔더는 솔더페이스트를 사용하였다. 분석은 SEM, EDS, XRD를 이용하였다. 분석 결과 세 가지 무연솔더 모두에서 $PtSn_4$가 계면 금속간화합물로 존재함을 발견하였으며 $1.7wt\%Cu$를 포함한 솔더와 Pt와의 반응에서는 고용도 이상으로 첨가된 Cu에 의해 솔더 내부에 조대한 형상의 $Cu_6Sn_5$가 존재함을 SEM 및 EDS분석을 통하여 발견 하였다.

• Journal of Welding and Joining
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• v.31 no.1
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• pp.6-10
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• 2013

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.09a
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• pp.93-99
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• 2004

At present, LG Electronics pushes ahead to eliminate the Pb(Lead) -a hazardous material- from all products. Especially, we have performed to select the optimum standard composition of lead free alloy for the application to products for about 3 years from 2000. These days, we have the chance for applying to the mass-production. This project constructed the system for applying the lead free solders on consumer electronic products, which is one of the major products of the LG Electronics. To select the lead free solders with corresponding to the product features, we have passed through the test and applied with Sn-3.0Ag-0.5Cu alloy system to our products, and for the application to the high melting temperature composition, we secured the thermal resistance of the many parts and substrate and optimized the processing conditions. We have operated the temperature cycling test and the high temperature storage test under the standards to confirm the reliability of the products. On these samples, we considered the consequence of our decision by the operating test. For the long life time of the product, we have operated the temperature cycling test at $-45^{\circ}C-+125^{\circ}C$, 1 cycle/hour, 1000 cycles. Also we have tested the tin whisker growth about lead free plating on lead finish. We have analyzed with the SEM, EDS and any other equipment for confirming the failure mode at the joint and the tin whisker growth on lead free finish.

• Journal of the Microelectronics and Packaging Society
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• v.24 no.1
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• pp.17-25
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• 2017

Recently, research and application for a power module have been actively studied according to the increasing demand for the production of vehicles, smartphones and semiconductor devices. The power modules based on the transient liquid phase (TLP) technology for bonding of power semiconductor devices have been introduced in this paper. The TLP bonding has been widely used in semiconductor packaging industry due to inhibiting conventional Pb-base solder by the regulation of end of life vehicle (ELV) and restriction of hazardous substances (RoHS). In TLP bonding, the melting temperature of a joint layer becomes higher than bonding temperature and it is cost-effective technology than conventional Ag sintering process. In this paper, a variety of TLP bonding technologies and their characteristics for bonding of power module have been described.

• Journal of the Microelectronics and Packaging Society
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• v.16 no.1
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• pp.33-38
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• 2009

The use of portable devices has created the need for new reliability criterion of drop impact tests because of the tendency to accidentally drop in the use of these devices. The effects of different PCB surface finishes (organic solderability preservative (OSP) and electroless nickel immersion gold (ENIG)) and high temperature storage (HTS) test on the drop reliability were studied. Various drop test conditions were used to evaluate a drop reliability of assemblies to endure such impact and shock load. In the case of the as-reflowed samples (no HTS test), the SAC/OSP boards exhibited a better drop impact reliability than that of SAC/ENIG. However, the reverse was true if HTS test is performed. In addition, significant decrease of drop reliability was observed for both SAC/ENIG and SAC/OSP assemblies after HTS test. It was also observed that the thickness of intermetallic compound layer do play an important role in the brittle fracture of drop test.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.06a
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• pp.226-226
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• 2008

지난 10여년 동안 Sn-3.0Ag-0.5(wt%)Cu 합금은 대표 무연솔더 조성으로 다양한 전자제품의 실장 및 접합에 적용되어 왔으며, 그 신뢰성 역시 충분히 검증된 바 있다. 그러나 최근 Ag 가격의 급격한 상승과 솔더 접합부의 내 충격 신뢰성을 보다 향상시키고자 하는 업계의 동향은 Ag의 함량이 낮은 무연솔더 조성의 적용 확대를 유도하고 있다. 이에 따라 본 연구자들은 저 Ag 함유 무연슬더로 Sn-1.2Ag-0.5Cu-0.4In 조성을 제안한 바 있는데, 이는 Sn-3.0Ag-0.5Cu 조성 이상의 solderability를 가지면서도 그 금속원료 가격이 약 20% 가량 저렴한 특징을 가진다. 또한 열 싸이클링 (cycling) 테스트를 통한 슬더 조인트의 신뢰성을 평가한 결과, Sn-3.0Ag-0.5Cu에 크게 뒤떨어지지 않는 양호한 특성이 관찰되었다. 따라서 본 연구에서는 열 싸이클링 테스트와 더불어 최근 그 중요성이 지속적으로 커지고 있는 내 충격 신뢰성 평가 시험을 실시하여 개발된 4원계 무연솔더 조성의 기계적 특성을 기존 무연솔더 조성과 비교, 분석해 보았다. 각 솔더 조성은 솔더 볼 형태로 제조되어 CSP(Chip Scale Package) 상에 범핑 (bumping)되었으며, CSP를 PCB(Printed Circuit Board) 상에 실장하는 공정에서도 Sn-3.0Ag-0.5Cu 및 Sn-1.2Ag-0.5Cu-0.4In의 두 종류의 솔더 페이스트가 사용되었다. 본 연구에서의 내 충격 신뢰성 시험에는 자체 제작한 rod drop 시험기를 사용하였는데, 고정된 CSP 실장 board의 후면 부위를 일정한 높이에서 추를 반복적으로 자유 낙하시켜 급격한 충격을 주는 방식으로 실험을 실시하였다. 이 때 추의 무게는 30g, 낙하 높이는 10cm 였으며, 추의 낙하 시 측정된 board 의 휨 변위량은 약 0.7mm로 측정되었다. 사용된 CSP와 PCB 는 모두 daisy chain 방식으로 연결되어 있기 때문에 저항측정기를 사용한 간단한 실시간 저항 측정 방법으로 시험 이력에 따른 파단부의 발생 시점과 대략의 위치를 손쉽게 확인할 수 있었다. 솔더 조인트의 파단 기준 저항값으로 $1000\Omega$을 설정하였으며. 각 조건 당 5 개 이상의 샘플에 대해 평가를 실시한 후 그 평균값을 조사하였다. 시험 결과 제안된 Sn-1.2Ag-0.5Cu-0.4In 조성은 대표적인 저 Ag 함유 조성인 Sn-1.0Ag-0.5Cu에 비해서는 떨어지는 내 충격 신뢰성을 나타내었지만, 우수한 연성에 기인하여 Sn-3.0Ag-0.5Cu 조성에 비해서는 약 2 배 이상 우수한 신뢰성이 관찰되었다. 또한 CSP의 실장 시 Sn-3.0Ag-0.5Cu보다 Sn-1.2Ag-0.5Cu-0.4In 조성 솔더 페이스트를 적용한 경우에서 보다 우수한 내 충격 신뢰성을 나타내어 기본적으로 개발된 Sn-1.2Ag-0.5Cu-0.4In 솔더 페이스트가 Sn-3.0Ag-0.5Cu 조성의 기존 솔더 페이스트 보다 내 충격 신뢰성이 우수함을 검증할 수 있었다. 각 조성의 솔더 조인트를 $150^{\circ}C$ 에서 500시간 aging한 후 실시한 내 충격 신뢰성 평가에서는 모든 조성에서 그 신뢰성이 급감하는 경항을 나타내었으나, Sn-1.2Ag-0.5Cu-0.4In가 Sn-l.0Ag-0.5Cu보다도 그 상대적인 신뢰성이 우수한 것으로 관찰되었다. 이와 같이 aging 후 실시하는 충격시험은 가장 실제적인 상황과 유사한 조건이므로 상기의 실험 결과는 매우 고무적이었으며, 이에 대한 보다 면밀한 분석이 요청되었다. 마지막으로 파면 및 미세조직 관찰을 통하여 각 조성에서의 충격 파단 특성을 비교, 분석해 보았다.

• Journal of the Microelectronics and Packaging Society
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• v.17 no.4
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• pp.11-17
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• 2010

The electromigration phenomenon in lead-free flip-chip solder joint has been one of the serious problems. To understand the mechanism of this phenomenon, the crystallographic orientation of Sn grain in the Sn-Ag-Cu solder bump has been analyzed. Different time to failure and different microstructural changes were observed in the all test vehicle and bumps, respectively. Fast failure and serious dissolution of Cu electrode was observed when the c-axis of Sn grain parallel to electron flow. On the contrary of this, slight microstructural changes were observed when the c-axis of Sn perpendicular to electron flow. In addition, underfill could enhance the electromigration reliability to prevent the deformation of solder bump during EM test.