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http://dx.doi.org/10.6117/kmeps.2017.24.1.017

Transient Liquid Phase (TLP) Bonding of Device for High Temperature Operation  

Jung, Do-hyun (Department of Materials Science and Engineering, University of Seoul)
Roh, Myung-hwan (Department of Materials Science and Engineering, University of Seoul)
Lee, Jun-hyeong (Duksan Himetal Co. Ltd.)
Kim, Kyung-heum (Duksan Himetal Co. Ltd.)
Jung, Jae Pil (Department of Materials Science and Engineering, University of Seoul)
Publication Information
Journal of the Microelectronics and Packaging Society / v.24, no.1, 2017 , pp. 17-25 More about this Journal
Abstract
Recently, research and application for a power module have been actively studied according to the increasing demand for the production of vehicles, smartphones and semiconductor devices. The power modules based on the transient liquid phase (TLP) technology for bonding of power semiconductor devices have been introduced in this paper. The TLP bonding has been widely used in semiconductor packaging industry due to inhibiting conventional Pb-base solder by the regulation of end of life vehicle (ELV) and restriction of hazardous substances (RoHS). In TLP bonding, the melting temperature of a joint layer becomes higher than bonding temperature and it is cost-effective technology than conventional Ag sintering process. In this paper, a variety of TLP bonding technologies and their characteristics for bonding of power module have been described.
Keywords
power module; power semiconductor; transient liquid phase (TLP) bonding; Pb-free solder; High temperature operation;
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Times Cited By KSCI : 2  (Citation Analysis)
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