• Proceedings of the KWS Conference
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• 2007.11a
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• pp.211-214
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• 2007

Sn-0.3Ag-0.7Cu 조성의 젖음 특성과 반응 특성을 Sn-1.0Ag-0.5Cu 및 Sn-3.0Ag-0.5Cu 합금의 결과와 비교, 분석하였다. 또한 Sn-0.3Ag-0.7Cu 조성의 용융 및 응고 특성을 DSC로 측정하고, 인장시험을 통한 stress-strain curve를 관찰하였다. 아울러 할로겐 함유량이 많은 플럭스를 사용하여 Sn-0.3Ag-0.7Cu 조성의 젖음 특성을 향상 시킬 수 있는지를 조사하였으며, Sn-0.3Ag-0.7Cu 조성에 미량의 In을 첨가하여 젖음 특성의 개선 정도를 분석하였다. 그 결과 할로겐 함유량이 높은 플럭스를 사용한 경우보다 미량의 In을 첨가한 경우에서 wettability의 향상을 보다 효과적으로 유도할 수 있음을 관찰할 수 있었다.

• Korean Journal of Materials Research
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• v.4 no.5
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• pp.556-565
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• 1994

Effects of Ag addition to 2090 and CP 276 Al-Li alloy systems on the microstructure and mechanical properties have been investigated. The addition of silver up to 0.16wt.% reduced the grain size of the alloys, and was responsible for the formation of finer and more uniform $\delta$'($AI_{3}Li$) and $T_{1}(AI_{2}CuLi$) precipitates in 2090 alloys, even though no variation of precipitates was found in CP 276 alloys. The addition of 0.16wt.% Ag improved the tensile strength of 2090 alloys about 40MPa with the expense of small reduction of percent elongation. However, the small addition of Ag to CP 276 containing Mg did not show any variation of tensile strength and elongation. The aging treatment of these alloys at $150^{\circ}C$ for 70 or 90 hours, depending on alloy systems, showed peak hardness value of about 92 $H_rB$.

• Journal of Biomedical Engineering Research
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• v.17 no.2
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• pp.247-254
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• 1996

The relationship between the isothermal age-hardening behavior and the phase transformation in the commercial dental Au-Ag-Cu-Pd alloy was investigated Age-hardening was mostly attributed to the lattice distortions of the supersaturated w phase resulting from the transformation to the metastable phasel which were more distinct at lower aging temperature. The lattice distortions resulting from the transformation of the metastable phases to the equilibrium phases also made a contribution to the age-hardening.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2000.04a
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• pp.81-86
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• 2000

To evaluate the possibility of the partial melting soldering. wettability of partial melted solders was measured using wetting balance. Off eutectic Sn-Pb allows are wettable in their partial melting zone. Especially, Pb rich alloys showed excellent wettability while wettability of Sn rich alloys were adequate or poor. It is found that wettability increases over $200^{\circ}C$ regardless of composition liquid fraction and phases of the original alloy Sn-7Ag alloy showed good wettability in their partial melting zone, while Sn-65Bi alloy was non-wettable under their melting points.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.28 no.5
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• pp.332-337
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• 2015

We have studied the effects of Ag on the characteristics of $Sn_{60}Pb_{40}Ag_x$ (wt%) solder for photovoltaic ribbon. Ag atoms in the solder formed an alloy phase of $Ag_3Sn$ after reacting with some part of Sn atoms, while they did not react with Pb atoms, but decreased the mean size of Pb solid phase. The enhancement of peel strength between solar cell and ribbon is an important part in the developments of long-lifespan solar module. The peel strength of the solder ribbon of $Sn_{60}Pb_{40}$ (wt%) was $169N/mm^2$, and it was largely enhanced by adding a small amount of Ag atoms. The maximum peel strength was $295N/mm^2$ in the solder ribbon of $Sn_{60}Pb_{40}Ag_2$ (wt%). This result is caused by the high binding energy of 162.9 kJ/mol between Ag atoms in the solder and Ag atoms in Ag sheet.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.13 no.8
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• pp.711-717
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• 2000

Effect of alloying element additions to Ag on thermal conductivity electrical conductivity and mechanical properties of sheath materials for BSCCO tapes has been characterized. The thermal conductivity at low temperature range(10~300K) of Ag alloys were evaluated by both direct and indirect measurement techniques and compared with each other. It was observed that thermal conductivity decreased with increasing the content of alloying elements such as Au, Pd and Mg. Thermal conductivity of pure Ag at 30 K was measured to be 994.0 W/m.K on the other hand the corresponding values of A $g_{0.9995}$/M $g_{0.0005}$, A $g_{0.974}$/A $u_{0.025}$/M $g_{0.001}$, A $g_{0.973}$/Au.0.025//M $g_{0.002}$, and A $g_{0.92}$/P $d_{0.06}$/M $g_{0.02}$ were 342.6, 62.1, 59.2, 28.9 W/m.K respectively indicating 3 to 30 times lower than that of pure Ag. In addition alloying element additions to Ag improved mechanical strength while reduced elongation probably due to the strengthening mechanisms by the presence of additive atoms.s.

• Journal of Welding and Joining
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• v.25 no.3
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• pp.57-63
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• 2007

Electrochemical migration characteristics of Pb-free solder alloys are quantitatively correlated with corrosion characteristics in harsh environment conditions. In-situ water drop test and corrosion resistance test for Sn-3.0Ag-0.5Cu solder alloys were carried out in NaBr and NaF solutions to obtain the electrochemical migration lifetime and pitting potential, respectively. Sn-3.0Ag-0.5Cu solder alloy shows similar ionization and electrochemical migration behavior with pure Sn because of Ag and Cu do not migrate due to the formation of resistant intermetallic compounds inside solder itself. Electrochemical migration lifetime in NaBr is longer than in NaF, which seems to be closely related to higher pitting potential in NaBr than NaF solution. Therefore, it was revealed that electrochemical migration lifetime of Sn-3.0Ag-0.5Cu solder alloys showed good correlation to the corrosion resistance, and also the initial ionization step at anode side is believed to be the rate-determining step during electrochemical migration of Pb-free solders in these environments.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.19 no.3
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• pp.576-583
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• 2018

Silicon carbide is considered to be a potentially useful material for high-temperature electronic devices, as its band gap is larger than that of silicon and the p-type and/or n-type conduction can be controlled by impurity doping. Particularly, porous n-type SiC ceramics fabricated from ${\beta}-SiC$ powder have been found to show a high thermoelectric conversion efficiency in the temperature region of $800^{\circ}C$ to $1000^{\circ}C$. For the application of SiC thermoelectric semiconductors, their figure of merit is an essential parameter, and high temperature (above $800^{\circ}C$) electrodes constitute an essential element. Generally, ceramics are not wetted by most conventional braze metals,. but alloying them with reactive additives can change their interfacial chemistries and promote both wetting and bonding. If a liquid is to wet a solid surface, the energy of the liquid-solid interface must be less than that of the solid, in which case there will be a driving force for the liquid to spread over the solid surface and to enter the capillary gaps. Consequently, using Ag with a relatively low melting point, the junction of the porous SiC semiconductor-Ag and/or its alloy-SiC and/or alumina substrate was studied. Ag-20Ti-20Cu filler metal showed promise as the high temperature electrode for SiC semiconductors.

• Proceedings of the Korea Institute of Applied Superconductivity and Cryogenics Conference
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• 2002.02a
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• pp.351-354
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• 2002

In most of electrical applications using Bi-2223/Ag HTS tapes, bending and tension stresses are essentially applied to the tape. Therefore, the critical current of the Bi-2223/Ag tape is degraded by increasing the deformation stress, though brittle superconducting filaments are embedded in the reinforced Ag alloy sheath. It is needed to understand bending and tension properties of HTS tapes at room temperature and cryogen to make superconducting magnet, cable and etc. using Bi-2223/Ag HTS tapes. Actually, bending and tension stress applied to the tapes simultaneously, when winding the tapes on former for applications. In this study, the effect of mechanical deformations, bending and tension, on the critical current of Bi-2223/Ag tape was investigated.

• Korean Journal of Materials Research
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• v.24 no.4
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• pp.175-179
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• 2014

Ti and Ti alloys have been extensively used in the medical and dental fields because of their good corrosion resistance, high strength to density ratio and especially, their low elastic modulus compared to other metallic materials. Recent trends in biomaterials research have focused on development of metallic alloys with elastic modulus similar to natural bone, however, many candidate materials also contain toxic elements that would be biologically harmful. In this study, new Ti based alloys which do not contain the toxic metallic components were developed using a theoretical method (DV-$X{\alpha}$). In addition, alloys were developed with improved mechanical properties and corrosion resistance. Ternary Ti-Ag-Zr alloys consisting of biocompatible alloying elements were produced to investigate the alloying effect on microstructure, corrosion resistance, mechanical properties and biocompatibility. The effects of various contents of Zr on the mechanical properties and biocompatibility were compared. The alloys exhibited higher strength and corrosion resistance than pure Ti, had antibacterial properties, and were not observed to be cytotoxic. Of the designed alloys' mechanical properties and biocompatibility, the Ti-3Ag-0.5Zr alloy had the best results.