Proceedings of the International Microelectronics And Packaging Society Conference (한국마이크로전자및패키징학회:학술대회논문집)

The Korean Microelectronics and Packaging Society (한국마이크로전자및패키징학회)
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Wettability Analysis of Liquid Phase in Partial Melted Solders Using Wetting Balance

  • Park, J.Y. (School of Materials Science & Engineering, Seoul National University) ;
  • Ha, J.S. (School of Materials Science & Engineering, Seoul National University) ;
  • Kang, C.S. (School of Materials Science & Engineering, Seoul National University) ;
  • Kim, M.I. (Department of Materials Science & Engineering, Univ. of Seoul) ;
  • Shin, K.S. (Department of Materials Science & Engineering, Univ. of Seoul) ;
  • Jung, J.P. (Department of Materials Science & Engineering, Univ. of Seoul)
  • Published : 2000.04.01
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Abstract

To evaluate the possibility of the partial melting soldering. wettability of partial melted solders was measured using wetting balance. Off eutectic Sn-Pb allows are wettable in their partial melting zone. Especially, Pb rich alloys showed excellent wettability while wettability of Sn rich alloys were adequate or poor. It is found that wettability increases over $200^{\circ}C$ regardless of composition liquid fraction and phases of the original alloy Sn-7Ag alloy showed good wettability in their partial melting zone, while Sn-65Bi alloy was non-wettable under their melting points.

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