• 한국재료학회지
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• 제20권1호
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• pp.19-24
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• 2010

The current study examined Ag migration from the Ag paste bump in the SABiT technology-applied PCB. A series of experiments were performed to measure the existence/non-existence of Ag in the insulating prepreg region. The average grain size of Ag paste was 30 nm according to X-ray diffraction (XRD) measurement. Conventional XRD showed limitations in finding a small amount of Ag in the prepreg region. The surface morphology and cross section view in the Cu line-Ag paste bump-Cu line structure were observed using a field emission scanning electron microscope (FE-SEM). The amount of Ag as a function of distance from the edge of Ag paste bump was obtained by FE-SEM with energy dispersive spectroscopy (EDS). We used an electron probe micro analyzer (EPMA) to improve the detecting resolution of Ag content and achieved the Ag distribution function as a function of the distance from the edge of the Ag paste bump. The same method with EPMA was applied for Cu filled via instead of Ag paste bump. We compared the distribution function of Ag and Cu, obtained from EPMA, and concluded that there was no considerable Ag migration effect for the SABiT technology-applied printed circuit board (PCB).

• Journal of Welding and Joining
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• 제25권3호
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• pp.57-63
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• 2007

Electrochemical migration characteristics of Pb-free solder alloys are quantitatively correlated with corrosion characteristics in harsh environment conditions. In-situ water drop test and corrosion resistance test for Sn-3.0Ag-0.5Cu solder alloys were carried out in NaBr and NaF solutions to obtain the electrochemical migration lifetime and pitting potential, respectively. Sn-3.0Ag-0.5Cu solder alloy shows similar ionization and electrochemical migration behavior with pure Sn because of Ag and Cu do not migrate due to the formation of resistant intermetallic compounds inside solder itself. Electrochemical migration lifetime in NaBr is longer than in NaF, which seems to be closely related to higher pitting potential in NaBr than NaF solution. Therefore, it was revealed that electrochemical migration lifetime of Sn-3.0Ag-0.5Cu solder alloys showed good correlation to the corrosion resistance, and also the initial ionization step at anode side is believed to be the rate-determining step during electrochemical migration of Pb-free solders in these environments.

• 한국신뢰성학회:학술대회논문집
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• 한국신뢰성학회 2001년도 정기학술대회
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• pp.489-496
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• 2001

컴퓨터 키보드의 시장 불량품을 분석한 결과 여러 키가 동시에 입력되는 현상이 다수 발생되는 것을 알 수 있었다. 정밀분석결과 이의 원인이 키보드 membrane의 패턴을 구성하는 은(Ag) paste의 ion migration발생에 의한 것임을 알 수 있었다. 재현실험을 통해 고온 고습한 환경에서 장시간 사용하다보면 membrane내부로 수분이 침투하여 패턴간에 Ag ion migration이 발생되어 키 동작 오류를 유발시킴을 알 수 있었다. 이에 대한 대책안으로 제조 원가에 크게 영향을 주지 않으면서 migration을 크게 억제할 수 있는 준방수 방식의 membrane을 채택하여 4$0^{\circ}C$, 90%RH 환경에서 최소 5년을 보증할 수 있는 키보드를 제작하였다. 또한, 키보드 membrane의 ion migration 시험시 정상사용 조건을 가속시킬 수 있는 재현 및 검증시험법(85$^{\circ}C$, 85%RH, 가속계수 17배)을 개발하였다.

• Corrosion Science and Technology
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• 제6권2호
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• pp.50-55
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• 2007

The smaller size and higher integration of advanced electronic package systems result in severe electrochemical reliability issues in microelectronic packaging due to higher electric field under high temperature and humidity conditions. Under these harsh conditions, electronic components respond to applied voltages by electrochemical ionization of metal and the formation of a filament, which leads to short-circuit failure of an electronic component, which is termed electrochemical migration. This work aims to evaluate electrochemical migration susceptibility of the pure Sn, Sn-3.5Ag, Sn-3.0Ag-0.5Cu solder alloys in $Na_{2}SO_{4}$. The water drop test was performed to understand the failure mechanism in a pad patterned solder alloy. The polarization test and anodic dissolution test were performed, and ionic species and concentration were analyzed. Ag and Cu additions increased the time to failure of Pb-free solder in 0.001 wt% $Na_{2}SO_{4}$ solution at room temperature and the dendrite was mainly composed of Sn regardless of the solders. In the case of SnAg solders, when Ag and Cu added to the solders, Ag and Cu improved the passivation behavior and pitting corrosion resistance and formed inert intermetallic compounds and thus the dissolution of Ag and Cu was suppressed; only Sn was dissolved. If ionic species is mainly Sn ion, dissolution content than cathodic deposition efficiency will affect the composition of the dendrite. Therefore, Ag and Cu additions improve the electrochemical migration resistance of SnAg and SnAgCu solders.

• Journal of Welding and Joining
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• 제29권5호
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• pp.95-98
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• 2011

Recently, there is a growing tendency that fine-pitch electronic devices are increased due to higher density and very large scale integration. Finer pitch printed circuit board(PCB) is to be decrease insulation resistance between circuit patterns and electrical components, which will induce to electrical short in electronic circuit by electrochemical migration when it exposes to long term in high temperature and high humidity. In this research, the effect of soldering flux acting as an electrical carrier between conductors on electrochemical migration was investigated. The PCB pad was coated with OSP finish. Sn3.0Ag0.5Cu solder paste was printed on the PCB circuit and then the coupon was treated by reflow process. Thereby, specimen for ion migration test was fabricated. Electrochemical migration test was conducted under the condition of DC 48 V, $85^{\circ}C$, and 85 % relative humidity. Their life time could be increased about 22% by means of removal of flux. The fundamentals and mechanism of electrochemical migration was discussed depending on the existence of flux residues after reflow process.

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2006년 추계학술발표대회 개요집
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• pp.136-138
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• 2006

Recently a lots of problems have observed in high densified and high integrated electronic components. One of them is ion migration phenomena, which induce the electrical short of electrical circuit. Ion migration phenomena has been observed in the field of exposing the specific environment and using for a long time. Also as the RoHS restriction was started in July 1st, 2006, Pb-free solder was utilized in electronics assemblies. In this case, it is very important to compatible between components and printed circuit board(PCB), thus surface treatment materials of PCB was changed to Sn, Sn-3.0Ag-0.5Cu, Cu. Therefore these new application become to need to reevaluate the sensitivity about electrochemical ion migration. This study was evaluated the occurrence time of electrochemical ion migration using by water drop test. We utilized PCB(printed circuit board) having a comb pattern as follows 0.1, 0.318, 0.5, 1.0 mm pattern distance. Sn-3.0Ag-0.5Cu and Sn-37Pb were electroplated on the comb pattern. 6.5V and 15.0V were applied in the comb pattern and then we measured the electrical short time causing by occurring the ion migration. In these results, we evaluate the sensitivity and derived the prediction models of ion migration occurrence time depending on the pattern materials, applied voltage and pattern spacing of PCB conductor.

• 방사성폐기물학회지
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• 제8권3호
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• pp.201-205
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• 2010

고준위방사성폐기물에서 유출되어 나오는 아이오딘의 이동을 저지하기 위하여 은을 흡착시킨 벤토나이트 블록에 NaI 용액을 흘려주었을 때 대부분의 아이오딘이 흡착되었다. 이 은이온에 의한 아이오딘의 저지 메커니즘을 상세히 조사하기 위하여 아이오딘과 접촉하기 전후의 은이 흡착된 벤토나이트의 X-ray Absorption Near Edge Structure (XANES)와 Extended X-ray Absorption Fine Structure (EXAFS) 스펙트 럼과 표준물질로서 AgO, $Ag_2O$, AgI의 스펙트럼을 비교하였다. 그 결과, 벤토나이트에 흡착되었던 은이 떨어져 나와 AgI 침전 클러스터를 형성함으로서 아이오딘의 이동이 지연되는 것으로 생각된다.

• 한국재료학회지
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• 제12권5호
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• pp.347-352
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• 2002

A transparent dielectric of the $PbO-B_2O_3-SiO_2-A1_2O_3$ system which was a low melting glass has been used for PDP (Plasma Display Panel), but it has a problem which is a reaction to be occurred between a transparent dielectric layer and electrodes (Ag, ITO) after firing. This research was conducted for ion migration of $Ag^+\$ and $Sn^ {2+}$ during firing three different frits of low melting glass. The result showed that yellowing phenomena occurred through a chemical reaction between $Ag^+\$and $Sn^ {2+}$ at 550~58$0^{\circ}C$ for 20~60 min. In addition, it was confirmed that the migration of $Sn^{2+}$ from ITO electrode made a strong effect on the yellowing phenomena.

• 한국신뢰성학회:학술대회논문집
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• 한국신뢰성학회 2005년도 학술발표대회 논문집
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• pp.385-392
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• 2005

The restriction of the use of hazardous substances in electrical and electronic equipment legislation mandates the substitution of lead and other hazardous substances in electronics products by July 2006. Due to this legislative pressure, the electronics industry is moving to adoption of lead free solders. In this paper, we investigated a flux to restrict generating electrochemical migration in lead-free solder. The lead-free solders used in this study were Sn-0.7Cu-0.01P and Sn-3.0Ag-0.5Cu. To measure the resistance of electrochemical migration, the dew-cycle test and water drop test were adopted. As the result, now flux having high durable of electrochemical migration was developed.

• 대한화학회지
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• 제24권4호
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• pp.295-301
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• 1980

고체전해질 $RbAg_4I_5$의 단결정을 키워서 온도에 따른 전기전도율의 변화를 퍼텐티오메트릭 4-전극방법으로 측정하고 $Ag/RbAg_4I_5$, 계면에 대한 전기화학적 성질을 순환전압전류법으로 조사하였다. 25$^{\circ}C$에서 단결정의 비전기전도율은 $0.284\pm0.003 ohm^{-1}cm^{-1}이었고 \;Ag^+$이온의 이동에 대하여 계산된 활성화에너지는 1.70kcal/mol로서 다결정 시료에 대한 값들과 거의 일치하였다. 순환전압전류법 실험결과 은 기준전극에 대한 전위 0볼트 이하에서는 은 전극에서 $Ag^+$ 이온의 가역적환원이 일어났고 +0.67볼트 이상의 전위에서 요오드화 이온이 산화되어 요오드가 유리되었다. 은의 산화 전위에서 은 전극은 작은 양극전류만을 나타내었으나 환원전위에서 은 전극의 표면에 환원 석출된 은은 다시 양극 전위로 돌아갈 때 아주 큰 산화전류를 나타내었다.