• Proceedings of the KSME Conference
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• 2008.11a
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• pp.333-337
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• 2008

This study investigates crack propagation behavior of Sn-3.0Ag-0.5Cu solder under pull-push loading conditions. Fatigue Crack Growth (FCG) tests were conducted on Center Cracked Plate (CCP) specimens in fast-fast (pp) strain waveform. The fast-slow (pc), slow-fast (cp) and slow-slow (cc) strain waveforms were also used to study the effect of strain rates. The crack propagation rates for the four strain waveforms were correlated with J-integral range and a scatter band of factor 4 was found. The crack growth rates for the pc waveform was highest, followed by cp, cc and then pp waveforms.

• Korean Journal of Veterinary Research
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• v.54 no.2
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• pp.75-79
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• 2014

Bordetella (B.) bronchiseptica is a causative agent of swine atrophic rhinitis that promotes colonization of the mucous membrane of the swine nasal cavity by Pasteurella (P.) multocida. Mixed infection with B. bronchiseptica and P. multocida leads to growth inhibition of pigs, resulting in significant economic loss. There are many commercial vaccines for atrophic rhinitis, including B. bronchiseptica as a killed vaccine antigen (Ag). However, the immunogenicity of killed B. bronchiseptica Ag has not yet been elucidated; therefore, this study was conducted to investigate the immunogenicity of killed B. bronchiseptica Ag and the type of immune response it induces. In vitro assays using mouse spleen cells and flow cytometry revealed that B. bronchiseptica Ag induced high proliferation capability of lymphocytes, especially B lymphocytes, and the proliferating cells showed a significant response to interleukin (IL)-2. B. bronchiseptica Ag also enhanced the production of IL-12, a representative cytokine for cell-mediated immunity. In vivo experiments using mice showed that the injection of B. bronchiseptica Ag markedly induced Ag-specific antibody. Taken together, these results indicate that B. bronchiseptica Ag has high immunogenicity by itself.

• 한국정보디스플레이학회:학술대회논문집
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• 2008.10a
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• pp.420-423
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• 2008

The characteristics of $Al_2O_3/Ag/Al_2O_3$ multilayer passivaton prepared by twin target sputtering (TTS) system for organic light emitting diodes. The $Al_2O_3/Ag/Al_2O_3$ multilayer thin film passivation on a PET substrate had a high transmittance of 86.44 % and low water vapor transmission rate (WVTR) of $0.011\;g/m^2$-day due to the surface plasmon resonance (SPR) effect of Ag interlayer and effective multilayer structure for preventing the intrusion of water vapor. Using synchrotron x-ray scattering and field emission scanning electron microscope (FESEM) examinations, we investigated the growth behavior of Ag layer on the $Al_2O_3$ layer to explain the SPR effect of the Ag layer. This indicates that an $Al_2O_3/Ag/Al_2O_3$ multilayer passivation is a promising thin film passivation scheme for organic based flexible optoelectronics.

• Korean Journal of Materials Research
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• v.16 no.8
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• pp.490-496
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• 2006

ITO monolayer and ITO/Ag/ITO multilayer thin films are prepared by D.C. magnetron sputtering method. Ag layer was inserted for applying ITO to a flexible substrate at low temperature. Carrier concentration and carrier mobility of ITO and ITO/Ag/ITO thin films were measured, the transmittance of them also was done. The amorphous phase was confirmed to be combined in addition to (400) and (440) peaks from XRD result of ITO thin film. As the substrate temperature increased, the preferred orientation of (400) appeared. From the result of application of Ag layer at room temperature, the growth of columnar structure was inhibited, and the amorphous phase formed mostly. The ITO/Ag/ITO thin film represented the transmittance of above 80% when the thickness of Ag layer was 50 ${\AA}$, and the concentration of carrier increased up to above 10 times than that of ITO thin film. Finally, since very low resistance of 3.9${\Omega}/{\square}$ was observed, the effective application of low temperature process is expected to be possible for ITO thin film.

• Bulletin of the Korean Chemical Society
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• v.27 no.4
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• pp.556-562
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• 2006

Studies on Ag nanoparticles grown on Highly Ordered Pyrolytic Graphite (HOPG) using HREELS provide different results for smaller and larger particle sizes corresponding to Ag coverages below and above 4 monolayers, respectively. For the larger particles, a positive frequency shift with decreasing particle size and a broadening of the plasmon resonance were observed with decreasing particle size, in line with previous studies on Ag on alumina. For the smaller particles, in contrast, a shift to lower energy with decreasing particle size, and a narrowing of the plasmon resonance with decreasing particle size can be found. The asymmetry of the Ag-features present for Ag coverages above 4 monolayers disappears for Ag coverages below 4 monolayers. The result for the smaller particles can be rationalized in terms of change of the particle growth mode with increasing particle size, which corroborates our STM data, as well as electronic effects due to the metal/support charge transfer.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.27 no.2
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• pp.75-79
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• 2017

Honeycomb-shaped Ag-grid transparent conductive electrodes (TCEs) were fabricated using two different processes, high density plasma etching and lift-off, and the optical and electrical properties were compared according to the fabrication method. For the fabrication of the Ag-grid TCEs by plasma etching, etch characteristics of the Ag thin film in $10CF_4/5Ar$ inductively coupled plasma (ICP) discharges were studied. The Ag etch rate increased as the power increased at relatively low ICP source power or rf chuck power conditions, and then decreased at higher powers due to either decrease in $Ar^+$ ion energy or $Ar^+$ ion-assisted removal of the reactive F radicals. The Ag-grid TCEs fabricated by the $10CF_4/5Ar$ ICP etching process showed better grid pattern transfer efficiency without any distortion or breakage in the grid pattern and higher optical transmittance values of average 83.3 % (pixel size $30{\mu}m/line$ width $5{\mu}m$) and 71 % (pixel size $26{\mu}m/line$ width $8{\mu}m$) in the visible range of spectrum, respectively. On the other hand, the Ag-grid TCEs fabricated by the lift-off process showed lower sheet resistance values of $2.163{\Omega}/{\square}$ (pixel size $26{\mu}m/line$ width $18{\mu}m$) and $4.932{\Omega}/{\square}$ (pixel size $30{\mu}m/line$ width $5{\mu}m$), respectively.

• Proceedings of the KWS Conference
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• 2002.10a
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• pp.450-455
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• 2002

Cu-cored Sn-Ag solder balls were fabricated by coating pure Sn and Ag on Cu balls. The melting behavior and the solderability of the BGA joint with the Ni/Au coated Cu pad were investigated and were compared with those of the commercial Sn-Ag and Sn-Ag-Cu balls. DSC analyses clarified the melting of Cu-cored solders to start at a rather low temperature, the eutectic temperature of Sn-Ag-Cu. It was ascribed to the diffusion of Cu and Ag into Sn plating during the heating process. After reflow soldering the microstructures of the solder and of the interfacial layer between the solder and the Cu pad were analyzed with SEM and EPMA. By EDX analysis, formation of a eutectic microstructure composing of $\beta$-Sn, Ag$_3$Sn, ad Cu$_{6}$Sn$_{5}$ phases was confirmed in the solder, and the η'-(Au, Co, Cu, Ni)$_{6}$Sn$_{5}$ reaction layer was found to form at the interface between the solder and the Cu pad. By conducting shear tests, it was found that the BGA joint using Cu-cored solder ball could prevent the degradation of joint strength during aging at 423K because of the slower growth me of η'-(Au, Co, Cu, Ni)$_{6}$Sn$_{5}$ reaction layer formed at the solder, pad interface. Furthermore, Cu-cored multi-component Sn-Ag-Bi balls were fabricated by sequentially coating the binary Sn-Ag and Sn-Bi solders on Cu balls. The reflow property of these solder balls was investigated. Melting of these solder balls was clarified to start at the almost same temperature as that of Sn-2Ag-0.75Cu-3Bi solder. A microstructure composing of (Sn), Ag$_3$Sn, Bi and Cu$_{6}$Sn$_{5}$ phases was found to form in the solder ball, and a reaction layer containing primarily η'-(Au, Co, Cu, Ni)$_{6}$Sn$_{5}$ was found at the interface with Ni/Au coated Cu pad after reflow soldering. By conducting shear test, it was found that the BGA joints using this Cu-core solder balls hardly degraded their joint shear strength during aging at 423K due to the slower growth rate of the η'-(Au, Cu, Ni)$_{6}$Sn$_{5}$ reaction layer at the solder/pad interface.he solder/pad interface.

• Journal of Plant Biotechnology
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• v.50
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• pp.183-189
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• 2023

This study investigated the impact of two distinct MS basal media: one containing FeNaEDTA and the other FeEDDHA, on the growth of five unique gerbera cultivars (Shy Pink, Pink Holic, Breeze, Harmony, Snow Dream). Notably, the response to these media types varied significantly among the cultivars, particularly concerning leaf yellowing and plant growth. 'Shiny Pink' and 'Pink Holic' exhibited leaf yellowing on the FeNaEDTA-containing medium but displayed leaf greening on the FeEDDHA-containing medium. In contrast, 'Snow Dream,' 'Harmony,' and 'Breeze' remained unaffected on both medium types. However, the FeNaEDTA-containing medium promoted higher plant height and petiole length in 'Breeze,' 'Harmony,' and 'Snow Dream' than the FeNaEDTA-containing medium did. A promotive effect of silver nanoparticles (AgNPs) on plant growth and leaf greening was observed in 'Pink Holic,' particularly on the FeNaEDTA-containing medium, while the addition of AgNPs to the FeEDDHA-containing medium negatively affected plant growth. These results highlight the substantial influence of medium type, specifically the presence of FeNaEDTA or FeEDDHA, on gerbera growth responses, emphasizing the critical role of medium selection in gerbera propagation. Additionally, when contemplating the addition of AgNPs for in vitro gerbera propagation, it is crucial to consider the medium type.

• Journal of Microbiology and Biotechnology
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• v.14 no.4
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• pp.653-657
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• 2004

The cold resistant mutants of P. fluorescens strain $PRS_{9}$ and ATCC13525 were developed which could grow equally well at $28^{\circ}C$ and $10^{\circ}C$. All the mutants were tested for siderophore production, of which $CRPF_9$ (ATCC13525 mutant) was selected, as there was a 16.8-fold increase when compared to its wild-type. Under in vitro conditions, $CRPF_9$ showed better growth promotion both in wheat (29.1% increase in root length) and mung bean (51.5% increase in root length) at $10^{\circ}C$. Greenhouse trials showed a significant increase in root (13.84cm) and shoot (15.0cm) length of $CRPF_9$-treated mung bean seeds, indicating increased rhizocompetence of the mutant. Ferric citrate was a better iron source than ferric hydroxide for plant growth.

• KSBB Journal
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• v.5 no.4
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• pp.365-371
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• 1990

To improve the growth of mouse hybridoma 2c3.1 secreting anti-Hepatitis B surface antigen monoclonal antibody (anti-HBsAg MAb), we had constructed an enriched medium and observed the effects of fetal bovine serum and serum-free supplements including human serum albumin, 'insulin and transferrin', and monoethanolamine. For further enhancement of growth, the concentrations of two major energy sources, glucose and glutamine, were strengthened with various ratios in the enriched medium. Maximum cell growth and monoclonal antibody production obtained in various ratios of glucose/glutamine with an inoculation concentration of 2$\times$105 cells/ml were 0.73$\times$106-4.62$\times$106 cells/ml and 65.1-422.6 $\mu\textrm{g}$/ml, respectively. Glutamine was round to be a major energy source and a limiting nutrient in comparison to glucose for 2c3.1 cell cultivation in enriched media with low serum.