• Title/Summary/Keyword: Ag growth

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Fabrication and characterization of Sn-3.0Ag-0.5Cu, Sn-0.7Cu and Sn-0.3Ag-0.5Cu alloys (Sn-3.0Ag-0.5Cu, Sn-0.7Cu 및 Sn-0.3Ag-0.5Cu 합금의 제조 및 특성평가)

  • Lee, Jung-Il;Paeng, Jong Min;Cho, Hyun Su;Yang, Su Min;Ryu, Jeong Ho
    • Journal of the Korean Crystal Growth and Crystal Technology
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    • v.28 no.3
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    • pp.130-134
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    • 2018
  • In the past few years, various solder compositions have been a representative material to electronic packages and surface mount technology industries as a replacement of Pb-base solder alloy. Therefore, extensive studies on process and/or reliability related with the low Ag composition have been reported because of recent rapid rise in Ag price. In this study, Sn-3.0Ag-0.5Cu, Sn-0.7Cu and Sn-0.3Ag-0.5Cu solder bar samples were fabricated by melting of Sn, Ag and Cu metal powders. Crystal structure and element concentration were analyzed by XRD, XRF, optical microscope, FE-SEM and EDS. The fabricated solder samples were composed of ${\beta}-Sn$, ${\varepsilon}-Ag_3Sn$ and ${\eta}-Cu_6Sn_5$ phases.

Lead-Free Solders and Processing Issues Relevant to Microelectronics Packaging

  • Kang, Sung K.
    • Proceedings of the International Microelectronics And Packaging Society Conference
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    • 2003.09a
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    • pp.147-163
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    • 2003
  • European Union bans the usage of Pb in electronics from July 1 st, 2006. The Near-eutectic Sn-Ag-Cu alloys are the leading candidate Pb-free solders (for SMT card assembly). .The microstructure of Sn-Ag-Cu alloys is discussed in terms of solidification, composition and cooling rate. Methods of controlling Ag3Sn plates are discussed. .Thermo-mechanical fatigue behaviors of Sn-Ag-Cu solder joints are reviewed. Tin pest, whisker growth, electromigration of Pb-free solders are discussed.

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Reflectivity characteristics of Ag nano-crystals grown by electroless plating (무전해 도금에 의해 성장되어진 은 나노결정의 반사율 특성)

  • Kim, Shin-Woo
    • Journal of the Korean Crystal Growth and Crystal Technology
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    • v.23 no.5
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    • pp.218-223
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    • 2013
  • In this study, the reflectivity characteristics of Ag nano-coating grown by electroless plating were investigated in order to use as the reflecting plate of BLU (Back Light Unit) in the LCD (Liquid Crystal Display) or LED (Light Emitting Diode) display equipment. The microstructure of Ag nano-coating was polycrystalline nano-structure that consisted of Ag nano-crystals to be reduced and precipitated, and the size of reduced nano-crystals increased as the thickness of nano-coating increased. The reflectivity of Ag nano-coating in the visible light decreased as the thickness of nano-coating increased and the reduction of reflectivity was more severe in the short wavelength region of visible light. The decrease of reflectivity was closely related to the size of Ag nano-crystal and was thought to be due to the larger surface roughness of larger nano-coating thickness. Therefore, the finer Ag nano-crystals and thinner nano-coating thickness could be favorable for the higher reflectivity of Ag nano-coating grown by electroless plating.

Effect of Ag Addition on the Mechanical Properties of 7050 Al Alloy (Ag 첨가가 7050 Al합금의 기계적 성질에 미치는 영향)

  • Kwak, S.H.;Chung, Y.H.;Kwun, S.I.;Cho, K.K.;Shin, M.C.
    • Journal of the Korean Society for Heat Treatment
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    • v.12 no.2
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    • pp.129-135
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    • 1999
  • The effects of Ag addition on the microstructures and mechanical properties of 7050 Al alloy were investigated. Various homogenizing and aging treatments were carried out to analyze the controversial effects of Ag in 7050 Al alloy. Transmission electron microscopy(TEM) was used for microstructural analysis. The hardening precipitates(${\eta}^{\prime}$) become finer with Ag addition. It suggests that Ag promotes easier nucleation of ${\eta}{\prime}$. The strength of overaged Ag bearing alloys are higher than that of Ag free alloy. Hardening precipitates(${\eta}^{\prime}$) in Ag bearing alloys are smaller than that of Ag free alloys, because the growth rate of ${\eta}^{\prime}$ during overaging stage is lower in Ag bearing alloys.

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Evaluation of the Biocontrol Potential of Some Medicinal Plant Materials Alone and in Combination with Trichoderma harzianum Against Rhizoctonia solani AG 2-1

  • Lee, Hye-Min;Khan, Zakaullah;Kim, Sang-Gyu;Baek, Nam-In;Kim, Young-Ho
    • The Plant Pathology Journal
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    • v.27 no.1
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    • pp.68-77
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    • 2011
  • Fifty five species of medicinal plant materials were tested for their antifungal activity in vitro against Rhizoctonia solani AG 2-1 and Trichoderma harzianum to select plant species that can be used to improve the biocontrol efficacy of T. harzianum. Six species were effective against R. solani AG 2-1 but were also antagonistic to T. harzianum, except for Cinnamomum loureirii stem bark (CSB). CSB inhibited mycelial growth of R. solani AG 2-1 by 73.7% but showed an inhibitory effect on mycelial growth of T. harzianum by only 2.2%. Scanning electron microscophs showed that the CSB treatment resulted in deformed R. solani AG 2-1 hyphal cells, and transmission electron microscophs revealed degenerated cell structures such as degenerated cytoplasm and disentangled cell wall and the accumulation of electron-dense inclusions (asterisks) in the CSB treatment. The biocontrol efficacy of radish damping-off increased greatly following the combined treatments of T. harzianum and CSB and the combined treatment increased efficacy from 6.4-23.1% to 37.1-87.3% compared with either treatment alone. CSB did not affect T. harzianum population growth, as it was almost the same in rice-bran peat medium (culture) amended with 0.1% and 1.0% CSB powder as in non-amended medium. The formulation of T. harzianum in rice-bran peat medium amended with CSB powder reduced the severity of radish damping-off by 80.6%, suggesting that T. harzianum and CSB can be formulated as a biocontrol product for the control of R. solani AG 2-1.

Synthesis of Cysteine Capped Silver Nanoparticles by Electrochemically Active Biofilm and their Antibacterial Activities

  • Khan, Mohammad Mansoob;Kalathil, Shafeer;Lee, Jin-Tae;Cho, Moo-Hwan
    • Bulletin of the Korean Chemical Society
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    • v.33 no.8
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    • pp.2592-2596
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    • 2012
  • Cysteine capped silver nanoparticles (Cys-AgNPs) have been synthesized by employing electrochemically active biofilm (EAB), $AgNO_3$ as precursor and sodium acetate as electron donor in aqueous solution at $30^{\circ}C$. Cys-AgNPs of 5-10 nm were synthesized and characterized by UV-Vis, FT-IR, XRD and TEM. Capping of the silver nanoparticles with cysteine provides stability to nanoparticles by a thiolate bond between the amino acid and the nanoparticle surface and hydrogen bonding among the Cys-AgNPs. In addition, the antibacterial effects of as-synthesized Cys-AgNPs have been tested against two pathogenic bacteria Escherichia coli (O157:H7) and Pseudomonas aeruginosa (PAO1). The results demonstrate that the as-synthesized Cys-AgNPs can proficiently inhibit the growth and multiplication of E. coli and P. aeruginosa.

Isolation and Identification of Antagonistic Bacteria for Biological Control of Large Patch Disease of Zoysiagrass Caused by Rhizoctonia solani AG2-2 (IV) (들잔디 갈색퍼짐병의 생물학적 방제를 위한 길항 세균의 분리와 동정)

  • Song, Chi-Hyun;Islam, Md. Rezuanul;Chang, Tae-Hyun;Lee, Yong-Se
    • Asian Journal of Turfgrass Science
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    • v.26 no.1
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    • pp.8-16
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    • 2012
  • The objective of this study was to identify bacterial antagonists of R. solani AG2-2 (IV) on zoysiagrass and to evaluate their antifungal activity in vitro and in vivo to select an antagonistic isolate. Antagonistic isolates that inhibit large patch disease caused by R. solani AG2-2 (IV) in zoysiagrass were selected from several soils, and their antagonistic activities were investigated in vitro and in vivo. Of 216 bacterial isolates, 67 inhibited several plant pathogenic fungi. The isolates that inhibited stem-segment colonization by R. solani AG2-2 (IV) in zoysiagrass were tested in a growth chamber. Eleven isolates were active as plant growth promoting isolates. Among them, five plant growth promoting isolates and their concentration dependent efficiency on zoysiagrass following inoculation with R. solani AG2-2 (IV) was evaluated. Isolate H33 was one of the potential antagonistic isolates, and it was further tested against various plant pathogens. H33 not only suppressed the disease caused by R. solani AG2-2 (IV) on zoysiagrass but also promoted leaf weight and leaf height of zoysiagrass under growth chamber and greenhouse conditions. The H33 isolate, which belongs to Streptomyces arenae, was identified through physiological, biochemical, and 16S rDNA studies. Further studies will investigate the cultural characterization of S. arenae H33 and isolation and identification of antifungal substance produced by S. arenae H33.

A study on the interfacial reactions between electroless Ni-P UBM and 95.5Sn-4.0Ag-0.5Cu solder bump (무전해 Ni-P UBM과 95.5Sn-4.0Ag-0.5Cu 솔더와의 계면반응 및 신뢰성에 대한 연구)

  • ;;Sabine Nieland;Adreas Ostmann;Herbert Reich
    • Proceedings of the International Microelectronics And Packaging Society Conference
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    • 2002.05a
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    • pp.85-91
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    • 2002
  • Even though electroless Hi and Sn-Ag-Cu solder are widely used materials in electronic packaging applications, interfacial reactions of the ternary Ni-Cu~Sn system have not been known well because of their complexity. Because the growth of intermetallics at the interface affects reliability of solder joint, the intermetallics in Ni-Cu-Sn system should be identified, and their growth should be investigated. Therefore, in present study, interfacial reactions between electroless Ni UB7f and 95.5Sn-4.0Ag-0.5Cu alloy were investigated focusing on morphology of the IMCs, thermodynamics, and growth kinetics. The IMCs that appear during a reflow and an aging are different each other. In early stage of a reflow, ternary IMC whose composition is Ni$_{22}$Cu$_{29}$Sn$_{49}$ forms firstly. Due to the lack of Cu diffusion, Ni$_{34}$Cu$_{6}$Sn$_{60}$ phase begins growing in a further reflow. Finally, the Ni$_{22}$Cu$_{29}$Sn$_{49}$ IMC grows abnormally and spalls into the molten solder. The transition of the IMCs from Ni$_{22}$Cu$_{29}$Sn$_{49}$ to Ni$_{34}$Cu$_{6}$Sn$_{60}$ was observed at a specific temperature. From the measurement of activation energy of each IMC, growth kinetics was discussed. In contrast to the reflow, three kinds of IMCs (Ni$_{22}$Cu$_{29}$Sn$_{49}$, Ni$_{20}$Cu$_{28}$Au$_{5}$, and Ni$_{34}$Cu$_{6}$Sn$_{60}$) were observed in order during an aging. All of the IMCs were well attached on UBM. Au in the quaternary IMC, which originates from immersion Au plating, prevents abnormal growth and separation of the IMC. Growth of each IMC is very dependent to the aging temperature because of its high activation energy. Besides the IMCs at the interface, plate-like Ag3Sn IMC grows as solder bump size inside solder bump. The abnormally grown Ni$_{22}$Cu$_{29}$Sn$_{49}$ and Ag$_3$Sn IMCs can be origins of brittle failure.failure.

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Influence of Surfactants(Ag, Sn) in Si/Si(111) Homoepitaxial Growth (Si(111) Homoepitaxial성장에서 중간금속이 미치는 영향)

  • Gwak, Ho-Won;Lee, Ui-Wan;Park, Dong-Su;Gwak, Lee-Sang;Lee, Chung-Hwa;Kim, Hak-Bong;Lee, Un-Hwan
    • Korean Journal of Materials Research
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    • v.3 no.3
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    • pp.230-236
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    • 1993
  • We have the homoepitaxiallayers on the surfaces of Si(111) with and without the adsorbed surfactants, for example, Ag or Sn. In this paper, We have studied the difference of growth for these two cases by the observation of intensity oscillations of RHEED specular spots during the growing processes. In the case of growth without the adsorbed surfactants, the Si atoms fill first the stacking fault layer of Si(111) 7 ${\times}$7 structure. Therefore, the irregular oscillations are observed in the early stage of growing process. However, in the case of growth with the adsorbed surfactants, the surfactants already have the ${\sqrt}{3}$ ${\times}$ ${\sqrt}{3}$ structures on the surfaces of Si(111) at the adjucate temperatures of 300`$600^{\circ}C$ and 190~$860^{\circ}C$ for the surfactants of Ag and Sn, respectively. We also find that the number of oscillations is a little larger for the case of growth with the adsorbed surfactants. The reason for this is that for the case of growth with the adsorbed surfactants, the activation energies of Si atoms decrease due to the segregation of surfactants toward the growing surfaces.

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Response of Systemic Fungicides of Rhizoctonia spp. Causing Rhizoctonia Blight on Turfgrass (잔디에 Rhizoctonia 마름병을 유발하는 Rhizoctonia spp.의 침투성 살균제에 대한 반응)

  • Chang, Taehyun;Lee, Seong Jun
    • Weed & Turfgrass Science
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    • v.2 no.4
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    • pp.387-394
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    • 2013
  • The Rhizoctonia blight causing by Rhizoctonia spp. is an important disease of turfgrass, requiring fungicide application to maintain acceptable conditions for turfgrass good qualities in the golf course. The experiment was conducted to determine the mean 50% effective concentration inhibiting mycelial growth ($EC_{50}$) value of to flutolanil, pyraclostrobine and hexaconazole to Rhizoctonia solani AG-1 IB, Rhizoctonia cerealis and Rhizoctonia solani AG2-2IV isolated from Gyeongbuk province of Korea in vitro. Five discriminatory concentrations of each fungicide were used to detect in vitro sensitivity. The mean of $EC_{50}$ values to three systemic fungicides was the lowest isolate of R. solani AG-1 IB. However, the sensitivity of fungicides to Rhizoctonia solani AG2-2IV were higher mean $EC_{50}$ value of 0.026 ${\mu}g\;a.i.\;ml^{-1}$ of pyraclostrobine and 0.044 ${\mu}g\;a.i.\;ml^{-1}$ of flutolanil. R. cerealis was the lowest sensitivity to hexaconazole which was an average $EC_{50}$ value of 0.022 ${\mu}g\;a.i.\;ml^{-1}$. Inhibition of mycelial growth rate (%) by three combine fungicides using the $EC_{50}$ value of each fungicide was the highest R. solani AG2-2IV. Results of this study were may confirmed in vitro response fungicide of three Rhizoctonia species for control of Rhizoctonia blight in the field.