1 |
J.M. Lee, J.T. Jeon, B.K. Jung, G.D. Lee and M.J. Moon, "Characterization of Al Films Prepared by Sputtering", J. Korean Ind. Eng. Chem. 15 (2004) 393.
과학기술학회마을
|
2 |
M. Zaborowski and P. Dumania, "Kinetics of hillock growth in Al and Al-alloys", Microelectronic Eng. 50 (2000) 301.
DOI
ScienceOn
|
3 |
S.K. Saha, R.S. Howell and M.K. Hatalis, "Elimination of hillock formation in al interconnects using Ni or Co", J. Appl. Phys. 86 (1999) 625.
DOI
|
4 |
B.C. Martin, C.J. Tracy, J.W. Mayer and L.E. Hendrickson, "A comparative study of hillock formation in aluminum films", Thin Solid Films 271 (1995) 64.
DOI
ScienceOn
|
5 |
S. Aceto, C.Y. Chang and R.W. Vook, "Hillock growth on aluminium and aluminium alloy films", Thin Solid Films 219 (1992) 80.
DOI
ScienceOn
|
6 |
A. Gladkikh, Y. Lereah, E. Glickman, M. Karpovski, A. Palevski and J. Schubert, "Hillock formation during electromigration in Cu and Al thin films: Three-dimensional grain growth", Appl. Phys. Lett. 66 (1995) 1214.
DOI
ScienceOn
|
7 |
S.J. Hwang, J.H. Lee, C.O. Jeong and Y.C. Joo, "Effect of film thickness and annealing temperature on hillock distributions in pure Al films", Scripta Mater. 56 (2007) 17.
DOI
ScienceOn
|
8 |
ASM Handbook Vol. 2 10th Ed. (1990) 1157.
|
9 |
H.T. Yeom and J.S. Lee, "Electroplating surface treatment", Munoondang (2000) 265.
|
10 |
N.I. Kim and S.S. Jang, "Electoless plating", Dongwha- Gisul (1996) 15.
|