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http://dx.doi.org/10.6111/JKCGCT.2018.28.3.130

Fabrication and characterization of Sn-3.0Ag-0.5Cu, Sn-0.7Cu and Sn-0.3Ag-0.5Cu alloys  

Lee, Jung-Il (Department of Materials Science and Engineering, Korea National University of Transportation)
Paeng, Jong Min (Department of Materials Science and Engineering, Korea National University of Transportation)
Cho, Hyun Su (Department of Materials Science and Engineering, Korea National University of Transportation)
Yang, Su Min (Department of Materials Science and Engineering, Korea National University of Transportation)
Ryu, Jeong Ho (Department of Materials Science and Engineering, Korea National University of Transportation)
Publication Information
Journal of the Korean Crystal Growth and Crystal Technology / v.28, no.3, 2018 , pp. 130-134 More about this Journal
Abstract
In the past few years, various solder compositions have been a representative material to electronic packages and surface mount technology industries as a replacement of Pb-base solder alloy. Therefore, extensive studies on process and/or reliability related with the low Ag composition have been reported because of recent rapid rise in Ag price. In this study, Sn-3.0Ag-0.5Cu, Sn-0.7Cu and Sn-0.3Ag-0.5Cu solder bar samples were fabricated by melting of Sn, Ag and Cu metal powders. Crystal structure and element concentration were analyzed by XRD, XRF, optical microscope, FE-SEM and EDS. The fabricated solder samples were composed of ${\beta}-Sn$, ${\varepsilon}-Ag_3Sn$ and ${\eta}-Cu_6Sn_5$ phases.
Keywords
Sn-Ag-Cu alloys; Crystal structures; Microstructure;
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