• Composites Research
• /
• v.35 no.2
• /
• pp.69-74
• /
• 2022

In this study, the conductive paste used in a wide range such as wiring in the electronic packaging field, the automobile industry, and electronic products is manufactured under various process conditions due to the simplicity of the process, and then the thermal, mechanical, and electrical characteristics are analyzed and simulation studies are conducted to optimize the process. to establish the conditions of the conductive paste manufacturing process. First, a conductive paste was prepared by setting various types of binder resin, an essential component of the conductive paste, and characteristics such as thermal conductivity, tensile strength, and elongation were analyzed. Among the binder resins, the conductive paste applied with a flexible epoxy material had the best physical properties, and a simulation study was conducted based on the physical property data base of the conductive face. As a result of the simulation, the best physical properties were exhibited when the Ag flake volume fraction was 60%.

• Journal of the Microelectronics and Packaging Society
• /
• v.22 no.4
• /
• pp.57-63
• /
• 2015

In order to prepare a low-cost conductive filler material possessing improved anti-oxidation property, Ag-coated Cu flakes were fabricated and the effects of an applying method of ammonium-based pretreatment solution on the Cu flakes were analyzed. The pretreatment solution was used to remove the surface oxide layer on Cu flake. During a single-stage pretreatment process, hole-shaped defects were formed on the flake surface during the pretreatment after 2 min, and the number and size increased in proportion to the pretreatment time. In the case that Ag plating solution was injected in the pretreatment solution after the pretreatment for 2 min, the defects were also formed during Ag plating. In contrast, the defects tremendous decreased in the case that the pretreatment solution was removed after the first pretreatment for 2 min and the Ag plating proceeded after the second pretratment using a low concentration pretreatment solution. As the final result, the 15 wt% Ag-coated Cu flake sample which was fabricated using the single-stage pretreatment oxidized at $166^{\circ}C$, but the sample fabricated by the double-stage pretreatment oxidized at $224^{\circ}C$, indicating definitely improved anti-oxidation property.

• Journal of the Microelectronics and Packaging Society
• /
• v.24 no.3
• /
• pp.57-62
• /
• 2017

In the process for preparing Ag-coated Cu flakes by electroless silver plating using hydroquinone reducing agent, Ag coating qualities were compared by changing various process parameters such as type of pretreatment solution, plating temperature, pH of plating solution, type and injection rate of plating solution, and pulp density. Effective pretreatment solution for removing the oxide layer on a Cu flake was preferentially suggested. The conditions of low plating temperature, pH value of 4.34, slow injection rate of Ag plating solution, elimination of deionized water in the Ag plating solution, and high pulp density significantly suppressed the formation of separated tiny Ag particles, and thus the surface coverage of Ag coating on Cu flakes was enhanced.

• Journal of the Microelectronics and Packaging Society
• /
• v.21 no.4
• /
• pp.51-56
• /
• 2014

After the preparation of low-cost conductive paste containing Ag-coated Cu flakes, thermal conductivity and electrical resistivity of the paste were measured with different curing conditions. Under air-curing conditions, the thermal conductivity of the cured sample increased with an increase of curing time from 30 to 60 min. After identical curing time of 60 min, the sample cured under nitrogen indicated more enhanced thermal conductivity than that cured under air, approaching that of paste containing pure Ag flakes. Under air-curing conditions, meanwhile, the electrical resistivity of the cured sample increased with an increase of curing time from 30 to 60 min. After identical curing time of 60 min, however, the sample cured under nitrogen indicated extremely enhanced electrical resistivity ($7.59{\times}10^{-5}{\Omega}{\cdot}cm$) in comparison with that cured under air.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.37 no.4
• /
• pp.420-426
• /
• 2024

This study proposes an innovative methodology for developing flexible printed circuit boards (FPCBs) capable of conforming to three-dimensional shapes, meeting the increasing demand for electronic circuits in diverse and complex product designs. By integrating a traditional flat plate-based fabrication process with a subsequent three-dimensional thermal deformation technique, we have successfully demonstrated an FPCB that maintains stable electrical characteristics despite significant shape deformations. Using a modified polyimide substrate along with Ag flake-based conductive ink, we identified optimized process variables that enable substrate thermal deformation at lower temperatures (~130℃) and enhance the stretchability of the conductive ink (ε ~30%). The application of this novel FPCB in a prototype 3D-shaped sensor device, incorporating photosensors and temperature sensors, illustrates its potential for creating multifunctional, shape-adaptable electronic devices. The sensor can detect external light sources and measure ambient temperature, demonstrating stable operation even after transitioning from a planar to a three-dimensional configuration. This research lays the foundation for next-generation FPCBs that can be seamlessly integrated into various products, ushering in a new era of electronic device design and functionality.

• Analytical Science and Technology
• /
• v.23 no.2
• /
• pp.216-223
• /
• 2010

In previous research, results on efficiency versus size and type of Ag particles showed similarity of detection efficiency comparing the particles of flake and spherical type with the gray particle on the market and in the case of nAg (rod, $0.9\;{\mu}m$) particle, relatively good results was given in the various evaluation methods for detection efficiency of latent fingerprint. However, oxidation was occurred when nAg particles laying on nature condition for a month and due to water absorption, detection efficiency was decreased. Therefore, with need to prevent oxidation and water absorption, more research is necessary. In this research, surface modification on nAg particles using silicon oil was conducted in various methods for complementing weakness of oxidation and water absorption. Then detection efficiency of nAg particles and surface modified nAg particles was evaluated by the number of feature points on the surface of non-porous materials (glass, plastic etc.) and degree of particle adhesion with ridges and contrast of detected fingerprint. Improvement of preventing oxidation and water absorbtion was given by surface modification using silicon oil (DC200, 0.5%) on the surface of non-porous materials.

• Journal of Fashion Business
• /
• v.21 no.6
• /
• pp.16-30
• /
• 2017

Currently, e-textile market is rapidly expanding and the emerging area of e-textiles requires electrically conductive threads for diverse applications, including wearable innovative e-textiles that can transmit/receive and display data with a variety of functions. This study introduces hybrid nano-structures which may help increase the conductivity of the textile threads for use in wearable and flexible smart apparels. For this aim, Ag was selected as a conductive material, and yarn treatment was implemented where silver nanowire (AgNW) and graphene flake (GF) hybrid structures overcome the limitations of the AgNW alone. The yarn treatment includes several treatment conditions, e.g., annealing temperature, annealing time, binder material such as polyurethane (PU), coating time, in order to search for the optimum method to form stable conductive nano-scale composite materials as thin film on the surface of textile yarns. Treatedyarns showed improved electrical resistance readings. The functionality of the spandex yarn as a stretchable conductive thread was also demonstrated. When the yarn specimens were treated with colloid of AgNW/GF, relatively good electrical conductivity value was obtained. During the extension and recovery cycles of the treated yarns, the initial resistance values did not deteriorate significantly, since the network of nanowire structure with the support of GF and polyurethane stayed flexible and stable. Through this research, it was found that when one-dimensional structure of AgNW and two-dimensional structure of GF were mixed as colloids and treated on the surface of textile yarns, flexible and stretchable electrical conductor could be formed.

• Journal of the Microelectronics and Packaging Society
• /
• v.29 no.4
• /
• pp.35-40
• /
• 2022

In this study, the average particle size of silver powder was 2㎛, 7㎛, and a mixture of these (50:50wt%), three kinds of silver pastes were prepared. In addition, as a result of examining the viscosity and viscoelasticity of the three silver pastes, TGA measurement, resistance change according to strain, and change in surface structure of the electrode, the following conclusions were obtained. Summarizing these results, it was found that it is most desirable to have a particle size of about 2㎛ in order to minimize the change in resistance due to strain.

• Advances in nano research
• /
• v.10 no.4
• /
• pp.373-383
• /
• 2021

In this work, silver nitrate complexes of sulfanilamide-5-methyl-2-thiophene carboxaldehyde (SMTCA) ligand intercalated Zn/Al-layered double hydroxide [Ag-SMTCA-LDH] were synthesized for the potential application as an antimicrobial system. The SMTCA ligand was synthesized by reacting sulfanilamide and 5-methyl-2-thiophene carboxaldehyde in methanol and further complexation with silver nitrate metal ions [Ag-SMTCA]. The structural analyses of synthesized compounds confirmed an intercalation of Ag-SMTCA into Zn/Al-NO₃-LDH by flake/restacking method. SMTCA, Ag-SMTCA and Ag-SMTCA-LDH were characterized by ¹H nuclear magnetic resonance (¹H NMR) spectroscopy, Fourier-transform infrared (FTIR), ultraviolet-visible (UV-Vis) spectrophotometer, scanning electron microscopy (SEM) and transmission electron microscopy (TEM), X-ray diffraction (XRD), and thermogravimetric analysis (TGA). It was found that Ag-SMTCA-LDH exhibited good antimicrobial activity against both gram-positive (Bacillus subtilis, [B. subtilis], Staphylococcus aures, [S. aureus]) and gram-negative (Escherichia coli, [E. coli], Pseudomonas aeruginosa [P. aeroginosa]) bacteria as well as excellent antioxidant activity.

• Journal of Powder Materials
• /
• v.11 no.6 s.47
• /
• pp.477-485
• /
• 2004

Monodispersed flaky silver powder was obtained by controlling the ratios of $H_{2}O_{2}/NH_{3}$ and Agin in a mixed solution of ethylene glycol and ammonia with an addition of PVP. The effects of $NH_{3}/Ag,\; H_{2}O_{2}/Ag\;and\;H_{2}PtCl_{6}/Ag$ on its morphology and size were investigated. In $H_{2}O_{2}-NH_{3}-AgNO_{3}\;system,\;NH_{3}/Ag$ molar ratio was found to be an important reaction factor for the nucleation and crystal growth of Ag powder. The synthesis of flaky powder was optimized at over 6 of $NH_{3}/Ag \;and\;5\;of\;H_{2}O_{2}/Ag\;under\;1.0{\times}10^{-3}\;of\;Pt/Ag.\;Moreover,\;as\;the\; NH_{3}/Ag$ molar ratio increased, the size of precipitates was increased regardless of the amount of Pt. In the absence of $H_{2}PtCI$, the morphology and size of reduced Ag powder were found to be irregular in shape $2-4{\mu}m$ in diameter. However, homogenized fine Ag powder was obtained due to heterogeneous nucleation when $H_{2}PtCI$ used as a cat-alyst, and flaky one was synthesized with the addition of Pt over $1.0{\times}10^{-3}$ of Pt/Ag.