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http://dx.doi.org/10.6117/kmeps.2017.24.3.057

Effects of Process Variables on Preparation of Silver-Coated Copper Flakes Using Hydroquinone Reducing Agent  

Chee, Sang-Soo (Department of Materials Science & Engineering, Seoul National University of Science and Technology)
Lee, Jong-Hyun (Department of Materials Science & Engineering, Seoul National University of Science and Technology)
Publication Information
Journal of the Microelectronics and Packaging Society / v.24, no.3, 2017 , pp. 57-62 More about this Journal
Abstract
In the process for preparing Ag-coated Cu flakes by electroless silver plating using hydroquinone reducing agent, Ag coating qualities were compared by changing various process parameters such as type of pretreatment solution, plating temperature, pH of plating solution, type and injection rate of plating solution, and pulp density. Effective pretreatment solution for removing the oxide layer on a Cu flake was preferentially suggested. The conditions of low plating temperature, pH value of 4.34, slow injection rate of Ag plating solution, elimination of deionized water in the Ag plating solution, and high pulp density significantly suppressed the formation of separated tiny Ag particles, and thus the surface coverage of Ag coating on Cu flakes was enhanced.
Keywords
Cu flake; electroless Ag plating; Ag-coated Cu; hydroquinone; pulp density;
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Times Cited By KSCI : 9  (Citation Analysis)
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