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X. Xu, X. Luo, H. Zhuang, W. Li, and B. Zhang, "Electroless silver coating on fine copper powder and its effects on oxidation resistance", Mater. Lett., 57(24-25), 3987 (2003).
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D. S. Jung, H. M. Lee, Y. C. Kang, and S. B. Park, "Air-stable silver-coated copper particles of sub-micrometer size', J. Colloid Interface Sci., 364(2), 574 (2011).
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3 |
J. Zhao, D. M. Zhang and J. Zhao, "Fabrication of Cu-Ag coreshell bimetallic superfine powders by eco-friendly reagents and structures characterization", J. Solid. State. Chem., 184(9), 2339 (2011).
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H. T. Hai, J. G. Ahn, D. J. Kim, J. R. Lee, H. S. Chung, and C. O. Kim, "Developing process for coating copper particles with silver by electroless plating method", Surf. Coat. Technol., 201(6), 3788 (2006).
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R. Zhang, W. Lin, K. Lawrence, and C. P. Wong, "Highly reliable, low cost, isotropically conductive adhesives filled with Ag-coated Cu flakes for electronic packaging applications", Int. J. Adh. Adh. 30(6), 403 (2010).
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Y. Peng, C. Yang, K. Chen, S. R. Popuri, C. H. Lee, and B. S. Tang, "Study on synthesis of ultrafine Cu-Ag core-shell powders with high electrical conductivity", Appl. Surf. Sci., 263(15), 38 (2012).
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7 |
G. Kim, K. M. Jung, J. T. Moon, and J. H. Lee, "Electrical resistivity and thermal conductivity of paste containing Agcoated Cu flake filler", J. Microelectron. Packag. Soc., 21(4), 51 (2014).
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8 |
J. H. Kim, and J. H. Lee, "Effects of pretreatment and Ag coating processes conditions on the properties of Ag-coated Cu flakes", J. Mater. Res., 24(11), 617 (2014).
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9 |
J. H. Kim, and J. H. Lee, "A method for application of ammonium- based pretreatment solution in preparation of copper flakes coated by electroless Ag plating", J. Microelectron. Packag. Soc., 22(4), 57 (2015).
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10 |
J. W. Kim, H. H. Lee, and C. W. Won, "Preparation of Cu- Ag powder having core-shell by electroless plating method", J. Kor. Inst. Surf. Eng., 42(1), 47 (2009).
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11 |
V. Brusic, G. S. Frankel, J. Roldan, and R. Saraf, "Corrosion and protection of a conductive silver paste", J. Electrochem. Soc., 142(8), 2591 (1995).
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12 |
D. H. Kim, S. Yoo, C. W. Lee, and T. Y. Lee, "Temperature measurement and contact resistance of Au stud bump bonding and Ag paste bonding with thermal heater device", J. Microelectron. Packag. Soc., 17(2), 55 (2010).
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13 |
G. Kim, K. M. Jung, J. T. Moon, and J. -H. Lee, "Electrical resistivity and thermal conductivity of paste containing Agcoated Cu flake filler", J. Microelectron. Packag. Soc., 21(4), 51 (2014).
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14 |
H. J. Kang, T. Kim, and M. Y. Jeong, "PLC devices fabricated on flexible plastic substrate by roll-to-roll imprint lithography", J. Microelectron. Packag. Soc., 22(4), 25 (2015).
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15 |
S. H. Seo, J. H. Lee, J. Y. Song, and W. J. Lee, "Control of position of neutral line in flexible microelectronic system under bending stress", J. Microelectron. Packag. Soc., 23(2), 79 (2016).
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16 |
T. I. Lee, C. Kim, M. S. Kim, and T. S. Kim, "Measurement of flexural modulus of lamination layers on flexible substrates", J. Microelectron. Packag. Soc., 23(3), 63 (2016).
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17 |
D. Lu, Q. K. Tong, and C. P. Wong, "Conductivity mechanisms of isotropic conductive adhesives (ICAs)", Proc. International Symposium on Advanced Packaging Materials, 2, IEEE (1999).
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L. Ye, Z. Lai, J. Liu, and A. Tholen, "Effect of Ag particle size on electrical conductivity of isotropically conductive adhesives", IEEE Trans. Electron. Packag. Manuf., 22(4), 299 (1999).
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D. Lu, Q. K. Tong, and C. P. Wong, "A study of lubricants on silver flakes for microelectronics conductive adhesives", IEEE Trans. Compon. Packag. Technol., 22(3), 365 (1999).
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20 |
H. Jiang, K. Moon, Y. Li, and C. P. Wong, "Surface functionalized silver nanoparticles for ultrahigh conductive polymer composites", 18(13), 2969 (2006).
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21 |
W. Zeng, H. Wu, C. Zhang, F. Huang, J. Peng, W. Yang, and Y. Cao, "Polymer light-emitting diodes with cathodes printed from conducting Ag paste", Adv. Mater., 19, 810 (2007).
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22 |
R. Ma, S. Kwon, Q. Zheng, H. Y. Kwon, J. I. Kim, H. R. Choi, and S. Baik, "Carbon-nanotube/silver networks in nitrile butadiene rubber for highly conductive flexible adhesives", Adv. Mater., 24, 3344 (2007).
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J. Krantz, K. Forberich, P. Kubis, F. Machui, J. Mina, T. Stubhan, and C. J. Brabeca, "Printing high performance reflective electrodes for organic solar cells", Org. Electron., 17, 334 (2015).
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