[KSCI] Korea Science Citation Index Service

http://dx.doi.org/10.7234/composres.2022.35.2.069

Analysis of the Physical Properties of the Conductive Paste according to the Type of Binder Resin and Simulation of Mechanical Properties according to Ag Flake Volume Fraction

Sim, Ji-Hyun (Department of Texitile System Enginnering, Kyungpook National University)
Yun, Hyeon-Seong (DYETEC, Computer Aided Engineering(CAE) Center)
Yu, Seong-Hun (DYETEC, Computer Aided Engineering(CAE) Center)
Park, Jong-Su (Pyung Hwa Industrials Co., Ltd)
Jeon, Seong-Min (Pyung Hwa Industrials Co., Ltd)
Bae, Jin-Seok (Department of Texitile System Enginnering, Kyungpook National University)

Publication Information

Composites Research / v.35, no.2, 2022 , pp. 69-74 More about this Journal

Abstract

In this study, the conductive paste used in a wide range such as wiring in the electronic packaging field, the automobile industry, and electronic products is manufactured under various process conditions due to the simplicity of the process, and then the thermal, mechanical, and electrical characteristics are analyzed and simulation studies are conducted to optimize the process. to establish the conditions of the conductive paste manufacturing process. First, a conductive paste was prepared by setting various types of binder resin, an essential component of the conductive paste, and characteristics such as thermal conductivity, tensile strength, and elongation were analyzed. Among the binder resins, the conductive paste applied with a flexible epoxy material had the best physical properties, and a simulation study was conducted based on the physical property data base of the conductive face. As a result of the simulation, the best physical properties were exhibited when the Ag flake volume fraction was 60%.

Keywords

Flexible-printed circuit board(F-PCB); Conductive paste; Ag flake; Flexible epoxy resin; Simulation;

Citations & Related Records

Times Cited By KSCI : 4 (Citation Analysis)

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