• 한국건축시공학회지
• /
• 제19권1호
• /
• pp.47-57
• /
• 2019

폴리머 종류에 상관없이 폴리머 시멘트비의 증가에 따라 접착성능은 크게 개선되었으며, A타입 인장접착강도는 1.90배, B 타입 인장(접착)강도는 2.17배, 휨(접착)강도는 1.83배 보통 시멘트 모르타르 보다 높게 나타났으며, 보통 시멘트 모르타르의 B 타입 인장(접착)강도에 대한 인장강도비와 휨(접착)강도에 대한 휨강도비인 상대강도비가 각각 46.9%, 72.6%를 나타냈으며, 폴리머 시멘트 모르타르의 경우에는 각각 50.1%~101.7%, 73.8%~132.9% 범위를 나타내, 폴리머 시멘트 모르타르가 높은 강도회복율을 보였다. 폴리머 종류에 따라서는 EVA를 사용하고, 폴리머 시멘트비로서는 접착성능과 경제성을 고려하면, P/C 10%~15% 범위를 제안할 수 있다.

• 한국건축시공학회:학술대회논문집
• /
• 한국건축시공학회 2014년도 춘계 학술논문 발표대회
• /
• pp.282-283
• /
• 2014

An active study on UHPC, which has been recently used in high-rise building and bridges, is in progress. However, research on adhesion strength of normal concrete and UHPC is required to be studied due to the lack of information. In this study, experimental research progress for adhesion strength (shear strength of adhesive surface) evaluation of Bi-compressive strength concretes (UHPC, Normal concrete) is proceeded. First, specimens using glue are produced and surface treatment methods of concrete bonded section are considered. Second, Direct Shear test is applied on concrete bonded section of UHPC (80~180MPa) and Normal Concrete (NC). As a result of this study, it is confirmed that bond strength is deteriorated as the difference of intensity ration of NC and UHPC increases.

• 한국건축시공학회:학술대회논문집
• /
• 한국건축시공학회 2021년도 가을 학술논문 발표대회
• /
• pp.252-253
• /
• 2021

In this study, butyl rubber, which is the main material constituting the self-adhesive butyl rubber waterproofing sheet, was mixed with reclaimed rubber, and tensile strength, tear strength, peeling resistance strength, and adhesion strength were measured for sample prepared by mixing ratio. As a result, it was confirmed that peeling resistance strength and adhesion strength decreased as the reclaimed rubber content increased, and tensile strength and tear strength did not change significantly.

• 한국표면공학회지
• /
• 제50권3호
• /
• pp.164-169
• /
• 2017

Ni-Cr-X ternary interlayers were investigated to improve the adhesion of Cu/Ni-Cr/Polyimide flexible copper clad laminates. The ternary compounds are sputtered Ni-Cr-X films (where X is one of Nb, V, Mo, or Ti), and the effect of third elements on the adhesion was evaluated and investigated chemically and mechanically. The feel strength was higher in the order of Ni-Cr-Nb > Ni-Cr-V > Ni-Cr > Ni-Cr-Mo > Ni-Cr-Ti. Nb, which has a comparable standard electrode potential to Cr, increased the adhesion, while Ti, with a low standard electrode potential, degraded the adhesion. The Ni-Cr-Nb interlayer was amorphous, while Ni-Cr-Ti was partially crystalline. The similar morphology structure of the Ni-Cr-Nb interlayer with polyimide resulted in a better adhesion.

• 한국표면공학회지
• /
• 제44권6호
• /
• pp.246-249
• /
• 2011

Surface modification before coating nickel by coupling agents and/or etchant of glass did not provide enough adhesive strength of electroless nickel deposits on glass. Effect of heat treatments on hardness as well as adhesion of nickel deposits was studied by using tape test for adhesion, nanoindenter for hardness and glancing angle x-ray diffractometer (GAXRD) for phase characterization. Heat treatment improved hardness as well as adhesion. XRD results give that the improvements of adhesion and hardness are due to the formation of $NiSiO_4$ around the interface between the nickel deposits and the glass and the precipitation of $Ni_3P$ causing precipitation hardening, respectively. The details in effects of heat treatment on adhesion and hardness are described here.

• 접착 및 계면
• /
• 제15권3호
• /
• pp.109-115
• /
• 2014

본 연구에서는 내부에 이소시아네이트를 포함하는 microcapsule을 합성하였으며, 제조된 microcapsule에 대한 분석 및 폴리우레탄 수지와 병용했을 때의 기계적 물성과 접착특성에 대해서 고찰하였다. 전자현미경을 사용해서 합성된 microcapsule이 구형의 외관을 갖는 것을 확인하였으며, FT-IR과 TGA 분석을 통해서 microcapsule의 core 물질이 IPDI인 것과 각 구성요소들의 성분비를 확인하였다. 폴리우레탄 수지 자체 및 microcapsule을 포함한 경우의 접착력 및 물성을 평가한 결과 접착수지 내에 포함된 microcapsule 내 IPDI의 가교반응에 의해서 폴리우레탄 수지 자체에 비해 접착력, 인장강도, 내마모 특성이 크게 향상되는 것을 확인하였다.

• 접착 및 계면
• /
• 제14권3호
• /
• pp.111-116
• /
• 2013

본 연구에서는 신발에 사용되는 고무부품의 접착에 있어서 버핑 및 용매 세척 등의 표면처리 공정을 대체하기 위하여, 플라즈마 처리를 통한 표면 및 접착특성을 알아보았다. 플라즈마 처리 시 분사노즐과 고무 시편과의 거리가 감소할수록 접촉각은 감소하였으며, 플라즈마 처리속도가 증가함에따라 접촉각은 증가하였다. 고무 시편의 표면조도 측정결과 플라즈마 처리 후 Ra 값은 20%, Rz 값은 16%가 증가하는 결과를 나타내었다. 플라즈마 발생 노즐과 고무시편과의 거리가 증가함에 따라 접착력은 감소하고, 플라즈마 처리속도가 증가함에 따라 접착력은 감소하였다.

• 한국표면공학회지
• /
• 제27권5호
• /
• pp.261-272
• /
• 1994

Both Cu-Cr and Cu-Ti alloy films with different composition were prepared by dc magnetron sputtering onto polyimide substrate and their adhesion and microstructure were observed. In addition, the effect of heat treatment at $400^{\circ}C$ for 2 hours on the variation of adhesion properties and on the changess of microstructure were investigated. Cu-Cr alloy films have crystalline structure of either for or bcc phase depending on the composition of the film. However, the Cu-Ti alloy film forms fcc phase at low Ti concentration while it forms an amorphous phase as the Ti concentration in the films is increased to more than 25at.%. TEM analysis reveal that the microstructure of Cu-Cr and Cu-Ti films forms an open structure with vacant spaces. The adhesion between Cu-Cr, Cu-Ti alloy films and polyimide substrate is relatively good before the heat treatment, but is noticeably reduced after the heat treatment. In particular, the adhesion strength is significantly reduced in the Cu-Ti alloy films after the heat treatment. The reduction of adhesion strength after the heat treatment is identified to relate with the formation of oxide phases at the metal/polyimide interface by AES(Auger Electron Spectroscopy).

• 한국마이크로전자및패키징학회:학술대회논문집
• /
• 한국마이크로전자및패키징학회 2001년도 추계 기술심포지움
• /
• pp.171-177
• /
• 2001

The adhesion enhancement from inserting a RF bias-sputtered Cr layer between Cu and polyimide (PI) has been studied. The RF bias power applied in this study was ranged from 0 to 400 W. Without the RF bias, the peel strength, which measures the adhesion strength, was nearly o g/mm. As the RF power was increased, the peel strength rose up to ~130 g/mm at 200 W, which remained constant with further increase of the RF bias power. Cross-sectional transmission electron microscopy(TEM) was used to investigate the interfacial reaction between the Cr film and PI substrate during the bias sputtering. The Cr/PI interface without the application of RF dais showed a clean, sharp interface while the RF raised Cr/PI interface had about 10~30 nm thick atomistically mixed interlayer between the metal film and PI substrate. This interlayer appeared to have resulted from the implantation of high energy adatoms during the RF bias sputtering of Cr film. This mixed layer serves as an interlocking layer, which enhances adhesion between the metal and PI layers.

• Journal of Welding and Joining
• /
• 제5권2호
• /
• pp.17-26
• /
• 1987

In this study, the experiments were carried out for the purpose of establishment of the arc sparing method which reducing oxides or oxide film by using the inert gas as the carrier gas of atomizing particles. Main results obtained are as follows; 1. Oxides and oxide film which lower the adhesion strength are largely reduced by using the inert gas as the carrier gas of atomizing particles, and adhesion strength of coating film are improved. 2. The coating film characteristics appear to be no difference between the inert gas arc spraying in air environment and that in argon gas environment. 3. Inert gas arc spraying using argon as the carrie gas has higher reduction rate of composition element in coating film than compressed air spraying does.