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http://dx.doi.org/10.5695/JKISE.2017.50.3.164

Adhesion of Cu/Interlayer/Polyimide Flexible Copper Clad Laminate Depending on the Ni-Cr-X Interlayers  

Kim, Si Myeong (Department of Energy, Materials and Chemical Engineering, Korea University of Technology and Education)
Jo, Yoo Shin (Department of Energy, Materials and Chemical Engineering, Korea University of Technology and Education)
Kim, Sung June (Department of Energy, Materials and Chemical Engineering, Korea University of Technology and Education)
Kim, Sang Ho (Department of Energy, Materials and Chemical Engineering, Korea University of Technology and Education)
Publication Information
Journal of the Korean institute of surface engineering / v.50, no.3, 2017 , pp. 164-169 More about this Journal
Abstract
Ni-Cr-X ternary interlayers were investigated to improve the adhesion of Cu/Ni-Cr/Polyimide flexible copper clad laminates. The ternary compounds are sputtered Ni-Cr-X films (where X is one of Nb, V, Mo, or Ti), and the effect of third elements on the adhesion was evaluated and investigated chemically and mechanically. The feel strength was higher in the order of Ni-Cr-Nb > Ni-Cr-V > Ni-Cr > Ni-Cr-Mo > Ni-Cr-Ti. Nb, which has a comparable standard electrode potential to Cr, increased the adhesion, while Ti, with a low standard electrode potential, degraded the adhesion. The Ni-Cr-Nb interlayer was amorphous, while Ni-Cr-Ti was partially crystalline. The similar morphology structure of the Ni-Cr-Nb interlayer with polyimide resulted in a better adhesion.
Keywords
FCCL; Ternary interlayer coating; Ni-Cr-X; Peel strength;
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Times Cited By KSCI : 1  (Citation Analysis)
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