• Title/Summary/Keyword: Adhesion Promoter

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A Study on the Effect of Polyetherimide Surface Treatment on the Adhesion and High Temperature/High Humidity Reliability of MCM-D Interface (Polyetherimide 접착제의 표면 처리에 따른 MCM-D 계면 접착력 및 고온고습 신뢰성 변화에 관한 연구)

  • Yoon, Hyun-Gook;Ko, Hyoung-Soo;Paik, Kyung-Wook
    • Korean Journal of Materials Research
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    • v.9 no.12
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    • pp.1176-1180
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    • 1999
  • The adhesion strength and high temperature/high humidity reliability of polyetherimide (PEI) adhesive on silicon wafer after being treated by each reactive ion etching (RIE) Aluminum (Al)-chelate adhesion promoter were investigated. 180$^{\circ}$ peel test and <85$^{\circ}C$ 85%> humidity test were performed for the initial adhesion strength and high temperature/high humidity reliability, respectively. For investigating surface effect scanning electron microscope (SEM), atomic force microscope (AFM), deionized (DI)-water contact angle studies were carried out. To investigate RIE effect, PEI was treated with $^O_2$ RIE, and then laminated. The initial peel strength increased slightly from 1.6 kg/cm for the first 2 minutes, and then decreased. High temp/high humid resistance decreased rapidly by RIE etching. RIE treatment on PEI affected on both of roughness and hydrophilicity increase. Aluminum-chelate adhesion promoter was coated by spinning on silicon wafer. The initial peel strength showed no effect of adhesion promoter treatment, but high temp/high humidity resistance increased remarkably. Al-chelate adhesion promoter did not affect the roughness but increased hydrophilicity.

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Studies on Adhesion Properties between Zinc-Coated Steel Cord and Adhesion Promoter-Containing Rubber Compound (아연 코팅된 스틸코드와 접착증진제가 적용된 고무 Compound와의 접착특성 연구)

  • Ko, Sang Min;Choi, Hee Seok;Son, Woo Jung;Kang, Sin Jung
    • Journal of Adhesion and Interface
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    • v.15 no.2
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    • pp.49-56
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    • 2014
  • In this study, properties of adhesion between adhesion promoter-containing rubber compound and zinc coated steel cord was investigated. Cobalt salt, resorcinol formaldehyde resin (RF resin) and hexamethoxymethylmelamine (HMMM) were used to adhesion promoter. Since cobalt salts accelerate sulphidation rate of zinc at zinc coated steel cord surface, pullout force of rubber compound applying cobalt salts was increased compared to that of rubber compound without applying cobalt salts. Pullout force and rubber coverage of rubber compounds applying all adhesion promoters were superior because strong interlocking between rubber matrix increased modulus due to applying RF resin and HMMM and grown zinc sulfides at zinc coated steel cord surface.

Preparation of Adhesion Promoter for Lead Frame Adhesion and Application to Epoxy Composite

  • Kim, Jung Soo;Kim, Eun-jin;Kim, Dong Hyun
    • Elastomers and Composites
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    • v.57 no.2
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    • pp.48-54
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    • 2022
  • A polymeric adhesion promoter was synthesized to improve the adhesive strength of the Ni lead frame/epoxy composite. Poly(itaconic acid-co-acrylamide) (IAcAAM) was prepared by copolymerizing itaconic acid and acrylamide. We compared the adhesive strength between the Ni lead frame and epoxy composite according to the molecular weight of IAcAAM. The molecular weight of IAcAAM was controlled using an initiator, which made it possible to use IAcAAM in the epoxy molding compound (EMC) manufacturing process by modulating the melting temperature. The adhesive strength of Ni lead frame/epoxy composite increased with the addition of IAcAAM to the epoxy composite. In addition, as the molecular weight of IAcAAM increased, the adhesive strength of the Ni lead frame/epoxy composite slightly increased. We confirmed that IAcAAM with an appropriate molecular weight can be used in the EMC manufacturing process and increase the adhesive strength of the Ni lead frame/epoxy composite.

High-temperature Adhesion Promoter Based on (3-Glycidoxypropyl) Trimethoxysilane for Cu Paste

  • Jiang, Jianwei;Koo, Yong Hwan;Kim, Hye Won;Park, Ji Hyun;Kang, Hyun Suk;Lee, Byung Cheol;Kim, Sang-Ho;Song, Hee-Eun;Piao, Longhai
    • Bulletin of the Korean Chemical Society
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    • v.35 no.10
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    • pp.3025-3029
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    • 2014
  • To realize copper-based electrode materials for printed electronics applications, it is necessary to improve the adhesion strength between conductive lines and the substrate. Here, we report the preparation of Cu pastes using (3-glycidoxypropyl) trimethoxysilane (GPTMS) prepolymer as an adhesion promoter (AP). The Cu pastes were screen-printed on glass and polyimide (PI) substrates and sintered at high temperatures (> $250^{\circ}C$) under a formic acid/$N_2$ environment. According to the adhesion strengths and electrical conductivities of the sintered Cu films, the optimized Cu paste was composed of 1.0 wt % GPTMS prepolymer, 83.6 wt % Cu powder and 15.4 wt % vehicle. After sintering at $400^{\circ}C$ on a glass substrate and $275^{\circ}C$ on a PI substrate, the Cu films showed the sheet resistances of $10.0m{\Omega}/sq$. and $5.2m{\Omega}/sq$., respectively. Furthermore, the sintered Cu films exhibit excellent adhesion properties according to the results of the ASTM-D3359 standard test.

Adhesive Properties of Epoxy Composite According to the Surface Treatment of Cu Substrate and Adhesion Promoter Content (구리기판의 표면처리 및 접착증진제 함량에 따른 에폭시 컴포지트의 접착특성)

  • Eun-jin Kim;Jung Soo Kim;Young-Wook Chang;Dong Hyun Kim
    • Journal of Adhesion and Interface
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    • v.23 no.4
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    • pp.108-115
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    • 2022
  • In this study, we synthesized poly(itaconic acid-co-acrylamide) (IAcAAM) used as a novel polymer adhesion promoter to improve the adhesion strength of surface-treated Cu lead frames and epoxy composites. IAcAAM comprising itaconic acid, acrylamide was prepared through radical aqueous polymerization. The chemical structure and properties of IAcAAM was analyzed by FT-IR, 1H-NMR, GPC, and DSC. The surface of the copper lead frame was treated with high temperature, alkali, and UV ozone to reduce the water contact angle and increase the surface energy. The adhesive strength of Cu lead frame and epoxy composite increased with the decrease of contact angle. The adhesive strength of Cu lead frame/epoxy composite increased with the addition of IAcAAM in epoxy composite. As silica content increased, the adhesive strength of Cu lead frame and epoxy composite tended to slightly decrease.

Synthesis of Adhesion Promoters with Improved Compatibility and Properties of UV-Curable Adhesives Containing Adhesion Promoters (상용성이 개선된 접착 증진제의 합성 및 이를 함유한 자외선 경화형 접착제의 특성분석)

  • Park, Jung-Hyun;Won, Jonh-Woo;Kim, Ju-Yeol;Yoon, Yoo-Jung;Kwon, Oh-Hyeong;Hwang, Jin-Sang
    • Journal of Adhesion and Interface
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    • v.19 no.4
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    • pp.145-153
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    • 2018
  • In this study, adhesion promoters with acrylate and carboxylic acid moiety were synthesized from malenized polybutadiene and 2-hydroxyethyl acrylate for producing adhesive film with low water absorption and high adhesion. The surface properties, adhesion strength, mechanical properties and water absorption of adhesive films were characterized according to the amount of acrylate and carboxylic acid in the synthesized adhesion promoters. As the carboxylic acid in the adhesion promoters increased, the adhesion strength showed a tendency to increase and the mechanical properties also improved compared to the commercial adhesion promoter. The compatibility of adhesion promoters improved remarkably due to the presence of polybutadiene (hydrophobic nature), maleic anhydride (hydrophilic nature) and carboxylic acid (hydrophilic nature).

Characteristics of Silver Nanow ire Solution and Film Depending on Hydroxypropyl Methylcellulose Adhesion Promoter Addition (Hydroxypropyl methylcellulose 접착력 증진제 첨가에 따른 은 나노와이어 용액 및 필름의 특성 변화)

  • Seungju Kang;Kim
    • Journal of Adhesion and Interface
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    • v.24 no.2
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    • pp.54-59
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    • 2023
  • Silver nanowire-based transparent electrodes are very attractive as a next-generation flexible and transparent electrode that can replace ITO-based flexible electrodes because they have excellent conductivity, transmittance and mechanical flexibility. However, weak understanding of the silver nanowire solution for the fabrication of silver nanowire-based transparent electrodes often cause abnormal operation of the electrical device or peeling problem of the electrode films when applied to electronic devices. Here, we studied a Hydroxypropyl Methylcellulose (HPMC) adhesion promoter, which is one of the additives for silver nanowire solution, to improve the understanding of silver nanowire solution. In detail, it is characterized how the HPMC changes the properties of silver nanowire solution and silver nanowire film, which is fabricated with silver nanowire solution including the HPMC adhesion promoter. As the characteristics of solution, polar surface tension and dispersive surface tension were measured. As the film characteristics, surface energy, surface morphology, silver nanowire density, and sheet resistance were analyzed.

The Surface Treatment Effect for Nanoimprint Lithography using Vapor Deposition of Silane Coupling Agent (나노임프린트 공정에서 실란커플링제 기상증착을 이용한 표면처리 효과)

  • Lee, Dong-Il;kim, Ki-Don;Jeong, Jun-Ho;Lee, Eung-Sug;Choi, Dae-Geun
    • Korean Chemical Engineering Research
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    • v.45 no.2
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    • pp.149-154
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    • 2007
  • Nanoimprint lithography (NIL) is useful technique because of its low cost and high throughput capability for the fabrication of sub-micrometer patterns which has potential applications in micro-optics, magnetic memory devices, bio sensors, and photonic crystals. Usually, a chemical surface treatment of the stamp is needed to ensure a clean release after imprinting and to protect the expensive original master against contamination. Meanwhile, adhesion promoter between resin and substrate is also important in the nanoscale pattern. In this work, we have investigated the effect of surface treatment using silane coupling agent as release layer and adhesion promoter for UV-Nanoimprint lithography. Uniform SAM (self-assembled monolayer) could be fabricated by vapor deposition method. Vapor phase process eliminates the use of organic solvents and greatly simplifies the handling of the sample. It was also proven that 3-acryloxypropyl methyl dichlorosilane (APMDS) could strongly improve the adhesion force between resin and substrate compared with common planarization layer such as DUV-30J or oxygen plasma treatment.

Preparation of PDMS Surface Modifier Using Silane-Functionalized Polymer Precursor Manufacture and Their Properties (실란 기능화 아크릴 고분자 전구체를 이용한 PDMS 표면 개질제 제조 및 표면 물성)

  • Shin, Jae-Hyeon;Kim, Nahae;Kim, Juyoung
    • Journal of Adhesion and Interface
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    • v.19 no.4
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    • pp.154-162
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    • 2018
  • Plasma treatment and corona treatment have been used for surface modification of polydimethylsiloxane (PDMS) film by activating its surface with the -OH group. Adhesion promoter or coupling agent was also used to improve adhesion of PDMS film with various materials. However, obtained hydrophilicity onto the surface of PDMS films with those processes was transient and vulnerable. In this study, a new alkoxysilane-functionalized acrylic polymer precursor was first synthesized by copolymerization process, and then was reacted with HO-terminated PDMS through condensation reaction to prepare a new surface modifier for PDMS film. The structure and molecular weight of the prepared surface modifier were confirmed by 1H-NMR and GPC measurement. Surface properties of surface modifier-coated PDMS films were also investigated by using XPS, ATR and WCA analysis. The adhesion between the PDMS film and the surface modifier was tested using cross-cut test.