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http://dx.doi.org/10.17702/jai.2022.23.4.108

Adhesive Properties of Epoxy Composite According to the Surface Treatment of Cu Substrate and Adhesion Promoter Content  

Eun-jin Kim (Materials & Component Convergence R&D Department, Korea Institute of Industrial Technology (KITECH))
Jung Soo Kim (Department of Material Chemical Engineering, Hanyang University)
Young-Wook Chang (Department of Material Chemical Engineering, Hanyang University)
Dong Hyun Kim (Materials & Component Convergence R&D Department, Korea Institute of Industrial Technology (KITECH))
Publication Information
Journal of Adhesion and Interface / v.23, no.4, 2022 , pp. 108-115 More about this Journal
Abstract
In this study, we synthesized poly(itaconic acid-co-acrylamide) (IAcAAM) used as a novel polymer adhesion promoter to improve the adhesion strength of surface-treated Cu lead frames and epoxy composites. IAcAAM comprising itaconic acid, acrylamide was prepared through radical aqueous polymerization. The chemical structure and properties of IAcAAM was analyzed by FT-IR, 1H-NMR, GPC, and DSC. The surface of the copper lead frame was treated with high temperature, alkali, and UV ozone to reduce the water contact angle and increase the surface energy. The adhesive strength of Cu lead frame and epoxy composite increased with the decrease of contact angle. The adhesive strength of Cu lead frame/epoxy composite increased with the addition of IAcAAM in epoxy composite. As silica content increased, the adhesive strength of Cu lead frame and epoxy composite tended to slightly decrease.
Keywords
Adhesion promoter; Adhesive strength; Epoxy composite; Cu lead frame; Poly(itaconic acid-co-acrylamide);
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Times Cited By KSCI : 7  (Citation Analysis)
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