• 대한금속재료학회지
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• 제50권3호
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• pp.237-242
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• 2012

The objective of this study is to investigate the effect of additives on the mechanical and electrical characteristics of electrodeposited copper foils. Additives A(leveler) and B(brightener) were used in this study and Cl ions were used as an accelerator. In case of using these additives A and B, it showed a disadvantage that decreased the elongation of electrodeposited layer due to decreased grain sizes and increased tensile strength. On the other hand, the Cl ions decreased the specific resistance of the copper layer and increased elongation owing to increasing grain sizes. The highest elongation and lowest resistivity were measured in the group added only Cl ions, whose values were 21.9% and $3.11{\mu}\Omega$-cm, respectively.

• 한국표면공학회지
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• 제43권6호
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• pp.289-296
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• 2010

The effect of organic additives, thiourea (TU), on the copper electroplated layer of large rectangular size was investigated through physical and various electrochemical techniques. It was found that TU had strong adsorption characteristics on the Ni substrate and affected the initial electroplating process by inducing surface reaction instead of mass transfer in the bulk solution. TU additives had its critical micelle concentration at 200 ppm in copper sulphate solution and showed abrupt change in morphological and electrochemical impedance spectroscopic results around this concentration, which could be related with the destruction of adsorption structure of TU-Cu(I) complex formed at the Ni substrate surface. By conducting a commercial electroplating simulation, when TU additives was included at cmc in the plating solution, it acted as a depolarizer for copper electrodeposition and was effective to reduce the unevenness of copper deposits between centre and edge region at high current densities of 10 ASD.

• 펄프종이기술
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• 제44권6호
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• pp.21-27
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• 2012

The effects of fines contents in OCC stock on the wet pressing process were evaluated in this study. The fines were collected from the beaten OCC stock by using 200 mesh. The dryness of handsheet samples after the couch and after the 1st wet press were greatly affected by the fine contents of the OCC stock. The higher contents of fines resulted in the lower value in dryness but the higher value of density followed by the higher strength properties. The addition of the retention aids and the drainage aids on the OCC stocks showed the wet pressing efficiency were greatly affected by the fine contents rather than the addition of polymer additives. The increase in the fine retention by the polymer additives offset the improvement in the wet pressing efficiency originated from the polymer additives.

• 대한금속재료학회지
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• 제47권9호
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• pp.586-590
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• 2009

The effects of additives on the surface morphology and physical properties of copper electrodeposited on polyimide(PI) film were investigated here. Two kinds of additives, an activator(additive A) and a leveler(additive B),were used in this study. Electrochemical experiments, in conjunction with scanning electron microscopy(SEM), X-ray diffraction(XRD) and a four-point probe, were performed to characterize the morphology and mechanical characteristics of copper electrodeposited in the presence of the additives. The surface roughness, crystal growth orientation and resistivity could be controlled using various quantities of additive B. High resistivity and lower peel strength were observed on the surface of the copper layer electroplated onto the electrolyte with no additive B. However, a uniform surface, lower resistivity and high flexibility were obtained with a combination of 20 ppm of additive A and 100 ppm of additive B.

• 한국윤활학회:학술대회논문집
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• 한국윤활학회 2002년도 proceedings of the second asia international conference on tribology
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• pp.265-266
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• 2002

Nano materials have great potential for development of advanced lubricating and protecting materials. Nano-particles capped by organic compound such as organic acid, dialkyldithiophosphate (DDP) are capable to disperse stably in lubricating oils, and are able to reduce wear and to increase load-carrying capacity.

• 한국환경과학회지
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• 제15권2호
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• pp.169-175
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• 2006

The changes of contaminants and odor corresponding to anaerobic maturation process of piggery slurry were investigated by applying the additives, such as different kinds of complex microorganism products and deodorants containing microorganism activating agents. The pHs during 20-day anaerobic maturation were operated stably without great change regardless of the additives, although they were rather lower in the case that the additives were contained than the case that they were not contained. The effects of removing CODcr, $NH_3-N$, T-N, and T-S in case that the additives were not contained, were not so great during the 20-day operation and so it would be difficult to remove the organic materials and nitrogen ingredients simply with anaerobic maturation process. However, in case of anaerobic maturation process that the additives were contained, their average removal rates were improved with the values of $49\%,\;63.5\%,\;48.5\%,\;and\;30.7\%$ for above each of items, even if the 20-day of short-term maturation period was applied. Especial1y, odor intensity with the additives was lowered continuously during the operation period and it had more than two times of lowering effect compared to that without those.

• 펄프종이기술
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• 제43권4호
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• pp.40-48
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• 2011

In this study, we investigated the usability of new powdered additives in the paperboard industry. We manufactured the powdered additives from peanut husks and garlic stems by grinding. The chemical composition, particle size, particle size distribution, and particle shape were investigated to identify the basic properties of the powdered raw materials. To determine the effect of the powdered additives on paper properties, handsheets were prepared by adding the powdered additives to the pulp slurry. The chemical composition, such as the contents of holocellulose, lignin, and ash, showed similar values to those of other biomass materials. The particles of peanut husk powder were irregularly shaped, smaller, and had a broader particle size distribution than those of the garlic stem powder, which had the fibril form. The particles of the two powdered raw materials showed a positioning of expansion in the fiber network, resulting in increased bulk and a loss of strength. Handsheets containing garlic stem particles were stronger than handsheets containing peanut husk particles. Finally, the new powdered additives are beneficial to the bulk of paperboard.

• 한국지반공학회:학술대회논문집
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• 한국지반공학회 2000년도 가을 학술발표회 논문집
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• pp.657-664
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• 2000

Weak and soft compressible clay deposits are commonly found in natural subgrade soils. These Soils need to be stabilized for using the subbase materials of highway constructions. This paper presents that a chemical treatment using chemical additives comprised of sulfate(SO$_4$) and chloride(Cl) is evaluated for stabilizing soft clay deposits and lime. The physical and mechanical characteristics of soil-lime and additives are described by means of a laboratory study. The study results indicate that the presence of chlorides encouraged the efficiency of lime stabilization, and the use of calcium chloride with quicklime is the best additive for improving soil behavior. The treated soil with lime-calcium chloride can have the adaptability to the subbase materials of highway constructions.

• 한국재료학회지
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• 제16권11호
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• pp.710-714
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• 2006

The purpose of this study is to identify the effect of additives and composition on copper surface morphology and mechanical characteristics by copper electrodeposition. Additives such as hydroxy ethyl cellulose(HEC), chloride ion were used in this study. Electrochemical experiments allied to SEM, XRD, AFM and four- point probe were performed to characterize the morphology and mechanical characters of copper in the presence of additives. Among various electrodeposition conditions, the minimum surface roughness of copper foil was obtained when electrodeposited at the current density of 200 mA/$cm^2$ for 68 seconds with 2 ppm of HEC. The minimum value of surface roughness(Rms) was 107.6 nm. It is copper foil is good for electromigration inhibition due to preferential crystal growth of Cu (111) deposited in the electrolyte containing chloride ions(10 ppm) and HEC(1 ppm).

• Corrosion Science and Technology
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• 제10권4호
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• pp.143-150
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• 2011

Copper electroplating has been applied to various fields such as decorative plating and through-hole plating. Technical realization of high strength copper preplating for wear-resistant tools and molds in addition to these applications is the aim of this work. Brighters and levelers, such as MPSA, Gelatin, Thiourea, PEG and JGB, were added in copper sulfate electrolyte, and the effects of these organic additives on the hardness were evaluated. All additives in this work were effective in increasing the hardness of copper electrodeposits. Thiourea increased the hardness up to 350 VHN, and was the most effective accelarator in sulfate electrolyte. It was shown from the X-ray diffraction analysis that preferred orientation changed from (200) to (111) with increasing concentration of organic additives. Crystallite size decreased with increasing concentration of additive. Hardness was increased with decreasing crystallite size, and this result is consistent with Hall-Petch relationship, and it was apparent that the hardening of copper electrodeposits results from the grain refining effect.