• 한국표면공학회지
• /
• 제30권5호
• /
• pp.320-332
• /
• 1997

The development of colored surface on zinc coating by the oxidation of a melten alloy of zinc with a minor amount of oxygen-avid additive such as tianium has been studied. Using a galvanizing Zinc alloy containing 0.1 to 0.3wt%Ti, gold, purple or blue color was developed clearly and stably, depending upon the extent of oxidation, by air cooling after hot dipping in a bath at temperature of $550^{\circ}C$ to $600^{\circ}C$. The source of the color is light interference with surface oxide layer. THe final color depends on the thickness of the color depends on the thickness of $TiO_2$, played So compositing, temperature and time at elevated temperature after are all controlling variables. Since oxidation film such as $TiO_2$ played role of passivation film, the corrosion resistance in a colored galvanized steel sheet. It is also thought that surface oxide layer of $TiO_2$ inhibited dissolution of the coating layer.

• 전기학회논문지
• /
• 제65권10호
• /
• pp.1697-1701
• /
• 2016

The leakage conduction and critical voltage characteristic of ZnO ceramic were investigated as a function of $Sb_2O_3$ concentration. Leakage conduction in the ohmic region increased with increasing $Sb_2O_3$ concentration and was attributed to the potential barrier height. The nonlinear coefficient increased with an increasing amount of $Sb_2O_3$. It was found that increases in the apparent critical voltages were associated with the lowered donor concentration in the grain boundary of between two ZnO grains. And the decrease of donor concentration on doping with $Sb_2O_3$ additive was attributed to the lowered capacitance in the grain boundary layer.

• Journal of Magnetics
• /
• 제11권3호
• /
• pp.119-122
• /
• 2006

We electroplated copper-cobalt thin films on a silicon substrate, which had 150 nm thick copper seed layer. The adhesion between the two metallic layers could be increased by utilizing a proper organic additive, pulse plating technique, and high temperature annealing. The thin films exhibited columnar growth of the deposits and enhanced adhesion. This is attributed to the grain growth mechanism introduced by the additive and annealing.

• 한국전기전자재료학회논문지
• /
• 제17권2호
• /
• pp.156-161
• /
• 2004

We investigated the effects of oxidizer additive on the performance of Cu-CMP process using commonly used tungsten slurry. In order to compare the removal rate and non-uniformity as a function of oxidizer contents, we used alumina-based tungsten slurry and copper blanket wafers deposited by DC sputtering method. According to the CMP removal rates and particle size distribution, and the microstructures of surface layer by SEM image as a function or oxidizer contents were greatly influenced by the slurry chemical composition of oxidizers. The difference in removal rate and roughness of copper surface are believed to cause by modification in the mechanical behavior of $Al_2$O$_3$abrasive particles in CMP slurry.

• 한국CDE학회논문집
• /
• 제22권2호
• /
• pp.190-201
• /
• 2017

This paper proposes how to solve a problem of FDM 3D printer's irregular output when changing volume of extrusion, adjusting movement speed of the printer's head and a way to fill new inner part. Existing slicers adjust directly to change the rotation speed of the stepper. In this method, the change of the extrusion area is delayed due to the gap between the stepper and the nozzle, so that precise control is difficult. We control the extrusion area adjusting the moving speed of the print head and making constantly the rotation speed of the stepper. Thus, the output time can be shortened by generating an efficient path having a short travel distance. For evaluation, we applied our method to lithophanes with detailed variation. Comparing existing methods, our method reduced output time at least 30%.

• 한국진공학회:학술대회논문집
• /
• 한국진공학회 2012년도 제42회 동계 정기 학술대회 초록집
• /
• pp.460-460
• /
• 2012

반도체 Device가 Shrink 함에 따라 Pattern Size가 작아지게 되고, 이로 인해 Photo Resist 물질 자체만으로는 원하는 Patterning 물질들을 Plasma Etching 하기가 어려워지고 있다. 이로 인해 Photoresist를 대체할 Hard Mask 개념이 도입되었으며, 이 Hardmask Layer 중 Amorphous Carbon Layer 가 가장 널리 사용되고 지고 있다. 이 Amorphous Carbon 계열의 Hardmask를 Etching 하기 위해서 기본적으로 O2 Plasma가 사용되는데, 이 O2 Plasma 내의 Oxygen Species들이 가지는 등 방성 Diffusion 특성으로 인해, 원하고자 하는 미세 Pattern의 Vertical Profile을 얻는데 많은 어려움이 있어왔다. 이를 Control 하기 인해 O2 Plasma Parameter들의 변화 및 Source/Bias Power 등의 변수가 연구되어 왔으며, 이와 다른 접근으로, N2 및 CO, CO2, SO2 등의 여러 Additive Gas 들의 첨가를 통해 미세 Pattern의 Profile을 개선하고, Plasma Etching 특성을 개선하는 연구가 같이 진행되어져 왔다. 본 논문에서 VLSI Device의 Masking Layer로 사용되는, Carbon 계 유기 층의 Plasma 식각 특성에 대한 연구를 진행하였다. Plasma Etchant로 사용되는 O2 Plasma에 새로운 첨가제 가스인 카르보닐 황화물 (COS) Gas를 추가하였을 시 나타나는 Plasma 내의 변화를 Plasma Parameter 및 IR 및 XPS, OES 분석을 통하여 규명하고, 이로 인한 Etch Rate 및 Plasma Potential에 대해 비교 분석하였다. COS Gas를 정량적으로 추가할 시, Plasma의 변화 및 이로 인해 얻어지는 Pattern에서의 Etchant Species들의 변화를 통해 Profile의 변화를 Mechanism 적으로 규명할 수 있었으며, 이로 인해 기존의 O2 Plasma를 통해 얻어진 Vertical Profile 대비, COS Additive Gas를 추가하였을 경우, Pattern Profile 변화가 개선됨을 최종적으로 확인 할 수 있었다.

• Bulletin of the Korean Chemical Society
• /
• 제24권2호
• /
• pp.183-188
• /
• 2003

The micro-patterning of multi-layered thin films containing CdS and $Ta_2O_5$ layers on ITO substrate with various structures was successfully obtained by combining three different techniques: chemical solution depositions, sol-gel, and microcontact printing (μCP) methods using octadecyltrichlorosilane (OTS) as the organic thin layer template. $Ta_2O_5$ layer was prepared by sol-gel casting and CdS one obtained by chemical solution deposition, respectively. Parallel and cross patterns of multi-layers with $Ta_2O_5$ and CdS films were fabricated additively by successive removal of OTS layer pre-formed. This study presents the designed architectures consisting of the two types of feature having horizontal dimensions of 170 ㎛ and 340 ㎛ with constant thickness ca. 150 nm of each deposited materials. The thin film lay-out of the cross-patterning is composed of four regions with chemically different layer compositions, which are confirmed by Auger electron microanalysis.

• 한국농공학회논문집
• /
• 제48권5호
• /
• pp.73-80
• /
• 2006

The mono-layer cover system is composed of soils only as a filling material and various plants are planted on the surface to control the water balance in the cover system. In this paper, the mono-layer cover system was considered as an alternative landfill final cover system and developed a model that could utilize industrial by-product (especially, coal ash & phosphogypsum) as additive filling materials. The mixture of granite soil, coal ash, and phosphogypsum was placed as a cover material in a box constructed with cement. Laboratory tests were carried out to investigate the environmental effect on the utilization of coal ash & phosphogypsum and to determine the mxing ratio of each materials. In the leaching test, all materials showed lower heavy metal concentration than the threshold values of regulation. The optimum mixing ratio of materials which was applied to field model test was determined to soil (4) : coal ash (1) : phosphogypsum (1) on the volume base. Field model tests were continued from February to July, 2004 in the soil box that was constructed with cement block. It was verified that coal ash and phospogypsum mixed with soil was to be safe environmentally and the water balance of mono-layer cover system was reasonable.

• Elastomers and Composites
• /
• 제51권4호
• /
• pp.275-279
• /
• 2016

Additive manufacturing or 3D printing is a new manufacturing process and its application is getting growth. However, the product qualities such as mechanical strength, dimensional accuracy, and surface quality are low compared with conventional manufacturing process such as molding and machining. In this study not only mechanical characteristics of polymer sandwich panel having three dimensional core layer but also mechanical characteristics of core layer itself were analyzed. The shape of three dimensional core layer was pyramidal kagome structure. This core layer was fabricated by two different methods, injection molding with PP resin and material jetting type 3D printing with acrylic photo curable resin. The material for face sheets in the polymer sandwich panel was PP. Maximum load, stiffness, and elongation at break were examined for core layers fabricated by two different methods and also assembled polymer sandwich panels. 3D printed core showed brittle behavior, but the brittleness decreased in polymer sandwich panel containing 3D printed core. The availability of 3D printed article for the three dimensional core layer of polymer sandwich panel was verified.

• 전기화학회지
• /
• 제17권2호
• /
• pp.79-85
• /
• 2014

리튬2차전지용 음극활물질로 연구되고 있는 실리콘은 흑연에 비하여 높은 이론용량 (4200mAh/g for $Li_{4.4}Si$)을 가지기 때문에 고용량 음극소재로 각광받고 있다. 이러한 실리콘 음극은 반복적인 충방전에 의해 활물질 입자의 심각한 부피변화와 균열에 의한 새로운 표면이 전해액에 계속적으로 노출되는 문제로 인하여 두껍고 불안정한 피막생성을 유도한다. 불안정한 구조의 피막은 실리콘 음극의 전기화학적 성능뿐만 아니라 고온 열안정성을 저해할 수 있기 때문에 본 연구에서는 실리콘의 열안정성 향상을 위해 전해액 첨가제를 도입하여 피막구조를 변경하고자 한다. 전해액 첨가제인 lithium bis(oxalato)borate (LiBOB)가 실리콘 음극표면에 피막을 효과적으로 형성하였으며, 만충전 상태의 실리콘 음극의 $60^{\circ}C$ 저장시 용량유지 특성을 개선하였으며 고온에서의 열안정성 크게 향상시켰다.