• Journal of Korean Society for Quality Management
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• v.28 no.4
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• pp.16-28
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• 2000

Recently days, High Accelerated Life Test of electrical and electronic parts is increasing its importance. This study set the hypothesis to develop the method that was analysis and application of HALT for the automotive electrical and electronic parts, it used Arrhenius's Model and Eyring's Model, and ESS theory. Validity of application is proved by other test data. Especially, this study emphasis on utility of acceleration to temperature, humidity, voltage, mechanical stress and other stress. In this study set the pattem of practical application. Therefore, this study emphasis on the application of the HALT and the use of other parameter by acceleration reliability test data. The result of this study is as follows. 1) There is relationship between molar weight and material constant. 2) Characteristic of material is operating acceleration factor as well as parts failure factors. Of course, according to the characteristic of material, activation energy is often more important than molar weight. But it will be defined by more testing and improvements in practical application.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2000.07a
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• pp.119-122
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• 2000

Recently polymer insulators are being used for outdoor high voltage applications. Polymer insulators for transmission line have significant advantages over porcelain and glass insulators, especially for ultra-high voltage transmission lines. Their advantages are light weight, vandalism resistance and hydrophobicity. Polymer insulators are a relatively new technology, but their expected life is still unknown. Therefore these estimating technique are very important. Their life time is related to weathering and operating condition. Multi-aging test is requested because aging factor is occurred by multi-aging than unique aging. The aging test about polymer insulators have mainly carried out by IEC 61109. This paper presents multi-stress chamber experiments and tracking wheel test to examine the tracking and erosion performance of polymer insulator for transmission. Multi-stress testing is able to demonstrate deficiencies of polymer insulator materials and designs, including the nature of interfaces in insulation design. We have investigated IEC 61109 Annex C (5000h aging test) and CEA tracking wheel test as test methods of artificial accelerated aging. The aging degree of polymer insulator is estimated by leakage current, measurement of hydrophobicity degree, damage conditions of insulator surface, withstand voltage test etc.

• Journal of Drive and Control
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• v.15 no.4
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• pp.48-54
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• 2018

The hydraulic servo actuator has always operated very precisely with high frequency and small displacement, and is used continuously for a long time. The hydraulic servo actuator of the test equipment used in the accelerated life test in order to guarantee the service life of the automotive parts failed earlier than the products before finishing the test. This study performed an analysis on the cause of the failure of the hydraulic servo actuator used in the test equipment, changed the design of the actuator to solve the root cause of the main failure mode, and developed the improved servo actuator. Based on above process, this study established a better performances and longer lifetime of the servo actuator after testing.

• Transactions of the KSME C: Technology and Education
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• v.1 no.1
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• pp.115-121
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• 2013

It is greatly expected that the technologies of durability enhancement and evaluation for the core structures of plant facilities, marine plant and bridge constructures will be greatly expanded in the plant industry fields. In this study, the actively ongoing applied cases were tried to be analyzed in the present domestic industry fields through the Ultrasonic Nanocrystalline Surface Modification (UNSM) and Ultrasonic Fatigue Test (UFT) technologies using ultrasonic elastic vibrational energy, and the new application technology to improve the durability of plant industry field, especially plant facilities, marine plant and core weld components of bridge constructures will be presented.

• Journal of The Korean Society of Agricultural Engineers
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• v.59 no.5
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• pp.73-81
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• 2017

The improved movable weir supplements the advantages and disadvantages of the rubber weir and the conduction gate. It consists of a stainless steel gate, air bags, and a steel clamping plate. The stainless steel gate is the main body of the weir, and the inflatable rubber sheet serves to support the steel gate. The steel clamping plate is typically in direct continuous contact with water, but this leads to corrosion issues that can reduce the life of the entire movable weir. In this study, a panel-type glass-fiber-reinforced polymer (GFRP) clamping plate was designed and fabricated. The test results showed that the flexural load of the panel-type GFRP composite clamping plate was over twice that of the wings type GFRP clamping plate. The lowest moisture absorption value was obtained upon exposure to tap water, and exposure to other solutions showed similar values. Additionally, flexural load testing after exposure to an accelerated environment found the lowest residual loads of 80.51 % and 78.50 % at 50 and 100 days, respectively, for exposure to a $CaCl_2$ solution, while exposure to other environments showed residual failure loads of over 80 % at both 50 and 100 days.

• Corrosion Science and Technology
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• v.8 no.3
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• pp.116-118
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• 2009

Korea Institute of Construction Materials founded Seosan Outdoor Exposure Test Site 2005 at Korea, which is a part of Worldwide Exposure Network (WEN). To evaluate the test site along with other exposure test sites, three different types of paints have been under real time weathering conditions at three major weathering test facilities around the world. Using these test specimens several spectroscopic experiments along with physical tests have been performed. Also acceleration tests have been performed using the same paints. The correlation of weathered paints among three different test facilities and accelerated test results has been compared. From the results the reliability of Seosan Weathering Test Facility and reasonable life time prediction tests are discussed.

• Corrosion Science and Technology
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• v.22 no.3
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• pp.153-163
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• 2023

Two types of accelerated tests, Water Drop Test (WDT) and Temperature-Humidity-Bias Test (THBT), can be used to evaluate the susceptibility to electrochemical migration (ECM). In the WDT, liquid water is directly applied to a specimen, typically a patterned conductor like a printed circuit board. Time to failure in the WDT typically ranges from several seconds to several minutes. On the other hand, the THBT is conducted under elevated temperature and humidity conditions, allowing for assessment of design and life cycle factors on ECM. THBT is widely recognized as a more suitable method for reliability testing than WDT. In both test methods, localized corrosion can be observed on the anode. Composition of dendrites formed during the WDT is similar to that formed during THBT. However, there is a lack of correlation between the time to failure obtained from WDT and that obtained from THBT. In this study, we investigated the relationship between electrochemical parameters and time to failure obtained from both WDT and THBT. Differences in time to failure can be attributed to actual anode potential obtained in the two tests.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2000.04a
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• pp.43-55
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• 2000

In traditional electronic packages the die and the substrate are interconnected with fine wire. Wire bonding technology is limited to bond pads around the peripheral of the die. As the demand for I/O increases, there will be limitations with wire bonding technology. Flip chip technology eliminates the need for wire bonding by redistributing the bond pads over the entire surface of the die. Instead of wires, the die is attached to the substrate utilizing a direct solder connection. Although several steps and processes are eliminated when utilizing flip chip technology, there are several new problems that must be overcome. The main issue is the mismatch in the coefficient of thermal expansion (CTE) of the silicon die and the substrate. This mismatch will cause premature solder Joint failure. This issue can be compensated for by the use of an underfill material between the die and the substrate. Underfill helps to extend the working life of the device by providing environmental protection and structural integrity. Flux residues may interfere with the flow of underfill encapsulants causing gross solder voids and premature failure of the solder connection. Furthermore, flux residues may chemically react with the underfill polymer causing a change in its mechanical and thermal properties. As flip chip packages decrease in size, cleaning becomes more challenging. While package size continues to decrease, the total number of 1/0 continue to increase. As the I/O increases, the array density of the package increases and as the array density increases, the pitch decreases. If the pitch is decreasing, the standoff is also decreasing. This paper will present the keys to successful flip chip cleaning processes. Process parameters such as time, temperature, solvency, and impingement energy required for successful cleaning will be addressed. Flip chip packages will be cleaned and subjected to JEDEC level 3 testing, followed by accelerated stress testing. The devices will then be analyzed using acoustic microscopy and the results and conclusions reported.

• Journal of the Korean Society for Nondestructive Testing
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• v.21 no.6
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• pp.618-629
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• 2001

This paper presents a result of failure analysis and reliability evaluation for high voltage ceramic capacitors. The failure modes and failure mechanisms were studied in two ways in order to estimate component life and failure rate. The causes of failure mechanisms for zero resistance phenomena under withstanding voltage test in high voltage ceramic capacitors molded by epoxy resin were studied by establishing an effective root cause failure analysis. Particular emphasis was placed on breakdown phenomena at the ceramic-epoxy interface. The validity of the results in this study was confirmed by the results of accelerated testing. Thermal cycling test for high voltage ceramic capacitor mounted on a magnetron were implemented. Delamination between ceramic and epoxy, which might cause electrical short in underlying circuitry, can occur during curing or thermal cycle. The results can be conveniently used to quickly identify defective lots, determine $B_{10}$ life estimation each lot at the level of inspection, and detect major changes in the vendors processes. Also, the condition for dielectric breakdown was investigated for the estimation of failure rate with load-strength interference model.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.19 no.10
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• pp.424-429
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• 2018

In this study, an expansion joint that is susceptible to waterhammer was tested for its vibration durability. The operation data for the hydraulic actuator was the expansion length of the expansion joint when the waterhammer occurred. In the case of the vibration durability test, the internal temperature status of the expansion joint was assumed to be a stress factor and a lifespan prediction model was assumed to follow the Arrhenius model. A test was carried out by increasing the internal temperature status at $30^{\circ}C$, $50^{\circ}C$, and $65^{\circ}C$. By a linear transformation of the lifespan data for each temperature, a constant value and activation energy coefficient was induced for the Arrhenius equation and verified by comparing the value of a lifetime prediction model with the experimental value at $85^{\circ}C$. The failure modes of the ongoing or finished test were leakage, bellows separation, and internal deformation. In the future, a composite lifespan prediction model, including two more stress factors, will be developed.