• Title/Summary/Keyword: Abrasives

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Micro Plishing using Electorheological fluid (ER유체를 이용한 미세 연마 가공)

  • 김욱배;이성재;박철우;이상조
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2000.11a
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    • pp.850-853
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    • 2000
  • It is well-known that Electro-rheological(ER) fluid is a material(suspension) which shows the dramatic change of rheological properties under an electric field. Using these properties, the concept that variable apparent viscosity of ER fluid could be applicable to the polishing for micro parts was introduced. It was investigated that how it works for polishing and how it affects ER effect when abrasives were mixed with an ER fluid. Therefore a few structures for polishing using ER fluid was suggested and evaluated by means of experiments. In this paper, fundamental mechanism and experimental results are described.

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Deburring Characteristics of Frame Hole in Fishing Trackle Reel (휘싱 트래클 릴 프레임홀 면의 디버링특성)

  • 김정두
    • Proceedings of the Korean Society of Machine Tool Engineers Conference
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    • 1998.03a
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    • pp.203-208
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    • 1998
  • Materials of the Frame hole in fishing trackle reel is made up a number large and small holes. Thus, it is difficult to effective machining. Abrasive flow machining(AFM) is useful to polish a internal or external surface of the 3-dimensional shape parts, which are used in many fields such as aerospace, automative, semi-conductor, and medical component industries. The machining process is that two hydraulic cylinders, which are located face to face, enforce abrasive media to the passage between workpiece and tooling parts alternately, and then the abrasives include in the media pass the passage and polish the surface of workpiece. The media which is made of polymer and abrasives plays the role of the tool for deburring or polishing complex shap workpiece by its viscoelastic characteristics. In this study, the abrasive media for abrasive flow machining was made by mixing viscielastic polymer with alunina and silicon carbide abrasive. Also, we present AFM device design and preliminary results of an investigation in to some aspects of the AFM process performance in fishing trackle reel.

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The Magnetic Finishing Characteristics of Non-ferromagnetic Pipe Inside Polished (비자성 파이프 내면기 자기연마특성에 관한 연구)

  • Park Won Kyou;Rho Tae Woo;Choi Hwan
    • Transactions of the Korean Society of Machine Tool Engineers
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    • v.13 no.6
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    • pp.74-80
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    • 2004
  • An internal finishing process by the application of magnetic abrasive machining has been developed as a new technology to obtain a fine inner surface of pipe. In this paper, the finishing process of a non-ferromagnetic pipe by a static magnetic field method is introduced and its finishing characteristics is discussed with effective factors by various experiments. From these experimental results, it is found that the magnetic abrasives inserted in the pipe are arranged according to the magnetic force line. Through the experimental, it is possible to estimate the proper supply volume of the abrasive, which in proportional to the diameter of pipe.

Magnetic Abrasive Polishing and Its Application (초정밀 자기연마 가공 기술과 최근 연구)

  • Kwak, Tae-Soo;Kwak, Jae-Seob
    • Journal of the Korean Society for Precision Engineering
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    • v.29 no.3
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    • pp.266-272
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    • 2012
  • This paper has aims to share fundamental knowledge for magnetic abrasive polishing and to mainly introduce recent research results. In order to enhance a magnetic flux density for nonferrous materials, advanced magnetic abrasive polishing system which is called 2nd generation system was established by electro-magnet array table, and the effectiveness of the electromagnet array table was evaluated in real polishing experiments. To increase adhesiveness of the abrasives in high speed polishing, a silicone gel agent was proposed and carbon nanotube particles as new magnetic abrasives were applied in the magnetic abrasive polishing. In addition, a strategy for optimal step-over determination by heuristic algorithm was introduced for applying large size workpiece. Curved surfaces having a uniform radius were simulated and tested with installed electro-magnet array table.

Chemical Mechanical Polishing Characteristics of Mixed Abrasive Slurry by Adding of Alumina Abrasive in Diluted Silica Slurry (탈이온수로 희석된 실리카 슬러리에 알루미나 연마제가 첨가된 혼합 연마제 슬러리의 CMP 특성)

  • 서용진;박창준;최운식;김상용;박진성;이우선
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.16 no.6
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    • pp.465-470
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    • 2003
  • The chemical mechanical polishing (CMP) process has been widely used for the global planarization of multi-layer structures in semiconductor manufacturing. The CMP process can be optimized by several parameters such as equipment, consumables (pad, backing film and slurry), process variables and post-CMP cleaning. However, the COO(cost of ownership) is very high, because of high consumable cost. Especially, among the consumables, the slurry dominates more than 40 %. In this paper, we have studied the CMP characteristics of diluted silica slurry by adding of raw alumina abrasives and annealed alumina abrasives. As an experimental result, we obtained the comparable slurry characteristics compared with original silica slurry in the view-point of high removal rate and low non-uniformity. Therefore, we can reduce the cost of consumables(COC) of CMP process for ULSI applications.

A Study on the Recycling of Silica Slurry Abrasives by Filtering (필터링에 의한 실리카 슬러리 연마제의 재활용에 관한 연구)

  • Seo Yong-Jin;Park Sung-Woo;Lee Woo-Sun
    • The Transactions of the Korean Institute of Electrical Engineers C
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    • v.53 no.11
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    • pp.551-555
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    • 2004
  • In this paper, in order to reduce the high COO (cost of ownership) and COC (cost of consumables), we have collected the silica abrasive powders by filtering method after subsequent CMP (chemical mechanical polishing) process for the purpose of abrasives recycling. And then, we have studied the possibility of recycle of reused silica abrasive through the analysis of particle size distribution and FE-SEM (field emission-scanning electron microscope) measurements of abrasive powders. It was annealed the collected abrasive powders to promote the mechanical strength of reduced abrasion force. Finally, we compared the CMP characteristics between self-developed KOH-based silica abrasive slurry and original slurry. As our experimental results, we obtained the comparable rate of removal and good planarity with commercial products. Consequently we can expect the saving of high cost slurry.

A Study on the Oxide CMP Characteristics of using $MnO_2$-Mixed Abrasive Slurry ($MnO_2$-MAS) ($MnO_2$ 연마제를 혼합한 Mixed Abraive Slurry (MAS)의 CMP 특성)

  • Han, Sung-Min;Park, Sung-Woo;Lee, Woo-Sun;Seo, Yong-Jin
    • Proceedings of the KIEE Conference
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    • 2006.10a
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    • pp.83-84
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    • 2006
  • Chemical mechanical polishing (CMP) process has been attracted as an essential technology of multi-level interconnection. However, the COO (cost of ownership) is very high, because of high consumable cost. Especially, among the consumables, slurry dominates more than 40 %. So, we focused how to reduce the consumption of raw slurry. In this paper, $MnO_2$ abrasives were added de-ionized water (DIW) and pH control as a function of KOH contents. Also, the addition effects of $MnO_2$ abrasives and the diluted silica slurry (DSS) on CMP performances were evaluated. Finally, we have investigated the possibility of new abrasive for the oxide CMP application.

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A Study on the effect of TEOS film by Dispel8ion Time and Content of $CeO_2$ Abrasive (DSS에서 $CeO_2$ 연마제의 첨가량과 분산시간이 TEOS 막에 미치는 특성연구)

  • Seo, Yong-Jin;Han, Sang-Jun;Park, Sung-Woo;Lee, Young-Kyun;Lee, Sung-Il
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2009.06a
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    • pp.487-487
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    • 2009
  • One of the critical consumables in chemical mechanical polishing (CMP) is a specialized solution or slurry, which typically contains both abrasives and chemicals acting together to planarize films. In single abrasive slurry (SAS), the solid phase consists of only one type of abrasive particle. On the other hand, mixed abrasive slurry (MAS) consists of a mixture of at least two types of abrasive particles. In this paper, we have studied the CMP characteristics of mixed abrasive slurry (MAS) retreated by adding of $CeO_2$ abrasives within 1:10 diluted silica slurry (DSS). The slurry designed for optimal performance should produce reasonable removal rates, acceptable polishing selectivity with respect to the underlying layer, low surface defects after polishing, and good slurry stability. The modified abrasives in MAS are evaluated with respect to their particle size distribution, surface morphology, and CMP performances such as removal rate and non-uniformity. As an experimental result, we obtained the comparable slurry characteristics compared with original silica slurry in the viewpoint of high removal rate and low non-uniformity.

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Evaluation of Point-Of-Use (POU) Filters Performance in Chemical Mechanical Polishing Slurry Supply System (슬러리 공급 시스템을 이용한 화학적 기계적 연마 공정에서의 POU 필터의 성능 평가)

  • Jang, Sunjae;Kim, Hojoong;Jin, Hongi;Nam, Miyeon;Kulkarni, Atul;Kim, Taesung
    • Particle and aerosol research
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    • v.9 no.4
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    • pp.261-269
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    • 2013
  • The chemical mechanical polishing (CMP) process is widely used in semiconductor manufacturing process for planarization of various materials and structures. Point-of-use (POU) filters are used in most of the CMP processes in order to reduce the unwanted micro-scratches which may result in defects. The performance of the POU filter is depends on type and size of the abrasives used during cleaning process. For this reason, there is a need to evaluate POU filters for their filtration efficiency (FE) with different types of abrasives. In this study, we developed filter test system to evaluate the FE of POU using ceria and silica abrasives (slurry). The POU filter is roll type capsule filter with retention size of 0.2 ${\mu}m$. Two POU filters of different make are evaluated for FE. We observed that both POU filters show similar filtration efficiency for silica and ceria slurry. Results reveal that the ceria slurry and the colloidal silica particle are removed not only by mechanical way but also hydrodynamic and electrostatic interaction way.