• Composites Research
• /
• 제16권3호
• /
• pp.75-84
• /
• 2003

본 연구의 목적은 가압주조법에 의해 제조된 Saffil/Al, Saffil/$\textrm{Al}_2\textrm{O}_3$/Al, Saffil/SiC/Al 과 같은 혼합금속 복합재료의 마모 물성을 조사하고자 하는 것이다. 마모 시험은 건조와 윤활상태 하에서 pin-on-disk 형태의 마모 시험기로 수행되었다. 세가지 금속복합재료의 마모 물성시험에서 Saffil섬유, $\textrm{Al}_2\textrm{O}_3$입자, SiC입자의 효과들을 조사하였다. 마모 메커니즘은 복합재료의 마모된 표면들을 관찰하여 분석하였다. 마모과정 동안 마찰계수(COF)의 변화는 컴퓨터에서 자동적으로 기록되었으며, 건조 조건에서 Saffi1/SiC/Al은 고온과 높은 하중 하에서 가장 좋은 마모 저항을 보여주었다. 한편 Saffil/ Al과 Saffi1/$\textrm{Al}_2\textrm{O}_3$/Al의 마모 저항은 비슷한 결과를 보였다. 건조조건에서 적당한 하중과 상온에서 지배적인 마모 메커니즘은 연삭 마모이며, 하중이나 온도가 증가함에 따라 응착마모로 변화되며, 고온에서는 융착마모를 나타내었다. 건조 상태에서 세가지 복합재료를 비교시 액체 파라핀에 의한 윤활시험시 마모 특성이 가장 좋은 결과를 나타내었다. 윤활조건에서는 Saffil/Al복합재료가 가장 좋은 마모 저항성을 보였으며, 이 경우 마찰계수도 가장 작게 나타났다. 윤활 조건에서 금속복합재료의 주요 마모 메커니즘은 microploughing 이었으나, microcracking 역시 다른 정도에서는 미소 균열도 발생한다.

• 암석학회지
• /
• 제16권3호
• /
• pp.144-161
• /
• 2007

낭산지역 일대의 쥬라기 흑운모 화강섬록암은 담회색, 치밀조직을 이루는 중립질암이다. 암체에 대한 광역적인 열극체계 분석결과는 다음과 같다. 열극의 주향은 빈도등급에 의하여 크게 세 방향으로 분류가 가능하다. 이들 열극은 빈도등급에 의하여 (1) $N80^{\circ}{\sim}90^{\circ}E$ (1st-order)>(2) $N70^{\circ}{\sim}80^{\circ}E$ (2nd-order)>(3) $NS{\sim}N10^{\circ}E$ (3rd-order)의 순으로 나타난다. 특히 이들 열극의 간격은 200 cm 미만의 것들이 대부분을 차지한다. 따라서 분석된 열극체계 및 간격으로 미루어 낭산일대에서는 규격석보다 비규격석의 산출이 훨씬 많아 쇄석자원의 잠재성이 더 클 것으로 해석된다. 특히 밀집하는 기존 석산의 수직상 채석면의 방향도 빈도등급에 의하여 두 그룹으로 분류되어, (1) $N14^{\circ}W{\sim}N16^{\circ}E$ (1st-order)와 (2) $N78^{\circ}E{\sim}N88^{\circ}E$ (2nd-order)에서 뚜렷이 우세하다. 상기한 두 그룹의 수직상 채석면의 방향은 광역적 열극체계와는 다소 차이가 있다. 이와 같은 현상은 단위 석산에서 발달하는 미세균열의 배향성과 크게 관련되는 것으로 볼 수 있다. 낭산지역의 물성 중에서 비중, 흡수율, 공극률, 압축강도, 인장강도와 마모경도는 각각 2.65, 0.28%, 0.73%, $1,628kg/cm^2,\;100kg/cm^2$ 및 31의 평균값을 가진다. 공극률의 경우와는 달리, 낭산 및 속리산지역의 화강암류는 상호 유사한 마모경도를 가진다. 이는 마모저항의 지표로 간주되는 석영과 알칼리장석의 모우드 값의 차이로 설명될 수 있다. 한편 낭산지역의 연구를 통하여 규명된 수직상 채석면의 방향 및 각종 물성특성의 전반적인 이해는 차후 이 지역의 암석자원 활용 시주요 정보로 활용될 것으로 기대된다.

• 한국전기전자재료학회논문지
• /
• 제30권5호
• /
• pp.301-306
• /
• 2017

Wire electrical discharge machining (WEDM) process was evaluated to slice Silicon (Si) for various applications. Specifically, various Si workpieces with various resistances, such as single and multi crystalline Si bricks and wafers were used. As conventional slicing processes, such as slurry-on or diamond-on wire slicing, are based on mechanical abrasions between Si and abrasive, there is a limitation to decrease the wafer thickness as well as kerf-loss. Especially, when the wafer thickness is less than $150{\mu}m$, wafer breakage increases dramatically during the slicing process. Single crystalline P-type Si bricks and wafers were successively sliced with considerable slicing speed regardless of its growth direction. Also, typical defects, such as microcracks, craters, microholes, and debris, were introduced when Si was sliced by electrical discharge. Also, it was found that defect type is also dependent on resistance of Si. Consequently, this study confirmed the feasibility of slicing single crystalline Si by WEDM.

• 대한용접접합학회:학술대회논문집
• /
• 대한용접접합학회 2002년도 Proceedings of the International Welding/Joining Conference-Korea
• /
• pp.53-58
• /
• 2002

Electrical insulation and mechanical properties of the plasma sprayed oxide ceramic coatings were studied before and after the sealing treatment of the ceramic coatings. Plasma sprayed A1$_2$O$_3$-TiO$_2$ coating as the reference coating was sealed using three commercial sealants based on polymer. Penetration depth of the sealants to the ceramic coating was evaluated directly from the optical microscope using a fluorescent dye. It is estimated that the penetration depth of the sealants to the ceramic coating is from 0.2 to 0.5 mm depending on the sealants used. The preliminary test results with a DC puncture tester imply that the dielectric breakdown voltage mechanism of plasma sprayed ceramic coatings has been determined to be a corona mechanism. Dielectric breakdown voltage of the as-sprayed and as-ground samples have shown a linear trend with regard to the thickness showing an average dielectric strength of 20 kV/mm for the thickness scale studied. It is also shown that grinding the coating before sealing and adding fluorescent dye do not agent the penetration depth of sealants. All of the microhardness, two-body abrasive wear resistance, bond strength, and surface roughness of the ceramic coating after the sealing treatment are improved. The extent of improvement is different from the sealants used. However, three-point bending stress of the ceramic coating after the sealing treatment is decreased. This is attributed to the reduced micro-crack toughening effect since the cracks propagate easily through the lamellar of the coating without crack deflection and/or branching after the sealing treatment.

• 대한기계학회논문집A
• /
• 제21권5호
• /
• pp.791-799
• /
• 1997

The wear characteristics and wear mechanisms of plasma sprayed Al/sub 2/ O/sub 3/-40%TiO/sub 2/ and Cr/sub 2/O/sub 3/ deposited on casting aluminum alloy(AC4C) were investigated. Specimens were processed for various coating thicknesses. Ball on disk type wear tester was used for wear test. The scratch test on plasma sprayed coating surface showed that critical load to break the coating layer was greater than 40 N. The critical load increase with the increase of coating thickness of specimens. The friction coefficient of Cr/sub 2/O/sub 3/ coating layer was less than that of Al/sub 2/O/sub 3/-40%TiO/sub 2/ coating layer. The wear resistance of Cr/sub 2/O/sub 3/ coating layer was greater than that of Al/sub 2/O/sub 3/-40%TiO/sub 2/ coating layer. Microscopic observation of worn surfaces was made by SEM. SEM observation showed that the main mechanism of wear for Al/sub 2/O/sub 3/-40%TiO/sub 2/ coating layer was abrasive wear under 50 N. For the case of Al/sub 2/O/sub 3/-40%TiO/sub 2/ coating layer, as the surface cracks perpendicular to sliding direction propagated, the wear debris was generated in wear track. However, the main mechanism of wear for Cr/sub 2/O/sub 3/ coating layer was brittle fracture under 150 N.

• 한국분말재료학회지
• /
• 제13권6호
• /
• pp.421-426
• /
• 2006

The microstructural and mechanical properties of Al-Si alloyed powder, prepared by gas atomization fallowed by hot extrusion, were studied by optical and scanning electron microscopies, hardness and wear testing. The gas atomized Al-Si alloy powder exhibited uniformly dispersed Si particles with particle size ranging from 5 to $8{\mu}m$. The hot extruded Al-Si alloy shows the average Si particle size of less than $1{\mu}m$. After heat-treatment, the average particle size was increased from 2 to $5{\mu}m$. Also, mechanical properties of extruded Al-Si alloy powder were analyzed before and after heat-treatment. As expected from the microstructural analysis, the heat-treated samples resulted in a decrease in the hardness and wear resistance due to Si particle growth. The friction coefficient of heat-treated Al-Si alloyed powder showed higher value tough all sliding speed. This behavior would be due to abrasive wear mechanism. As sliding speed increases, friction coefficient and depth and width of wear track increase. No significant changes occurred in the wear track shape with increased sliding speed.

• 한국분말재료학회지
• /
• 제18권3호
• /
• pp.290-296
• /
• 2011

Titanium carbonitride is more perspective materials compared to titanium carbide. It can be used in tool industry and special products because of its higher strength, abrasive wear-resistance and especially its strong chemical stability at high temperatures. We produced STS+TiCxNy composite by the spark plasma sintering for higher strength and studied the characteristics. The planar and cross-sectional microstructures of the specimens were observed by scanning electron microscopy. Characterizations of the carbon and nitride phases on the surface of composite were carried out using an X-ray diffractometer. During annealing TiCxNy particles diffusion into STS 430 was observed. After annealing, sintering isolations between particles were formed. It causes decreasing of mechanical strength. In addition when annealing temperature was increased hardness increased. Heterogeneous distribution of alloying elements particles was observed. After annealing composites, highest value of hardness was 738.1 MHV.

• 폴리머
• /
• 제26권6호
• /
• pp.803-811
• /
• 2002

본 연구에서는 상이한 방법을 통하여 제조된 초고분자량 폴리에틸렌 (ultra high molecular polyethylene, UHMWPE)/카올린 복합재료의 마모 특성에 대하여 살펴보았다. 카올린 입자는 중합충전(in-situ polymerization)법과 분말 혼합법의 두 가지 상이한 방법을 통하 UHMWPE와 복합화되었으며 특히 분말 혼합법에서는 입자상으로 구성된 두 재료의 혼합 방법에 따른 입자 분산 및 마모 특성에 대하여 분석하였다. 제조된 복합재료의 마모실험에서 입자 충전에 의하여 내마모성이 크게 향상되었는데 연삭마모가 지배적인 마모기구였으며, 중합충전법이 내마모성 향상에 있어서 분말혼합법에 비하여 효과적이었다. 또한 충전된 입자의 분산 상태와 계면 특성이 내마모성 향상에 중요한 변수임을 확인할 수 있었다.

• 한국기계가공학회지
• /
• 제16권5호
• /
• pp.85-90
• /
• 2017

Mica-glass ceramics has features such as micro-sized crystals, high strength, chemical resistance, semitransparent optical properties, etc. Due to its superior material properties, mica glass ceramics have increasing applications in dental and medical components, insulation boards, chemical devices, etc. In many applications, especially for dental and medical components, ultra-precise polishing is required. However, it is known to be a very difficult-to-grind material because of its high hardness and brittle properties. Thus, in this study, a newly developed ultra-precise polishing method is applied to obtain nano-level surface roughness of the mica glass ceramics using magnetorheological (MR) fluids and nano abrasives. Nano-sized ceria particles were used for the polishing of the mica glass ceramics. A series of experiments were performed under various polishing conditions, and the results were analyzed. A very fine surface roughness of Ra=6.127 nm could be obtained.

• 한국전기전자재료학회:학술대회논문집
• /
• 한국전기전자재료학회 2007년도 하계학술대회 논문집 Vol.8
• /
• pp.79-80
• /
• 2007

Copper has been used as an interconnect material in the fabrication of semiconductor devices, because of its higher electrical conductivity and superior electro-migration resistance. Chemical mechanical polishing (CMP) technique is required to planarize the overburden Cu film in an interconnect process. Various problems such as dishing, erosion, and delamination are caused by the high pressure and chemical effects in the Cu CMP process. But these problems have to be solved for the fabrication of the next generation semiconductor devices. Therefore, new process which is electro-chemical mechanical planarization/polishing (ECMP) or electro-chemical mechanical planarization was introduced to solve the. technical difficulties and problems in CMP process. In the ECMP process, Cu ions are dissolved electrochemically by the applying an anodic potential energy on the Cu surface in an electrolyte. And then, Cu complex layer are mechanically removed by the mechanical effects between pad and abrasive. This paper focuses on the manufacturing of ECMP system and its process. ECMP equipment which has better performance and stability was manufactured for the planarization process.