• Progress in Superconductivity
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• v.5 no.2
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• pp.144-148
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• 2004

Uniform current distribution among conductor layers in HTS cables using IPTs (inter-phase transformers) was investigated. Conventional methods for current distribution, in which resistors are inserted to conductor layers, causes additional loss. In contrast, IPTs, which use magnetic coupling, make it possible that the current in parallel circuits is distributed uniformly with any load, and minimize the loss. In this study, IPTs were designed and fabricated for examination of uniform current distribution in the conductor layers of HTS cables. The ITP was designed through calculation of its impedance that can cancel the inductance of the conduction layers. The experimental setup consisted of four IPTs and four inductors that simulate the conductor layer inductance. Each layer was designed to feed 10 A. We examined the behavior of current distribution with IPTs for various layer inductances.

• Journal of Magnetics
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• v.9 no.1
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• pp.13-16
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• 2004

Magnetic tunnel junctions (MTJs) comprising amorphous CoNbZr layers have been investigated. $Co_{85.5}Nb_8Zr_{6.5}$(in at. %) layers were employed to substitute the traditionally used Ta layers with an emphasis given on under-standing underlayer effect. The typical junction structure was $SiO_2/CoNbZr$ or Ta 2/CoFe 8/IrMn 7.5/CoFe 3/Al 1.6 + oxidation/CoFe 3/CoNbZr or Ta 2 (nm). For both as-deposited state and after annealing, the CoNbZr-underlayered structure showed superior surface smoothness up to the tunnel barrier than Ta-underlayerd one (rms roughness of 0.16 vs. 0.34 nm). CoNbZr-based MTJs was proven beneficial for increasing thermal stability and increasing $V_h$ (the bias voltage where MR ratio becomes half) characteristics than Ta-based MTJs. This is because the CoNbZr-based junctions offer smoother interface structure than the Ta-based one.

• Journal of the Korean institute of surface engineering
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• v.12 no.2
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• pp.75-83
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• 1979

The Rates of formation and heats of activation for the intermatallic Compound Layers between Cold rolled sheet and molten aluminium &ath (adding small amounts of silicon) has been determined by Continous aluminizing method in the temperature range of 680$^{\circ}$ to 760$^{\circ}C$ and with immerssion time. The structure of the intermetallic Compound Layers was the shape of "Tongues" in pure Al-Bath and Al-Bath Containing 1% Si, But in Al-5% Si Bath was "Band" the Composition of the intermetallic Compound Layers were checked by microhardness measurements and X-Ray probe micro analyzer. FeAl intermetallic Compound layer was found to be uniform in pure Al-Bath and Al-5% Si Bath, But Fe Al intermetallic Compound Layer was shown in Al-1% Si Bath. The growth Rates of the intermetallic Compound Layers was most rapidly increased at Temperatures from 720$^{\circ}$ to 760$^{\circ}C$, at the immorsion time above 60 Second in pure Al-Bath, But in Al-1% Si Bath was solwly increased for the same conditions, and then in Al-5% Si Bath was hardly effected by these experimental condition. Heasts of activation of 29, 46 Kcal per mole which calculuted from Layer growth experiments were found in pure Al-Bath, Al-1% Si Bath respectively.

• Journal of the Korean Vacuum Society
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• v.4 no.S1
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• pp.168-173
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• 1995

$GaxIn{1_x}As$ epitaxial layers were grown by a simplified hydrode vapor phase epitaxy(VPE) method bsed on the utilization of Ga/In alloy as the source metal. The effects of a wide range of experimental variables(i.e.,inlet mole fraction of HCI, deposition temperature, Ga/In alloy composition) on the ternary composition and growth rate were investigated. Layers of $Ga_{0.47}In_{0.53}As$ lattice matched to InP were successfully grown from alloys containing 5 to 8 at.% Ga. These layers were used to produce state-of-the art p-i-n photodetectors having the following characteristics: dark current, $I_d$(-5V) = 10-20 nA: responsivity, R=0.84-0.86 A/W; dark current, Id(-5V)=10-20 nA; responsivity, R=0.84-0.86 A/W; capacitance, C=0.88-0.92 pF; breakdown voltage, $V_b$ >40V. This study demonstrated for the first time that a simplified hydride VPE process with a Ga/In alloy source is capable of producing device quality epitaxial layers.

• Journal of Magnetics
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• v.9 no.2
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• pp.40-46
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• 2004

The magnetic properties of sputtered ($Ni_{83}Fe_{17}/Au/Co/Au$) multilayers with various thicknesses of Au (0.5 {\leq} t_{Au} {\leq} 3 nm), Ni-Fe ($1{\leq}t_{Ni-Fe}{\leq}4nm$) and Co ($0.2{\leq}t_{co}{\leq}1.5nm$) layers were characterized. An alternating in-plane and out-of-plane anisotropy of the ferromagnetic layers was achieved for the structures ($t_{Au}{\geq}1.5nm$) showing a weak coupling between the Ni-Fe layers with an in-plane anisotropy and the Co layers ($0.3{\leq}t_Co{\leq}1.2nm$) with a perpendicular anisotropy. For such a structure, a detailed discussion on the GMR effect is presented, relating to the magnetization reversal from a mutually perpendicular magnetic configuration at the remanence to a parallel one at the saturation. An influence of the dense labyrinth domain structure on the magnetoresistance effect is also addressed.

• Journal of Technologic Dentistry
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• v.27 no.1
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• pp.57-63
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• 2005

Experimental Ti-13%Zr and Ti-13%Zr-5%Cu alloys were made in an argon-arc melting furnace. The grade 2 CP Ti was used to control. To investigate the surface reaction layers produced by the reaction with mold materials and the influence of the reaction layers on the hardness of castings, A phosphate bonded $SiO_2$ base investment was used as mold material, and microstructure observation and hardness test were performed. The surface reaction layers of Ti-13%Zr and Ti-13%Zr-5%Cu alloys were thinner than that of CP Ti had a clearly multiple structure. A difference of the hardness between surface and inner of the Ti-13%Zr and Ti-13%Zr-5%Cu alloys became less than that of CP Ti. From the results, it was found that the Ti-Zr-(Cu) based alloys were possible to cast with $SiO_2$ base investment without the great changes of mechanical properties of the castings.

• Transactions on Electrical and Electronic Materials
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• v.9 no.5
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• pp.202-205
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• 2008

We have studied the liquid crystal (LC) orientation behavior on the organic hybrid overcoat layer with ion beam irradiation. Excellent LC alignments of the nematic liquid crystal (NLC) on the ion beam irradiated organic hybrid overcoat layers were observed in various intensities above 600 eV. Pretilt angles of the NLC on the organic hybrid overcoat layers for all ion beam energy intensities were observed from 0.2 to 0.5 degrees. Also, we used the atomic force microscopy (AFM) images for measuring the roughness of the organic hybrid overcoat layers with ion beam irradiation before and after. The surface of organic hybrid overcoat layers was leveled off by the ion beam irradiation. Finally, a good LC alignment thermal stability on the organic hybrid overcoat layer with ion beam irradiation can be achieved.

• Journal of Welding and Joining
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• v.20 no.6
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• pp.59-59
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• 2002

Sn-Ag-Cu solder is known as most competitive in many kinds of Pb-free solders. In this study, effects of solderability with plated layers such as Cu, Cu/Sn, Cu/Ni and Cu/Ni/Au were investigated. Sn-3.5Ag-0.7Cu solder balls were reflowed in commercial reflow machine (peak temp. : 250℃ and conveyer speed : 0.6m/min). In wetting test, immersion speed was 5mm/sec., immersion time 5sec., immersion depth 4mm and temperature of solder bath was 250℃. Wettability of Sn-3.5Ag-0.7Cu on Cu, Cu/Sn (5㎛), Cu/Ni (5㎛), and Cu/Ni/Au (5㎛/500Å) layers was investigated. Cu/Ni/Au layer had the best wettability as zero cross time and equilibrium force, and the measured values were 0.93 sec and 7mN, respectively. Surface tension of Sn-3.5Ag-0.7Cu solder turmed out to be 0.52N/m. The thickness of IMC is reduced in the order of Cu, Cu/Sn, Cu/Mi and Cu/Ni/Au coated layer. Shear strength of Cu/Ni, Cu/Sn and Cu was around 560gf but Cu/Ni/Au was 370gf.

• Journal of Welding and Joining
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• v.20 no.6
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• pp.783-788
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• 2002

Sn-Ag-Cu solder is known as most competitive in many kinds of Pb-free solders. In this study, effects of solderability with plated layers such as Cu, Cu/Sn, Cu/Ni and Cu/Ni/Au were investigated. Sn-3.5Ag-0.7Cu solder balls were reflowed in commercial reflow machine (peak temp.:$250^{\circ}C$and conveyer speed:0.6m/min). In wetting test, immersion speed was 5mm/sec., immersion time 5sec., immersion depth 4mm and temperature of solder bath was $250^{\circ}C$. Wettability of Sn-3.5Ag-0.7Cu on Cu, Cu/Sn ($5\mu\textrm{m}$), Cu/Ni ($5\mu\textrm{m}$), and Cu/Ni/Au ($5\mu\textrm{m}/500{\AA}$) layers was investigated. Cu/Ni/Au layer had the best wettability as zero cross time and equilibrium force, and the measured values were 0.93 sec and 7mN, respectively. Surface tension of Sn-3.5Ag-0.7Cu solder turmed out to be 0.52N/m. The thickness of IMC is reduced in the order of Cu, Cu/Sn, Cu/Mi and Cu/Ni/Au coated layer. Shear strength of Cu/Ni, Cu/Sn and Cu was around 560gf but Cu/Ni/Au was 370gf.

• Korean Journal of Environmental Biology
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• v.18 no.1
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• pp.69-75
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• 2000

The vegetation structure and soil characteristics in Koelreuteria paniculata communities of Taean-Gun and Anmyondo were studied. The Koelreuteria paniculata community in Anmyondo had two vegetation layers, lower-tree and herb layers, but the Koelreuteria paniculata community in Anmyondo had three vegetation layers, subtree, shrub, and herb layers. Also the Koelreuteria paniculata was only the species of subtree layers in the Koelreuteria paniculata community of Anmyondo, but the subtree layer in the Koelreuteria paniculata community of Taean-Gun consisted of Pinus thunbergii, Cornus walteri, Celtis jessoensis, Celtis sinensis, and Evodia danielii. The soil organic matter, total N, available P, CEC, and exchangeable K, Ca, Mg, and Na concentrations were greater in the two Koelreuteria paniculata community than in the adjacent forest. The range of soil pH in the two Koelreuteria paniculata communities were 6.3-7.0, but those in adjacent forests were 4.7-5.5. [Dierssen scale, Vegetation classification, Forest soil] .