1 |
Lin Kwang-Lung and Liu Yi-Cheng : Manufacturing of Cu/electroless Nickel/Sn-Pb flip chip solder bumps. IEEE, 22-4 (1999) 575-579
|
2 |
A. Zribi, et. al : Solder Metallization Interdiffusion in Microelectronic Interconnects, Components and Packaging Technologies, IEEE, 23-2 (2000) 383-387
|
3 |
Thaddeus B. Massalski : 1986. Binary Alloy Phase Diagram, American Society for Metals, Metals Park, Ohio, 965, 1759
|
4 |
이창배, 정승부, 서창제 : Sn 계 무연솔더에 관한 연구, 한국 마이크로 전자 및 패키징 학회 추계 기술 심포지움 (2001) 75-88 (in Korean)
|
5 |
월간반도체 : CSP의 기초와 실장기술 (1), 전자자료사, 3월호. (1999) 118-119 (in Korean)
|
6 |
Hyun Joo Han : A Study on the soldering Characteristics with Reflow Variables in BGA, MS thesis. University of Seoul. (2000), 1-27 (in Korean)
|
7 |
エレクトロニクス寅袈における環境問題シンポシウム(2000) 77-86 (in Japanese)
|
8 |
Jae Yong Park : Study on the Analysis of Wetting Forces on the Wetting Balance Curve and Application to the Prediction of Solder Joint Geometry, PhD thesis, Seoul National University, (2000) (in Korean)
|
9 |
Y.Wu, J.A.Sees, C.Pouraghabagher : the dependence of the activation energies of intermetallic formation on the composition of composite Sn/Pb solders. JEM, Vol. 22, (1993) 769
|
10 |
Ka Yau LEE. Ming Li, Dennis R. OLSEN and William T. CHEN: Microstructure, Joint Strength and Failure Mechanism of Sn-Ag, Sn-Ag-Cu versus Sn-Pb-Ag Solders in BGA Package, IEEE Electronic Components and Technology Conference (2001) , 478-485
|
11 |
K. Zeng, et. al : Interfacial Reactions between Lead-Free SnAgCu Solder and N (P)!Au Surface Finish on PWBs, Electronic Components and Technology Conference (2001) , 693-698
|
12 |
월간반도체 : -BGA, 전자자료사, 1월호, (1999) 34-35(in Korean)
|